Flip chip (English Wikipedia)

Analysis of information sources in references of the Wikipedia article "Flip chip" in English language version.

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4books.google.com

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2web.archive.org

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1processsolutionsconsulting.com

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1designworldonline.com

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1semiconductor-digest.com

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1nowpublishers.com

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analog.com

https://www.analog.com/media/en/technical-documentation/application-notes/AN-617.pdf ^{[bare URL PDF]}

archive.org

Filter Center, Aviation Week & Space Technology, September 23, 1963, v. 79, no. 13, p. 96.

books.google.com

Materials for Advanced Packaging. Springer. 18 November 2016. ISBN 978-3-319-45098-8.
Materials for Advanced Packaging. Springer. 17 December 2008. ISBN 978-0-387-78219-5.
Materials for Advanced Packaging. Springer. 17 December 2008. ISBN 978-0-387-78219-5.
Materials for Advanced Packaging. Springer. 18 November 2016. ISBN 978-3-319-45098-8.

designworldonline.com

Venkat Nandivada. "Enhance Electronic Performance with Epoxy Compounds". Design World. 2013.

diamond.jp

"Ajinomoto's 'secret ingredient' is now vital to chipmaking giants". 9 November 2022.

digitimes.com

"ABF substrate shortages may dent 2021 shipments of new CPU, GPU chips". 14 December 2020.

doi.org

"Flip Chip—The Bumping Processes". Integrated Circuit Packaging, Assembly and Interconnections. Springer. 2007. pp. 143–167. doi:10.1007/0-387-33913-2_10. ISBN 978-0-387-28153-7.
He, Lei (2010). "System-in-Package: Electrical and Layout Perspectives". Foundations and Trends in Electronic Design Automation. 4 (4): 223–306. doi:10.1561/1000000014.
Li, Tengyu; Li, Peng; Sun, Rong; Yu, Shuhui (2023). "Polymer-based nanocomposites in semiconductor packaging". IET Nanodielectrics. 6 (3): 147–158. doi:10.1049/nde2.12050.

embedded.com

"Underfill revisited: How a decades-old technique enables smaller, more durable PCBs". 2011.

flipchips.com

George Riley, Flipchips.com. “Solder Bump Flip Chip.” November 2000. Retrieved July 30, 2015.

nasa.gov

nepp.nasa.gov

"BGA Underfill for COTS Ruggedization". NASA. 2019.

nowpublishers.com

He, Lei (2010). "System-in-Package: Electrical and Layout Perspectives". Foundations and Trends in Electronic Design Automation. 4 (4): 223–306. doi:10.1561/1000000014.

processsolutionsconsulting.com

Peter Elenius and Lee Levine, Chip Scale Review. "Comparing Flip-Chip and Wire-Bond Interconnection Technologies". July/August 2000. Retrieved July 30, 2015.

semiconductor-digest.com

sst.semiconductor-digest.com

"The back-end process: Step 7 – Solder bumping step by step | Semiconductor Digest".

springer.com

link.springer.com

"Flip Chip—The Bumping Processes". Integrated Circuit Packaging, Assembly and Interconnections. Springer. 2007. pp. 143–167. doi:10.1007/0-387-33913-2_10. ISBN 978-0-387-28153-7.

web.archive.org

Demerjian, Charlie (2008-12-17), Nvidia chips show underfill problems, The Inquirer, archived from the original on July 21, 2009, retrieved 2009-01-30{{citation}}: CS1 maint: unfit URL (link)
George Riley, Introduction to Flip Chip: What, Why, How, Flipchips.com October 2000.