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Mehrfachstrukturierung (German Wikipedia)

Analysis of information sources in references of the Wikipedia article "Mehrfachstrukturierung" in German language version.

refsWebsite
Global rank German rank
14doi.org
2nd place
3rd place
9web.archive.org
1st place
1st place
4redirecter.toolforge.org
33rd place
2nd place
2eetimes.com
3,722nd place
5,946th place
1espacenet.com
800th place
160th place
1electroiq.com
low place
low place
1archive.md
3,187th place
629th place

archive.md

doi.org

  • Tokuyuki Honda, Yasuhiro Kishikawa, Yuichi Iwasaki, Akinori Ohkubo, Miyoko Kawashima, Minoru Yoshii: Influence of resist blur on ultimate resolution of ArF immersion lithography. In: Journal of Microlithography, Microfabrication, and Microsystems. Band 5, 2006, S. 043004, doi:10.1117/1.2397018.
  • Carlos Fonseca, Mark Somervell, Steven Scheer, Wallace Printz, Kathleen Nafus, Shinichi Hatakeyama, Yuhei Kuwahara, Takafumi Niwa, Sophie Bernard, Roel Gronheid: Advances and challenges in dual-tone development process optimization. SPIE, 2009, S. 72740I, doi:10.1117/12.814289.
  • Xuefeng Hua, S. Engelmann, G. S. Oehrlein, P. Jiang, P. Lazzeri, E. Iacob, M. Anderle: Studies of plasma surface interactions during short time plasma etching of 193 and 248 nm photoresist materials. In: Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. Band 24, 2006, S. 1850–1858, doi:10.1116/1.2217973.
  • Yang-Kyu Choi, Ji Zhu, Jeff Grunes, Jeffrey Bokor, Gabor. A. Somorjai: Fabrication of Sub-10-nm Silicon Nanowire Arrays by Size Reduction Lithography. In: J. Phys. Chem. B. Band 107, Nr. 15, 2003, S. 3340–3343, doi:10.1021/jp0222649.
  • Soyoung Song, Shoichi Yokoyama, Shigeru Takahara, Tsuguo Yamaoka: Novel dual-mode photoresist based on decarboxylation by photogenerated base compound Novel dual-mode photoresist based on decarboxylation by photogenerated base compound. In: Polymers for Advanced Technologies. Band 9, Nr. 6, 1998, S. 326–333, doi:10.1002/(SICI)1099-1581(199806)9:6<326::AID-PAT785>3.0.CO;2-5.
  • Xinyu Gu u. a.: A New Materials-based Pitch Division Technique A New Materials-based Pitch Division Technique. In: Journal of Photopolymer Science and Technology. Band 22, Nr. 6, 2009, S. 773–781, doi:10.2494/photopolymer.22.773.
  • Andrew Carlson, Tsu-Jae King Liu: Negative and iterated spacer lithography processes for low variability and ultra-dense integration. Band 6924. SPIE, 2008, S. 69240B, doi:10.1117/12.772049.
  • B. Degroote u. a.: Spacer defined FinFET: Active area patterning of sub-20 nm fins with high density. In: Microelectronic Engineering. Band 84, Nr. 4, 2007, S. 609–618, doi:10.1016/j.mee.2006.12.003.
  • Yang-Kyu Choi: Sub-lithographic patterning technology for nanowire model catalysts and DNA label-free hybridization detection. Band 5220. SPIE, 2003, S. 10–19, doi:10.1117/12.505409.
  • Beom-Seok Seo u. a.: Double patterning addressing imaging challenges for near- and sub-k. SPIE, 2009, S. 73791N-73791N-10, doi:10.1117/12.824300.
  • C. Auth u. a.: 45nm High-k+ metal gate strain-enhanced transistors. In: Intel Technology Journal. Vol. 12, Nr. 2, 2008, S. 77–86, doi:10.1109/VLSIT.2008.4588589 (download.intel.com (Memento vom 10. Juli 2012 im Internet Archive) [PDF]).
  • Erik Anderson, Weilun Chao: Double exposure makes dense high-resolution diffractive optics. In: SPIE Newsroom. 2007, doi:10.1117/2.1200702.0599.
  • Weilun Chao, Jihoon Kim, Senajith Rekawa, Peter Fischer, Erik Anderson: Hydrogen silsesquioxane double patterning process for 12nm resolution x-ray zone plates. In: Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. Band 27, 2009, S. 2606–2611, doi:10.1116/1.3242694.
  • Weilun Chao, Erik H. Anderson, Peter Fischer, Dong-Hyun Kim: Toward sub-10-nm resolution zone plates using the overlay nanofabrication processes. In: Proc. SPIE. Band 6883, 2008, S. 688309, doi:10.1117/12.768878.

