A. Skorek: "A Parallel Approach for Electrothermal Analysis of Power Electronics Devices", INTERPACK'97, The Pacific RIM/ASME International, Intersociety Electronic & Photonic Packaging Conference and Exhibition, Mauna Lani, Kohala Coast, Hawaii, USA, June 15–19, 1997, Epp-Vol.19-2, Suhir, Ephraim (1997). Advances in Electronic Packaging. Vol. 2. pp. 2019–2022. ISBN978-0-7918-1559-5. Archived from the original on 2007-05-02.
Ortiz, C.; Skorek, A.; Lavoie, M.; Bénard, P. (2009). "Parallel CFD Analysis of Conjugate Heat Transfer in a Dry Type Transformer". IEEE Transactions on Industry Applications. 45 (4): 1530–1534. doi:10.1109/TIA.2009.2023561. S2CID264196806.
A. Skorek, S.V.Blé, A.Gryko-Nikitin, J.Nazarko: "Nanothermal Management in Nanoelectronics Systems" Proceedings of the 2006 Canadian Conference on Electrical and Computer Engineering, Vancouver, British Columbia, Canada, April 22–26, Page(s):1298 - 1301 2007, ISBN1-4244-1021-5, doi:10.1109/CCECE.2007.330.
Lakhsasi, A.; Skorek, A. (2002). "Dynamic finite element approach for analyzing stress and distortion in multilevel devices". Journal of Solid-State Electronics. 46 (6): 925–932. Bibcode:2002SSEle..46..925L. doi:10.1016/s0038-1101(02)00008-4.
Aniserowicz, A.Skorek; Cossette, M.Zaremba (1997). "A New Algorithm for Numerical Simulation of Induction Heating of Steel Cylinders". IEEE Transactions on Industry Applications. 33 (4): 893–897. doi:10.1109/28.605729.
A.Napieralski, A.Skorek, J.-M.Dorkel "A Comparative Study of Two Simulation Methods for Thermal Analysis of Power Electronic Devices", Proceedings of IEEE PELS Third Workshop on Computers in Power Electronics, University of California, Berkeley, USA, 9–11 August 1992, pp. 129- 142. doi:10.1109/CIPE.1992.247285
Urbanek, A.Skorek (1994). "Magnetic flux and temperature analysis in induction heated steel cylinder". IEEE Transactions on Magnetics. 30 (5): 3328–3330. Bibcode:1994ITM....30.3328U. doi:10.1109/20.312650.
Lakhsasi, A.; Skorek, A. (2002). "Dynamic finite element approach for analyzing stress and distortion in multilevel devices". Journal of Solid-State Electronics. 46 (6): 925–932. Bibcode:2002SSEle..46..925L. doi:10.1016/s0038-1101(02)00008-4.
Urbanek, A.Skorek (1994). "Magnetic flux and temperature analysis in induction heated steel cylinder". IEEE Transactions on Magnetics. 30 (5): 3328–3330. Bibcode:1994ITM....30.3328U. doi:10.1109/20.312650.
Ortiz, C.; Skorek, A.; Lavoie, M.; Bénard, P. (2009). "Parallel CFD Analysis of Conjugate Heat Transfer in a Dry Type Transformer". IEEE Transactions on Industry Applications. 45 (4): 1530–1534. doi:10.1109/TIA.2009.2023561. S2CID264196806.
A. Skorek: "A Parallel Approach for Electrothermal Analysis of Power Electronics Devices", INTERPACK'97, The Pacific RIM/ASME International, Intersociety Electronic & Photonic Packaging Conference and Exhibition, Mauna Lani, Kohala Coast, Hawaii, USA, June 15–19, 1997, Epp-Vol.19-2, Suhir, Ephraim (1997). Advances in Electronic Packaging. Vol. 2. pp. 2019–2022. ISBN978-0-7918-1559-5. Archived from the original on 2007-05-02.
