Fusible alloy (English Wikipedia)
Analysis of information sources in references of the Wikipedia article "Fusible alloy" in English language version.
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books.google.com
- François Cardarelli (2008-03-19). Materials Handbook: A Concise Desktop Reference. Springer Science & Business Media. pp. 210–. ISBN 978-1-84628-669-8.
- John H. Lau (1991). Solder joint reliability: theory and applications. Springer. p. 178. ISBN 0-442-00260-2.[permanent dead link]
- Ray P. Prasad (1997). Surface mount technology: principles and practice. Springer. p. 385. ISBN 0-412-12921-3.
- Charles A. Harper (2003). Electronic materials and processes. McGraw-Hill Professional. pp. 5–8. ISBN 0-07-140214-4.
- Karl J. Puttlitz, Kathleen A. Stalter (2004). Handbook of lead-free solder technology for microelectronic assemblies. CRC Press. ISBN 0-8247-4870-0.
- T.Q. Collier (May–Jun 2008). "Choosing the best bumb for the buck". Advanced Packaging. 17 (4): 24. ISSN 1065-0555.
- Madara Ogot, Gul Okudan-Kremer (2004). Engineering design: a practical guide. Trafford Publishing. p. 445. ISBN 1-4120-3850-2.
- Howard H. Manko (8 February 2001). Solders and soldering: materials, design, production, and analysis for reliable bonding. McGraw-Hill Professional. pp. 396–. ISBN 978-0-07-134417-3. Retrieved 17 April 2011.
chipquik.com
- Johnson Manufacturing Co, MSDS for Chip Quik Alloy w/Lead. Retrieved on February 6, 2015.
doi.org
- Jensen, William B. (2010-10-01). "The Origin of the Name "Onion's Fusible Alloy"". Journal of Chemical Education. 87 (10): 1050–1051. Bibcode:2010JChEd..87.1050J. doi:10.1021/ed100764f. ISSN 0021-9584.
farnell.com
- msl747.PDF. (PDF). Retrieved 2010-07-06.
harvard.edu
ui.adsabs.harvard.edu
- Jensen, William B. (2010-10-01). "The Origin of the Name "Onion's Fusible Alloy"". Journal of Chemical Education. 87 (10): 1050–1051. Bibcode:2010JChEd..87.1050J. doi:10.1021/ed100764f. ISSN 0021-9584.
hitechalloys.com
- "F.A.Q." Archived from the original on 2004-08-07.
indium.com
- "A Guide to Low Temperature Solder Alloys | Indium Corporation® | Indium Corporation Blogs | Indium | Solder Alloys". indium.com. Retrieved 2022-10-08.
kappalloy.com
- "Tin-Zinc Solders for Aluminium to Aluminium and Copper". Kapp Alloy & Wire, Inc. Archived from the original on 16 July 2013. Retrieved 23 October 2012.
oregonstate.edu
- "Oregon State University". Oregon State University. Retrieved 2022-04-06.
qualitek.com
- Qualitek. Technical Data Sheet Sn42/Bi58 Solid Wire Rev.A 03/14 (PDF). Retrieved 3 May 2018.
- Qualitek. Technical Data Sheet Sn42/Bi58 Solid Wire Rev.A 03/14 (PDF). Retrieved 3 May 2018.
web.archive.org
- "F.A.Q." Archived from the original on 2004-08-07.
- "Lens Blocking alloy 136 58oC". Archived from the original on 2016-10-17.
- "Tin-Zinc Solders for Aluminium to Aluminium and Copper". Kapp Alloy & Wire, Inc. Archived from the original on 16 July 2013. Retrieved 23 October 2012.
wikisource.org
en.wikisource.org
- One or more of the preceding sentences incorporates text from a publication now in the public domain: Chisholm, Hugh, ed. (1911). "Fusible Metal". Encyclopædia Britannica. Vol. 11 (11th ed.). Cambridge University Press. p. 369.
worldcat.org
search.worldcat.org
- Jensen, William B. (2010-10-01). "The Origin of the Name "Onion's Fusible Alloy"". Journal of Chemical Education. 87 (10): 1050–1051. Bibcode:2010JChEd..87.1050J. doi:10.1021/ed100764f. ISSN 0021-9584.
- T.Q. Collier (May–Jun 2008). "Choosing the best bumb for the buck". Advanced Packaging. 17 (4): 24. ISSN 1065-0555.
zilt.co.uk
- "Lens Blocking alloy 136 58oC". Archived from the original on 2016-10-17.