5 nm process (English Wikipedia)

Analysis of information sources in references of the Wikipedia article "5 nm process" in English language version.

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  • Doris, Bruce B.; Dokumaci, Omer H.; Ieong, Meikei K.; Mocuta, Anda; Zhang, Ying; Kanarsky, Thomas S.; Roy, R. A. (December 2002). Extreme scaling with ultra-thin Si channel MOSFETs. Digest. International Electron Devices Meeting. pp. 267–270. doi:10.1109/IEDM.2002.1175829. ISBN 0-7803-7462-2. S2CID 10151651.
  • Wakabayashi, Hitoshi; Yamagami, Shigeharu; Ikezawa, Nobuyuki; Ogura, Atsushi; Narihiro, Mitsuru; Arai, K.; Ochiai, Y.; Takeuchi, K.; Yamamoto, T.; Mogami, T. (December 2003). Sub-10-nm planar-bulk-CMOS devices using lateral junction control. IEEE International Electron Devices Meeting 2003. pp. 20.7.1–20.7.3. doi:10.1109/IEDM.2003.1269446. ISBN 0-7803-7872-5. S2CID 2100267.
  • Jaehwan Kim; Jin Kim; Byungchul Shin; Sangah Lee; Jae-Hyun Kang; Joong-Won Jeon; Piyush Pathak; Jac Condella; Frank E. Gennari; Philippe Hurat; Ya-Chieh Lai (23 March 2020). Process related yield risk mitigation with in-design pattern replacement for system ICs manufactured at advanced technology nodes. Proc. SPIE 11328, Design-Process-Technology Co-optimization for Manufacturability XIV, 113280I. San Jose, California, United States. doi:10.1117/12.2551970.
  • G. Yeap; et al. 5nm CMOS Production Technology Platform featuring full-fledged EUV, and High Mobility Channel FinFETs with densest 0.021µm2 SRAM cells for Mobile SoC and High Performance Computing Applications. 2019 IEEE International Electron Devices Meeting (IEDM). doi:10.1109/IEDM19573.2019.8993577.
  • J.C. Liu; et al. A Reliability Enhanced 5nm CMOS Technology Featuring 5th Generation FinFET with Fully-Developed EUV and High Mobility Channel for Mobile SoC and High Performance Computing Application. 2020 IEEE International Electron Devices Meeting (IEDM). doi:10.1109/IEDM13553.2020.9372009.

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  • Doris, Bruce B.; Dokumaci, Omer H.; Ieong, Meikei K.; Mocuta, Anda; Zhang, Ying; Kanarsky, Thomas S.; Roy, R. A. (December 2002). Extreme scaling with ultra-thin Si channel MOSFETs. Digest. International Electron Devices Meeting. pp. 267–270. doi:10.1109/IEDM.2002.1175829. ISBN 0-7803-7462-2. S2CID 10151651.
  • Wakabayashi, Hitoshi; Yamagami, Shigeharu; Ikezawa, Nobuyuki; Ogura, Atsushi; Narihiro, Mitsuru; Arai, K.; Ochiai, Y.; Takeuchi, K.; Yamamoto, T.; Mogami, T. (December 2003). Sub-10-nm planar-bulk-CMOS devices using lateral junction control. IEEE International Electron Devices Meeting 2003. pp. 20.7.1–20.7.3. doi:10.1109/IEDM.2003.1269446. ISBN 0-7803-7872-5. S2CID 2100267.

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  • "Quantum Effects At 7/5nm And Beyond". Semiconductor Engineering. Archived from the original on 15 July 2018. Retrieved 15 July 2018.
  • Mark LaPedus (20 January 2016). "5nm Fab Challenges". Archived from the original on 27 January 2016. Retrieved 22 January 2016. Intel presented a paper that generated sparks and fueled speculation regarding the future direction of the leading-edge IC industry. The company described a next-generation transistor called the nanowire FET, which is a finFET turned on its side with a gate wrapped around it. Intel's nanowire FET, sometimes called a gate-all-around FET, is said to meet the device requirements for 5nm, as defined by the International Technology Roadmap for Semiconductors (ITRS).

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