Multi-leaded power package (English Wikipedia)

Analysis of information sources in references of the Wikipedia article "Multi-leaded power package" in English language version.

refsWebsite

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652^nd place

515^th place

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1semanticscholar.org

11^th place

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low place

low place

1web.archive.org

1^st place

1^st place

doi.org

Hopkins, T.; Tiziani, R. (1989), "Transient thermal impedance considerations in power semiconductor applications", Automotive Power Electronics 1989, Dearborn, MI, USA, USA: IEEE, pp. 89–97, doi:10.1109/APE.1989.97162, S2CID 111154062

ieee.org

ieeexplore.ieee.org

Hopkins, T.; Tiziani, R. (1989), "Transient thermal impedance considerations in power semiconductor applications", Automotive Power Electronics 1989, Dearborn, MI, USA, USA: IEEE, pp. 89–97, doi:10.1109/APE.1989.97162, S2CID 111154062

semanticscholar.org

api.semanticscholar.org

Hopkins, T.; Tiziani, R. (1989), "Transient thermal impedance considerations in power semiconductor applications", Automotive Power Electronics 1989, Dearborn, MI, USA, USA: IEEE, pp. 89–97, doi:10.1109/APE.1989.97162, S2CID 111154062

st.com

Hopkins, T.; Cognetti, C.; Tiziani, R. (1988). "AN261 Designing with Thermal Impedance" (PDF). STMicroelectronics. Archived (PDF) from the original on 2017-12-23.

web.archive.org

Hopkins, T.; Cognetti, C.; Tiziani, R. (1988). "AN261 Designing with Thermal Impedance" (PDF). STMicroelectronics. Archived (PDF) from the original on 2017-12-23.