Atomic layer deposition (English Wikipedia)

Analysis of information sources in references of the Wikipedia article "Atomic layer deposition" in English language version.

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  • Cremers, Véronique; Puurunen, Riikka L.; Dendooven, Jolien (4 April 2019). "Conformality in atomic layer deposition: Current status overview of analysis and modelling". Applied Physics Reviews. 6 (2). AIP Publishing (published June 2019). doi:10.1063/1.5060967. eISSN 1931-9401. hdl:1854/LU-8614054.

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  • Cremers, Véronique; Puurunen, Riikka L.; Dendooven, Jolien (4 April 2019). "Conformality in atomic layer deposition: Current status overview of analysis and modelling". Applied Physics Reviews. 6 (2). AIP Publishing (published June 2019). doi:10.1063/1.5060967. eISSN 1931-9401. hdl:1854/LU-8614054.
  • Haynes, William M., ed. (2011). CRC handbook of chemistry and physics : a ready-reference book of chemical and physical data (92nd ed.). Boca Raton, FL.: CRC Press. ISBN 9781439855119. OCLC 730008390.
  • Gordon, Peter G.; Kurek, Agnieszka; Barry, Seán T. (2015). "Trends in Copper Precursor Development for CVD and ALD Applications". ECS Journal of Solid State Science and Technology. 4 (1): N3188–N3197. doi:10.1149/2.0261501jss. ISSN 2162-8769. S2CID 97668427.
  • Knisley, Thomas J.; Ariyasena, Thiloka C.; Sajavaara, Timo; Saly, Mark J.; Winter, Charles H. (25 October 2011). "Low Temperature Growth of High Purity, Low Resistivity Copper Films by Atomic Layer Deposition". Chemistry of Materials. 23 (20): 4417–4419. doi:10.1021/cm202475e. ISSN 0897-4756.
  • Guo, Zheng; Li, Hao; Chen, Qiang; Sang, Lijun; Yang, Lizhen; Liu, Zhongwei; Wang, Xinwei (8 September 2015). "Low-Temperature Atomic Layer Deposition of High Purity, Smooth, Low Resistivity Copper Films by Using Amidinate Precursor and Hydrogen Plasma". Chemistry of Materials. 27 (17): 5988–5996. doi:10.1021/acs.chemmater.5b02137. ISSN 0897-4756.
  • Seghete, D.; Rayner, G.B.; Cavanagh, A.S.; Anderson, V.R.; George, S.M. (12 April 2011). "Molybdenum Atomic Layer Deposition Using MoF 6 and Si 2 H 6 as the Reactants". Chemistry of Materials. 23 (7): 1668–1678. doi:10.1021/cm101673u. ISSN 0897-4756.
  • Kalutarage, Lakmal C.; Martin, Philip D.; Heeg, Mary Jane; Winter, Charles H. (28 August 2013). "Volatile and Thermally Stable Mid to Late Transition Metal Complexes Containing α-Imino Alkoxide Ligands, a New Strongly Reducing Coreagent, and Thermal Atomic Layer Deposition of Ni, Co, Fe, and Cr Metal Films". Journal of the American Chemical Society. 135 (34): 12588–12591. doi:10.1021/ja407014w. ISSN 0002-7863. PMID 23947400.
  • Klesko, Joseph P.; Thrush, Christopher M.; Winter, Charles H. (28 July 2015). "Thermal Atomic Layer Deposition of Titanium Films Using Titanium Tetrachloride and 2-Methyl-1,4-bis(trimethylsilyl)-2,5-cyclohexadiene or 1,4-Bis(trimethylsilyl)-1,4-dihydropyrazine". Chemistry of Materials. 27 (14): 4918–4921. doi:10.1021/acs.chemmater.5b01707. ISSN 0897-4756.
  • Stevens, Eric C.; Mousa, Moataz Bellah M.; Parsons, Gregory N. (November 2018). "Thermal atomic layer deposition of Sn metal using SnCl 4 and a vapor phase silyl dihydropyrazine reducing agent". Journal of Vacuum Science & Technology A. 36 (6): 06A106. Bibcode:2018JVSTA..36fA106S. doi:10.1116/1.5055212. ISSN 0734-2101. S2CID 104844454.
  • Blakeney, Kyle J.; Winter, Charles H. (27 March 2018). "Atomic Layer Deposition of Aluminum Metal Films Using a Thermally Stable Aluminum Hydride Reducing Agent". Chemistry of Materials. 30 (6): 1844–1848. doi:10.1021/acs.chemmater.8b00445. ISSN 0897-4756.
  • van Delft, J A; Garcia-Alonso, D; Kessels, W M M (11 July 2012). "Atomic layer deposition for photovoltaics: applications and prospects for solar cell manufacturing". Semiconductor Science and Technology. 27 (7): 074002. Bibcode:2012SeScT..27g4002V. doi:10.1088/0268-1242/27/7/074002. ISSN 0268-1242. S2CID 55670928.
  • Seo, Seongrok; Jeong, Seonghwa; Park, Hyoungmin; Shin, Hyunjung; Park, Nam-Gyu (2019). "Atomic layer deposition for efficient and stable perovskite solar cells". Chemical Communications. 55 (17): 2403–2416. doi:10.1039/C8CC09578G. ISSN 1359-7345. PMID 30719523. S2CID 73448015.
  • Lei Wenwen; Li Xingcun; Chen Qiang; Wang Zhengduo (February 2012). "Plasma-Assisted ALD of an Al2O3 Permeation Barrier Layer on Plastic". Plasma Science and Technology. 14 (2): 129. Bibcode:2012PlST...14..129L. doi:10.1088/1009-0630/14/2/09. ISSN 1009-0630. S2CID 250740101.
  • Park, Sang-Hee Ko; Oh, Jiyoung; Hwang, Chi-Sun; Yang, Yong Suk; Lee, Jeong-Ik; Chu, Hye Yong (January 2004). "Ultra thin film encapsulation of OLED on plastic substrate". Journal of Information Display. 5 (3): 30–34. doi:10.1080/15980316.2004.9651953. ISSN 1598-0316. S2CID 135967211.
  • Park, Sang-Hee Ko; Oh, Jiyoung; Hwang, Chi-Sun; Lee, Jeong-Ik; Yang, Yong Suk; Chu, Hye Yong; Kang, Kwang-Yong (14 October 2005). "Ultra Thin Film Encapsulation of OLED on Plastic Substrate". ETRI Journal. 27 (5): 545–550. doi:10.4218/etrij.05.0905.0006. ISSN 1225-6463. S2CID 58156645.

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