HiSilicon (English Wikipedia)

"Kirin 620". www.hisilicon.com. Retrieved 10 April 2021.
"Kirin". www.hisilicon.com. Archived from the original on 2 October 2019. Retrieved 21 September 2019.
"Kirin 9000". www.hisilicon.com. Retrieved 16 September 2021.
"Balong". www.hisilicon.com. Archived from the original on 4 May 2019. Retrieved 5 May 2019.
"HiSilicon Releases Leading LTE Multi-mode Chipset | HiSilicon". www.hisilicon.com. Archived from the original on 5 May 2019. Retrieved 5 May 2019.
"Huawei Launches the World's First 8-Antenna 4.5G Modem Chipset". www.hisilicon.com. Archived from the original on 17 May 2019. Retrieved 5 May 2019.
"Balong 5000". www.hisilicon.com. Retrieved 16 September 2021.
"Huawei Launches Industry-Leading 5G Multi-Mode Chipset Balong 5000 to Lead the 5G Era". www.hisilicon.com. Archived from the original on 5 May 2019. Retrieved 5 May 2019.
"Huawei Unveils Industry's Highest-Performance ARM-based CPU Bringing Global Computing Power to Next Level". www.hisilicon.com. Archived from the original on 4 May 2019. Retrieved 4 May 2019.
"Ascend | HiSilicon". www.hisilicon.com. Archived from the original on 4 May 2019. Retrieved 4 May 2019.

hitmobile.pk

"Huawei MediaPad X1". DeviceSpecifications. Archived from the original on 23 July 2014. Retrieved 14 March 2014.
"Huawei MediaPad M1". DeviceSpecifications. Archived from the original on 29 April 2015. Retrieved 14 March 2014.

huawei.com

e.huawei.com

"TaiShan 2280 Balanced Server ─ Huawei Enterprise". Huawei Enterprise. Archived from the original on 5 May 2019. Retrieved 5 May 2019.
"TaiShan 5280 Storage Server". Huawei Enterprise. Archived from the original on 5 May 2019. Retrieved 5 May 2019.
"TaiShan XA320 High-Density Server Node". Huawei Enterprise. Archived from the original on 5 May 2019. Retrieved 5 May 2019.
"TaiShan X6000 ARM High-Density Server". Huawei Enterprise. Archived from the original on 5 May 2019. Retrieved 5 May 2019.
"TaiShan 2280 V2 Balanced Server ─ Huawei Enterprise". Huawei Enterprise. Archived from the original on 5 May 2019. Retrieved 5 May 2019.
"TaiShan 5280 V2 Storage Server ─ Huawei Enterprise". Huawei Enterprise. Archived from the original on 5 May 2019. Retrieved 5 May 2019.
"TaiShan XA320 V2 High-Density Server Node". Huawei Enterprise. Archived from the original on 5 May 2019. Retrieved 5 May 2019.

consumer.huawei.com

"HUAWEI MediaPad M3 8.0". Huawei-Consumer. Huawei. Archived from the original on 20 November 2016. Retrieved 18 January 2017.
"HUAWEI FreeBuds 3, Kirin A1, Intelligent Noise Cancellation | HUAWEI Global". consumer.huawei.com. Archived from the original on 21 September 2019. Retrieved 21 September 2019.

huaweicentral.com

"Huawei Mate 70 Pro+ network speed is 2x faster than Mate 60 Pro". www.huaweicentral.com. 27 November 2024. Retrieved 30 November 2024.
S, Amy (7 September 2019). "Kirin A1: The world's first Bluetooth 5.1 and Bluetooth Low Energy 5.1 Wearable Chip". Huawei Central. Archived from the original on 21 September 2019. Retrieved 21 September 2019.

ifixit.com

"Huawei Mate 20 X 5G Teardown". iFixit. 25 July 2019. Archived from the original on 27 July 2019. Retrieved 27 July 2019.

nanoreview.net

NanoReview.net. "HiSilicon Kirin 9000S".

nikkei.com

cn.nikkei.com

The Nikkei. "美智库：华为7纳米芯片是对华包围网的失败" (in Chinese).

