FOUP (English Wikipedia)

Analysis of information sources in references of the Wikipedia article "FOUP" in English language version.

refsWebsite

Global rank English rank

3books.google.com

3^rd place

3^rd place

415^th place

327^th place

102^nd place

76^th place

2^nd place

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18^th place

17^th place

5^th place

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652^nd place

515^th place

books.google.com (Global: 3^rd place; English: 3^rd place)

Yoshio Nishi; Robert Doering (9 July 2007). Handbook of Semiconductor Manufacturing Technology, Second Edition. CRC Press. pp. 33–. ISBN 978-1-4200-1766-3.
Mikhail Baklanov; Paul S. Ho; Ehrenfried Zschech (17 February 2012). Advanced Interconnects for ULSI Technology. John Wiley & Sons. pp. 291–. ISBN 978-1-119-96686-9.
Lars Mönch; John W. Fowler; Scott Mason (12 September 2012). Production Planning and Control for Semiconductor Wafer Fabrication Facilities: Modeling, Analysis, and Systems. Springer Science & Business Media. pp. 144–. ISBN 978-1-4614-4471-8.

doi.org (Global: 2^nd place; English: 2^nd place)

Lin, Tee; Zargar, Omid Ali; Lee, Tzu-Chieh; Sabusap, Dexter Lyndon; Li, Jian-Jie; Hu, Shih-Cheng; Khodadadi, Jay M.; Jamshideasli, Dourna; Leggett, Graham (2021-11-01). "Flow analysis of a front opening unified pod (FOUP) subjected to different fan filter unit (FFU) coverage area in mini-environment". International Journal of Thermofluids. 12 100124. Bibcode:2021IJTf...1200124L. doi:10.1016/j.ijft.2021.100124. ISSN 2666-2027.

handle.net (Global: 102^nd place; English: 76^th place)

hdl.handle.net

Cassett, David Ian (2004). Radio frequency identification (RFID) applications in semiconductor manufacturing (Thesis thesis). Massachusetts Institute of Technology. hdl:1721.1/28503.

harvard.edu (Global: 18^th place; English: 17^th place)

ui.adsabs.harvard.edu

Lin, Tee; Zargar, Omid Ali; Lee, Tzu-Chieh; Sabusap, Dexter Lyndon; Li, Jian-Jie; Hu, Shih-Cheng; Khodadadi, Jay M.; Jamshideasli, Dourna; Leggett, Graham (2021-11-01). "Flow analysis of a front opening unified pod (FOUP) subjected to different fan filter unit (FFU) coverage area in mini-environment". International Journal of Thermofluids. 12 100124. Bibcode:2021IJTf...1200124L. doi:10.1016/j.ijft.2021.100124. ISSN 2666-2027.

ieee.org (Global: 652^nd place; English: 515^th place)

ieeexplore.ieee.org

"450mm FOUP/LPU system in advanced semiconductor manufacturing processes: A study on the minimization of oxygen content inside FOUP when the door is opened". IEEE: 1–4. September 2015.

mit.edu (Global: 415^th place; English: 327^th place)

dspace.mit.edu

Cassett, David Ian (2004). Radio frequency identification (RFID) applications in semiconductor manufacturing (Thesis thesis). Massachusetts Institute of Technology. hdl:1721.1/28503.

worldcat.org (Global: 5^th place; English: 5^th place)

search.worldcat.org

Lin, Tee; Zargar, Omid Ali; Lee, Tzu-Chieh; Sabusap, Dexter Lyndon; Li, Jian-Jie; Hu, Shih-Cheng; Khodadadi, Jay M.; Jamshideasli, Dourna; Leggett, Graham (2021-11-01). "Flow analysis of a front opening unified pod (FOUP) subjected to different fan filter unit (FFU) coverage area in mini-environment". International Journal of Thermofluids. 12 100124. Bibcode:2021IJTf...1200124L. doi:10.1016/j.ijft.2021.100124. ISSN 2666-2027.