Ball grid array (English Wikipedia)

Analysis of information sources in references of the Wikipedia article "Ball grid array" in English language version.

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7web.archive.org

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1slideshare.net

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1cascade-eng.com

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1electronicsandyou.com

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1seekdatasheet.com

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archive.today

Solid State Technology: BGA underfills - Increasing board-level solder joint reliability, 12/01/2001

bit-tech.net

Ryan J. Leng. "The Secrets of PC Memory: Part 2". 2007.

cascade-eng.com

"Dye and Pry of BGA Solder Joints" (PDF). cascade-eng.com. 2013-11-22. Archived from the original (PDF) on 2011-10-16. Retrieved 2014-03-22.

economist.com

"More than just digital quilting: The "maker" movement could change how science is taught and boost innovation. It may even herald a new industrial revolution". The Economist. Dec 3, 2011.

electronicsandyou.com

Das, Santosh (2019-08-22). "BGA Soldering & Repairing / How to Solder Ball Grid Array". Electronics and You. Retrieved 2021-09-07.

indium.com

"Soldering 101 - A Basic Overview". Archived from the original on 2012-03-03. Retrieved 2010-12-29.

jedec.org

Design Requirements - Fine Pitch Ball Grid Array Package (FBGA) DR-4.27D, jedec.org, MAR 2017

jgarantmc.com

"CT Services - Overview." Jesse Garant & Associates. August 17, 2010. "Industrial Computed Tomography Scanning Services – JG&A". Archived from the original on 2010-09-23. Retrieved 2010-11-24.

nasa.gov

teerm.nasa.gov

"TEERM - TEERM Active Project - NASA-DOD Lead-Free Electronics (Project 2)". Teerm.nasa.gov. Archived from the original on 2014-10-08. Retrieved 2014-03-21.

seekdatasheet.com

pdf.seekdatasheet.com

Intel. "Mobile Intel Celeron Processor (0.13 μ) in Micro-FCBGA and Micro-FCPGA Packages". Datasheet Archived 2014-03-18 at the Wayback Machine. 2002.

slideshare.net

Alpha (2010-03-15) [September 2009]. "Reducing Head in Pillow Defects - Head in pillow defects: causes and potential solutions". 3. Archived from the original on 2013-12-03. Retrieved 2018-06-18.

sparkfun.com

Sparkfun tutorials: Reflow skillet, July 2006

web.archive.org

"Soldering 101 - A Basic Overview". Archived from the original on 2012-03-03. Retrieved 2010-12-29.
Alpha (2010-03-15) [September 2009]. "Reducing Head in Pillow Defects - Head in pillow defects: causes and potential solutions". 3. Archived from the original on 2013-12-03. Retrieved 2018-06-18.
"TEERM - TEERM Active Project - NASA-DOD Lead-Free Electronics (Project 2)". Teerm.nasa.gov. Archived from the original on 2014-10-08. Retrieved 2014-03-21.
"CT Services - Overview." Jesse Garant & Associates. August 17, 2010. "Industrial Computed Tomography Scanning Services – JG&A". Archived from the original on 2010-09-23. Retrieved 2010-11-24.
"Dye and Pry of BGA Solder Joints" (PDF). cascade-eng.com. 2013-11-22. Archived from the original (PDF) on 2011-10-16. Retrieved 2014-03-22.
Intel. "Mobile Intel Celeron Processor (0.13 μ) in Micro-FCBGA and Micro-FCPGA Packages". Datasheet Archived 2014-03-18 at the Wayback Machine. 2002.
"FCBGA-479 (Micro-FCBGA)". Archived from the original on 2021-02-28. Retrieved 2011-12-20.

x86-guide.com

"FCBGA-479 (Micro-FCBGA)". Archived from the original on 2021-02-28. Retrieved 2011-12-20.