notebookcheck.net

"HiSilicon Kirin 650 SoC – Benchmarks and Specs". www.notebookcheck.net. Archived from the original on 5 February 2017. Retrieved 4 February 2017.
Hinum, Klaus (12 October 2018). "ARM Mali-G76 MP10". Notebookcheck. Archived from the original on 4 December 2018. Retrieved 3 December 2018.{{cite web}}: CS1 maint: numeric names: authors list (link)

reameizu.com

Huawei、秘密裏にKirin 8000を市場に投入

reuters.com

Josh, Horwitz (21 May 2020). "U.S. strikes at a Huawei prize: chip juggernaut HiSilicon". Reuters. Archived from the original on 22 May 2020. Retrieved 22 May 2020.
"Huawei to stop making flagship chipsets as U.S. pressure bites, Chinese media say". Reuters. 8 August 2020. Retrieved 8 August 2020.

sagepub.com

journals.sagepub.com

Qing, Lingli; Chun, Dongphil; Xiong, Peng (1 December 2022). "What Cultivates a Path of Disruptive Innovation within Semiconductor Latecomers? An Exploratory Case Study of HiSilicon". Science, Technology and Society. 27 (4): 502–523. doi:10.1177/09717218221124884. ISSN 0971-7218.

techcentral.co.za

"Huawei Pura 70 series of smartphones launched - TechCentral". 18 April 2024. Retrieved 18 April 2024.

techpowerup.com

AleksandarK (7 December 2021). "Huawei Prepares Laptop Powered by Custom Kirin 5 nm SoC and DDR5 Memory". TechPowerUp. Retrieved 6 February 2024.

tomshardware.com

Shilov, Anton (5 January 2024). "Huawei's 5nm Kirin 9006C laptop chip was reportedly produced by TSMC in 2020, dispelling production rumors at Chinese fab SMIC". tom's HARDWARE. Retrieved 6 February 2024.
Matthew Connatser (25 February 2024). "Huawei's new CPU matches Zen 3 in single-core performance - HiSilicon Taishan V120 server CPU benchmark". Tom's Hardware. Retrieved 3 April 2024.
Anton Shilov (3 September 2023). "Huawei's New Mystery 7nm Chip from Chinese Fab Defies US Sanctions". Tom's Hardware. Retrieved 3 April 2024.

vmall.com

"Huawei P6 S". Huawei. Archived from the original on 22 June 2014. Retrieved 12 June 2014.

wccftech.com

Sohail, Omar (18 April 2024). "Kirin 9010 Is Huawei's Latest Smartphone SoC With A 12-core CPU Cluster, Is Regarded As A Faster Variant To The Kirin 9000S, Lithography Unknown". Wccftech. Retrieved 21 April 2024.

