FEOL (Catalan Wikipedia)

Analysis of information sources in references of the Wikipedia article "FEOL" in Catalan language version.

Last modified: 21:37:56, 29 August 2025 (UTC)

Ref.Un. Ref.Website

Global rank Catalan rank

11books.google.cat

516^th place

3^rd place

low place

low place

11com,+22-02-2019.+

low place

low place

1,915^th place

4,694^th place

11com,+26-02-2021.+

low place

low place

books.google.cat (Global: 516^th place; Catalan: 3^rd place)

Karen A. Reinhardt and Werner Kern. Handbook of Silicon Wafer Cleaning Technology. 2a edició. William Andrew, 2008, p. 202. ISBN 978-0-8155-1554-8.

com,+22-02-2019.+ (Global: low place; Catalan: low place)

usjpc.com,+22-02-2019.+

«FEOL (Front End of Line: substrate process, the first half of wafer processing) 1. Isolation | USJC：United Semiconductor Japan Co., Ltd.» (en anglès). https://www.usjpc.com,22-02-2019.[Consulta: 1r juliol 2022].

com,+26-02-2021.+ (Global: low place; Catalan: low place)

deepforest.substack.com,+26-02-2021.+

Ramsundar, Bharath. «A Deep Dive into Chip Manufacturing: Front End of Line (FEOL) Basics» (en anglès). https://deepforest.substack.com,26-02-2021.[Consulta: 1r juliol 2022].

substack.com (Global: 1,915^th place; Catalan: 4,694^th place)

deepforest.substack.com

Ramsundar, Bharath. «A Deep Dive into Chip Manufacturing: Front End of Line (FEOL) Basics» (en anglès). https://deepforest.substack.com,26-02-2021.[Consulta: 1r juliol 2022].

usjpc.com (Global: low place; Catalan: low place)

«FEOL (Front End of Line: substrate process, the first half of wafer processing) 1. Isolation | USJC：United Semiconductor Japan Co., Ltd.» (en anglès). https://www.usjpc.com,22-02-2019.[Consulta: 1r juliol 2022].