تبديد طاقة وحدة المعالجة المركزية (Arabic Wikipedia)

Analysis of information sources in references of the Wikipedia article "تبديد طاقة وحدة المعالجة المركزية" in Arabic language version.

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academia.edu

anandtech.com

arstechnica.com

  • Cunningham، Andrew (14 يناير 2013). "The technical details behind Intel's 7 Watt Ivy Bridge CPUs". Ars Technica. مؤرشف من الأصل في 2019-12-30. اطلع عليه بتاريخ 2013-01-14. In Intel's case, a specified chip's TDP has less to do with the amount of power a chip needs to use (or can use) and more to do with the amount of power the computer's fan and heatsink need to be able to dissipate while the chip is under sustained load. Actual power usage can be higher or (much) lower than TDP, but the figure is intended to give guidance to engineers designing cooling solutions for their products.

arxiv.org

doi.org

microsoft.com

  • Zhang، Yifan؛ Liu، Yunxin؛ Zhuang، Li؛ Liu، Xuanzhe؛ Zhao، Feng؛ Li، Qun. Accurate CPU Power Modeling for Multicore Smartphones (Report). Microsoft Research. MSR-TR-2015-9. مؤرشف من الأصل في 2017-10-26.

silentpcreview.com

  • Chin، Mike (15 يونيو 2004). "Athlon 64 for Quiet Power". silentpcreview.com. ص. 3. مؤرشف من الأصل في 2019-09-11. اطلع عليه بتاريخ 2013-12-21. Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the maximum power that the processor can dissipate.

web.archive.org

  • Zhang، Yifan؛ Liu، Yunxin؛ Zhuang، Li؛ Liu، Xuanzhe؛ Zhao، Feng؛ Li، Qun. Accurate CPU Power Modeling for Multicore Smartphones (Report). Microsoft Research. MSR-TR-2015-9. مؤرشف من الأصل في 2017-10-26.
  • Mittal، Sparsh؛ Vetter، Jeffrey S. (2014). "A Survey of Methods for Analyzing and Improving GPU Energy Efficiency". ACM Computing Surveys. ج. 47 ع. 2: 1–23. arXiv:1404.4629. DOI:10.1145/2636342. مؤرشف من الأصل في 2020-06-01.
  • Cutress، Ian (23 أبريل 2012). "Undervolting and Overclocking on Ivy Bridge". anandtech.com. مؤرشف من الأصل في 2020-05-20.
  • Chin، Mike (15 يونيو 2004). "Athlon 64 for Quiet Power". silentpcreview.com. ص. 3. مؤرشف من الأصل في 2019-09-11. اطلع عليه بتاريخ 2013-12-21. Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the maximum power that the processor can dissipate.
  • Cunningham، Andrew (14 يناير 2013). "The technical details behind Intel's 7 Watt Ivy Bridge CPUs". Ars Technica. مؤرشف من الأصل في 2019-12-30. اطلع عليه بتاريخ 2013-01-14. In Intel's case, a specified chip's TDP has less to do with the amount of power a chip needs to use (or can use) and more to do with the amount of power the computer's fan and heatsink need to be able to dissipate while the chip is under sustained load. Actual power usage can be higher or (much) lower than TDP, but the figure is intended to give guidance to engineers designing cooling solutions for their products.