Void-free pull wafer adhesive bonding

Multilingual Wikipedia

In June 2020 the work Void-free pull wafer adhesive bonding was on the 687,045th place in the ranking of the most reliable and popular publications with DOI number in multilingual Wikipedia from readers' point of view (PR-score). If we consider only frequency of appearance of this source in references of Wikipedia articles (F-score), this work was on the 499,161st place in June 2020. From Wikipedians' point of view, "Void-free pull wafer adhesive bonding" is the 890,695th most reliable publication with DOI number in different language versions of Wikipedia (AR-score).

PR-score:
687,045th place
1,572
-317
AR-score:
890,695th place
124
0
F-score:
499,161st place
2
0

English Wikipedia (en)

PR-score:
581,237th place
1,572
-317
AR-score:
746,050th place
124
0
F-score:
300,352nd place
2
0

BestRef shows popularity and reliability scores for sources in references of Wikipedia articles in different languages. Data extraction based on complex method using Wikimedia dumps. To find the most popular and reliable sources we used information about over 200 million references of Wikipedia articles. More details...