Wafer bonding (English Wikipedia)

Analysis of information sources in references of the Wikipedia article "Wafer bonding" in English language version.

refsWebsite

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9,995^th place

acm.org

S.-H. Choa (2005). "Reliability of MEMS packaging: vacuum maintenance and packaging induced stress". Microsyst. Technol. 11 (11): 1187–1196. doi:10.1007/s00542-005-0603-8.
A. Plössl and G. Kräuter (1999). "Wafer direct bonding: tailoring adhesion between brittle materials". Materials Science and Engineering. 25 (1–2): 1–88. doi:10.1016/S0927-796X(98)00017-5.

T. Gessner and T. Otto and M. Wiemer and J. Frömel (2005). "Wafer bonding in micro mechanics and microelectronics - an overview". The World of Electronic Packaging and System Integration. The World of Electronic Packaging and System Integration. pp. 307–313.