eetimes.com

electroiq.com

  • Katherine Derbyshire: Double development offers simpler double patterning. In: Solid State Technology. Band 51, Nr. 5, 2008, S. 18–20 (HTML).

espacenet.com

worldwide.espacenet.com

  • Patent US6114082: Frequency doubling hybrid photoresist having negative and positive tone components and method of preparing the same. Veröffentlicht am 5. September 2000.‌

redirecter.toolforge.org

  • vgl. Michael Lercel: 2006 Lithography Update. (PDF) In: ITRS Winter Conference 2006. 2006, S. 9, archiviert vom Original (nicht mehr online verfügbar) am 15. Juli 2014; abgerufen am 12. Mai 2013.
  • vgl. M. Maenhoudt, D. Vangoidsenhoven, T. Vandeweyer, R. Gronheid, J. Versluijs, A. Miller: Double Patterning process development at IMEC. (PDF) In: Litho Forum 2008. 2008, S. 4, archiviert vom Original (nicht mehr online verfügbar) am 14. Juli 2014; abgerufen am 12. Mai 2013.
  • vgl. Michael Lercel: 2006 Lithography Update. (PDF) In: ITRS Winter Conference 2006. 2006, S. 8, archiviert vom Original (nicht mehr online verfügbar) am 15. Juli 2014; abgerufen am 12. Mai 2013.
  • D. Vogler: Intel product launch event yields more insight into its manufacturing strategy. In: Solid State Technology (jetzt ElectroIQ). November 2007, archiviert vom Original (nicht mehr online verfügbar) am 30. Juli 2012; abgerufen am 23. November 2011.

web.archive.org

  • vgl. Michael Lercel: 2006 Lithography Update. (PDF) In: ITRS Winter Conference 2006. 2006, S. 9, archiviert vom Original (nicht mehr online verfügbar) am 15. Juli 2014; abgerufen am 12. Mai 2013.
  • S. Kusumoto u. a.: Double Patterning with Resist Freezing Process. In: Workshop on Optical Lithography at 22nm and 16nm. 15. Mai 2008 (Vortragsfolien als PDF (Memento vom 14. Juli 2014 im Internet Archive)).
  • vgl. M. Maenhoudt, D. Vangoidsenhoven, T. Vandeweyer, R. Gronheid, J. Versluijs, A. Miller: Double Patterning process development at IMEC. (PDF) In: Litho Forum 2008. 2008, S. 4, archiviert vom Original (nicht mehr online verfügbar) am 14. Juli 2014; abgerufen am 12. Mai 2013.
  • vgl. Michael Lercel: 2006 Lithography Update. (PDF) In: ITRS Winter Conference 2006. 2006, S. 8, archiviert vom Original (nicht mehr online verfügbar) am 15. Juli 2014; abgerufen am 12. Mai 2013.
  • Double patterning lithography (Memento vom 11. Dezember 2010 im Internet Archive). IMEC, 2007.
  • C. Auth u. a.: 45nm High-k+ metal gate strain-enhanced transistors. In: Intel Technology Journal. Vol. 12, Nr. 2, 2008, S. 77–86, doi:10.1109/VLSIT.2008.4588589 (download.intel.com (Memento vom 10. Juli 2012 im Internet Archive) [PDF]).
  • Intel 45 nm process at IEDM (Memento vom 24. März 2009 im Internet Archive)
  • Yan Borodovsky: ArF lithography extension for critical layer patterning. LithoVision 2010, 21st Feb.,San. Jose, CA/USA (2010). Zitiert nach: Intel Sr. Fellow Recommends Complementary Solutions for ArF Extension (Memento vom 14. Juli 2011 im Internet Archive). Nikon Precision Inc. 2010.
  • Garry Tessler: Enabling MLC Flash SSD In Enterprise Storage. 2010 Flash Memory Summit (Vortrag, Vortragsfolien online (Memento vom 11. Juli 2011 im Internet Archive))