كيمياء الأشرطة اللاصقة الحساسة للضغط (Arabic Wikipedia)

Analysis of information sources in references of the Wikipedia article "كيمياء الأشرطة اللاصقة الحساسة للضغط" in Arabic language version.

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adhesivetoolkit.com

archive.org

doi.org

  • Werner Karmann and Andreas B. Kummer "Tapes, Adhesive" in Ullmann's Encyclopedia of Industrial Chemistry, Wiley-VCH, Weinheim, 2000. دُوِي:10.1002/14356007.a26_085
  • Tse، Mun Fu (1989). "Studies of triblock copolymer-tackifying resin interactions by viscoelasticity and adhesive performance". Journal of Adhesion Science and Technology. ج. 3 ع. 1: 551–570. DOI:10.1163/156856189x00407.

dwfc.org

nasa.gov

trs-new.jpl.nasa.gov

tesa.com

web.archive.org

  • Ozawa، Takehiro؛ Ishiwata, Kano (2001). "Adhesive Properties of Ultraviolet Curable Pressure-Sensitive Adhesive Tape for Semiconductor Processing (I) - Interpretation via Rheological Viewpoint" (PDF). Furukawa Review. ج. 20: 83–88. مؤرشف من الأصل (PDF) في 2018-06-12. اطلع عليه بتاريخ 2015-04-18.
  • "The Effects of Low Temperatures on Pressure-Sensitive Adhesives". www.tesatape.com. Tesa Tape. مؤرشف من الأصل في 2014-07-14. اطلع عليه بتاريخ 2014-06-04.
  • Broughton، W.R.؛ Mera، R.D. "Environmental Degradation of Adhesive Joints Accelerated Testing" (PDF). Centre for Materials Measurement & Technology National Physical Laboratory. مؤرشف من الأصل (PDF) في 2017-08-09. اطلع عليه بتاريخ 2014-06-08.
  • "Jobsite System Failures Involving Pressure Sensitive Adhesive Masking Tape over Gypsum Board Substrates" (PDF). Drywall Finishing Council. مؤرشف من الأصل (PDF) في 2016-03-03.
  • Ojeda، Cassandra E.؛ Oakes، Eric J.؛ Hill، Jennifer R.؛ Aldi، Dominic؛ Forsberg، Gustaf A. "Temperature Effects on Adhesive Bond Strengths and Modulus for Commonly Used Spacecraft Structural Adhesives" (PDF). Jet Propulsion Laboratory, California Institute of Technology. مؤرشف من الأصل (PDF) في 2014-07-14. اطلع عليه بتاريخ 2014-06-08.

xn--7ors6u3mmbh5b.jp

  • Ozawa، Takehiro؛ Ishiwata, Kano (2001). "Adhesive Properties of Ultraviolet Curable Pressure-Sensitive Adhesive Tape for Semiconductor Processing (I) - Interpretation via Rheological Viewpoint" (PDF). Furukawa Review. ج. 20: 83–88. مؤرشف من الأصل (PDF) في 2018-06-12. اطلع عليه بتاريخ 2015-04-18.