Failure of electronic components (English Wikipedia)

Analysis of information sources in references of the Wikipedia article "Failure of electronic components" in English language version.

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17books.google.com

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2web.archive.org

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1arcsuppressiontechnologies.com

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1learningaboutelectronics.com

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arcsuppressiontechnologies.com

"Lab Note #105 Contact Life – Unsuppressed vs. Suppressed Arcing". Arc Suppression Technologies. August 2011. Retrieved 10 March 2012.

books.google.com

STFA 2001: proceedings of the 27th International Symposium for Testing and Failure Analysis: 11–15 November 2001, Santa Clara Convention Center, Santa Clara, California, p. 267 ISBN 0-87170-746-2
Merrill L. Minges (1989). Electronic Materials Handbook: Packaging. ASM International. p. 970. ISBN 978-0-87170-285-2.
ASM International (2008). Thirty-fourth International Symposium for Testing and Failure Analysis. ASM International. p. 61. ISBN 978-1-61503-091-0.
Shangguan, Dongkai (5 December 2005). Lead-free solder interconnect reliability. ASM International. ISBN 978-0-87170-816-8.
Thomas W. Lee (2002). Microelectronic Failure Analysis: Desk Reference : 2002 Supplement. ASM International. p. 161. ISBN 978-0-87170-769-7.
Microelectronics failure analysis: desk reference By Electronic Device Failure Analysis Society. Desk Reference Committee, ASM International, 2004 ISBN 0-87170-804-3 p. 79
Corrosion and reliability of electronic materials and devices: proceedings of the Fourth International Symposium. The Electrochemical Society. 1999. p. 251. ISBN 1-56677-252-4.
A. Christou; B. A. Unger (1990). Semiconductor device reliability. Springer. p. 221. ISBN 0-7923-0536-1.
黑斯廷斯 (2004). The art of analog layout. 清华大学出版社. p. 120. ISBN 7-302-08226-X.
Oleg Semenov; Hossein Sarbishaei; Manoj Sachdev (2008). ESD Protection Device and Circuit Design for Advanced CMOS Technologies. Springer Science & Business Media. p. 4. ISBN 978-1-4020-8301-3.
R. W. Welker; Ramamurthy Nagarajan; Carl E. Newberg (2006). Contamination and ESD control in high-technology manufacturing. John Wiley and Sons. p. 68. ISBN 0-471-41452-2.
John M. Kolyer; Donald E. Watson (1996). ESD from A to Z: electrostatic discharge control for electronics. Springer. p. 32. ISBN 0-412-08381-7.
G. Theodore (1990). Esd Program Management: A Realistic Approach to Continuous Measurable Improvement in Static Control. Springer. p. 67. ISBN 0-412-09781-8.
Carlos H. Diaz; Sung-Mo (Steve) Kang; Charvaka Duvvury (1994). Modeling of Electrical Overstress in Integrated Circuits. Springer Science & Business Media. p. 3. ISBN 978-0-7923-9505-8.
Milton Ohring (1998). Reliability and failure of electronic materials and devices. Academic Press. p. 349. ISBN 0-12-524985-3.
Khlefa Alarbe Esaklul (1992). Handbook of Case Histories in Failure Analysis, Volume 2. ASM International. ISBN 978-0-87170-495-5.
James J. Licari; Leonard R. Enlow (2008). Hybrid Microcircuit Technology Handbook, 2nd Edition: Materials, Processes, Design, Testing and Production. Elsevier Science. p. 506. ISBN 978-0-08-094659-7.

doi.org

Zhai, C.; et al. (2015). "Stress-Dependent Electrical Contact Resistance at Fractal Rough Surfaces". Journal of Engineering Mechanics. 143 (3): B4015001. doi:10.1061/(ASCE)EM.1943-7889.0000967.

iaei.org

Brown, Kenneth (March 2004). "Metal Oxide Varistor Degradation". IAEI Magazine. Archived from the original on 19 July 2011. Retrieved 30 March 2011.

learningaboutelectronics.com

What is IDSS of a FET Transistor?

nasa.gov

parts.jpl.nasa.gov

Chapter 4. Basic Failure Modes and Mechanisms, S. Kayali

web.archive.org

Brown, Kenneth (March 2004). "Metal Oxide Varistor Degradation". IAEI Magazine. Archived from the original on 19 July 2011. Retrieved 30 March 2011.
Sykes, Bob (June 2010). "Why test bonds?". Global SMT & Packaging magazine. Archived from the original on 3 July 2018. Retrieved 20 June 2014.

xyztec.com

Sykes, Bob (June 2010). "Why test bonds?". Global SMT & Packaging magazine. Archived from the original on 3 July 2018. Retrieved 20 June 2014.