Lau, John H. «The Most Cost-Effective Integrator (TSV Interposer) for 3D IC Integration System-in-Package (SiP)». A: ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 2011, p. 53–63. DOI10.1115/ipack2011-52189. ISBN 978-0-7918-4461-8.