Hybrid Memory Cube (HMC) is a high-performance computer random-access memory (RAM) interface for through-silicon vias (TSV)-based stacked DRAM memory competing with the incompatible rival interface High Bandwidth Memory (HBM). Hybrid Memory Cube was co-developed by Samsung Electronics and Micron Technology in 2011, and announced by Micron in September 2011. It promised a 15 times speed improvement over DDR3. The Hybrid Memory Cube Consortium (HMCC) is backed by several major technology companies including Samsung, Micron Technology, Open-Silicon, ARM, HP (since withdrawn), Microsoft (since withdrawn), Altera (acquired by Intel in late 2015), and Xilinx. Micron, while continuing to support HMCC, is discontinuing the HMC product in 2018 when it failed to achieve market adoption. More information...
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