web.archive.org

"HiSilicon Technologies Co., Ltd.: Private Company Information". Bloomberg. Archived from the original on 19 January 2019. Retrieved 18 January 2019.
HiSilicon Licenses ARM Technology for use in Innovative 3G/4G Base Station, Networking Infrastructure and Mobile Computing Applications Archived 27 January 2013 at the Wayback Machine, 2 August 2011 on ARM.com
"HiSilicon Technologies Co., Ltd. 海思半导体有限公司". ARM Holdings. Archived from the original on 15 January 2013. Retrieved 26 April 2013.
ARM Launches Cortex-A50 Series, the World’s Most Energy-Efficient 64-bit Processors Archived 5 January 2013 at the Wayback Machine on ARM.com
Lai, Richard (9 January 2013). "Huawei's HiSilicon K3V3 chipset due 2H 2013, to be based on Cortex-A15". Engadget. Archived from the original on 15 May 2013. Retrieved 26 April 2013.
"Hisilicon grown into the largest local IC design companies". Windosi. September 2012. Archived from the original on 21 August 2014. Retrieved 26 April 2013.
Josh, Horwitz (21 May 2020). "U.S. strikes at a Huawei prize: chip juggernaut HiSilicon". Reuters. Archived from the original on 22 May 2020. Retrieved 22 May 2020.
brightsideofnews.com: Huawei U9510 Ascend D Quad XL Benchmarked Archived 8 May 2013 at the Wayback Machine on ARMdevices.net
Hands On with the Huawei Ascend W1, Ascend D2, and Ascend Mate Archived 29 June 2019 at the Wayback Machine on Anandtech
"HiSilicon Kirin 650 SoC – Benchmarks and Specs". www.notebookcheck.net. Archived from the original on 5 February 2017. Retrieved 4 February 2017.
"Huawei MediaPad X1". DeviceSpecifications. Archived from the original on 23 July 2014. Retrieved 14 March 2014.
"Huawei P6 S". Huawei. Archived from the original on 22 June 2014. Retrieved 12 June 2014.
"Huawei MediaPad M1". DeviceSpecifications. Archived from the original on 29 April 2015. Retrieved 14 March 2014.
"Huawei Honor 6". DeviceSpecifications. Archived from the original on 27 June 2014. Retrieved 25 June 2014.
"Huawei Ascend Mate 8/Honor 7's Kirin 940/950 Processor Performance & Specs". Archived from the original on 16 March 2015. Retrieved 13 May 2015.
"HUAWEI MediaPad M3 8.0". Huawei-Consumer. Huawei. Archived from the original on 20 November 2016. Retrieved 18 January 2017.
"Kirin 955, Huawei P9, P9 Plus". Archived from the original on 9 April 2016. Retrieved 7 April 2016.
"Huawei announces the HiSilicon Kirin 960: 4xA73 + 4xA53, G71MP8, CDMA". AnandTech. 19 October 2016. Archived from the original on 20 October 2016. Retrieved 19 October 2016.
Frumusanu, Andrei. "HiSilicon Kirin 970 – Android SoC Power & Performance Overview". www.anandtech.com. Archived from the original on 28 January 2019. Retrieved 28 January 2019.
Cutress, Ian. "Cambricon, Makers of Huawei's Kirin NPU IP, Build A Big AI Chip and PCIe Card". www.anandtech.com. Archived from the original on 28 January 2019. Retrieved 28 January 2019.
Hinum, Klaus (12 October 2018). "ARM Mali-G76 MP10". Notebookcheck. Archived from the original on 4 December 2018. Retrieved 3 December 2018.{{cite web}}: CS1 maint: numeric names: authors list (link)
"Kirin". www.hisilicon.com. Archived from the original on 2 October 2019. Retrieved 21 September 2019.
Cutress, Dr Ian. "Hot Chips 31 Live Blogs: Huawei Da Vinci Architecture". www.anandtech.com. Archived from the original on 21 August 2019. Retrieved 21 August 2019.
"Balong". www.hisilicon.com. Archived from the original on 4 May 2019. Retrieved 5 May 2019.
"HiSilicon Releases Leading LTE Multi-mode Chipset | HiSilicon". www.hisilicon.com. Archived from the original on 5 May 2019. Retrieved 5 May 2019.
"Huawei Launches the World's First 8-Antenna 4.5G Modem Chipset". www.hisilicon.com. Archived from the original on 17 May 2019. Retrieved 5 May 2019.
"Huawei Launches Industry-Leading 5G Multi-Mode Chipset Balong 5000 to Lead the 5G Era". www.hisilicon.com. Archived from the original on 5 May 2019. Retrieved 5 May 2019.
"Huawei Mate 20 X 5G Teardown". iFixit. 25 July 2019. Archived from the original on 27 July 2019. Retrieved 27 July 2019.
S, Amy (7 September 2019). "Kirin A1: The world's first Bluetooth 5.1 and Bluetooth Low Energy 5.1 Wearable Chip". Huawei Central. Archived from the original on 21 September 2019. Retrieved 21 September 2019.
"HUAWEI FreeBuds 3, Kirin A1, Intelligent Noise Cancellation | HUAWEI Global". consumer.huawei.com. Archived from the original on 21 September 2019. Retrieved 21 September 2019.
Cutress, Ian. "Huawei Server Efforts: Hi1620 and Arm's Big Server Core, Ares". www.anandtech.com. Archived from the original on 9 June 2019. Retrieved 4 May 2019.
"TaiShan 2280 Balanced Server ─ Huawei Enterprise". Huawei Enterprise. Archived from the original on 5 May 2019. Retrieved 5 May 2019.
"TaiShan 5280 Storage Server". Huawei Enterprise. Archived from the original on 5 May 2019. Retrieved 5 May 2019.
"TaiShan XA320 High-Density Server Node". Huawei Enterprise. Archived from the original on 5 May 2019. Retrieved 5 May 2019.
"TaiShan X6000 ARM High-Density Server". Huawei Enterprise. Archived from the original on 5 May 2019. Retrieved 5 May 2019.
"Huawei Unveils Industry's Highest-Performance ARM-based CPU Bringing Global Computing Power to Next Level". www.hisilicon.com. Archived from the original on 4 May 2019. Retrieved 4 May 2019.
"TaiShan 2280 V2 Balanced Server ─ Huawei Enterprise". Huawei Enterprise. Archived from the original on 5 May 2019. Retrieved 5 May 2019.
"TaiShan 5280 V2 Storage Server ─ Huawei Enterprise". Huawei Enterprise. Archived from the original on 5 May 2019. Retrieved 5 May 2019.
"TaiShan XA320 V2 High-Density Server Node". Huawei Enterprise. Archived from the original on 5 May 2019. Retrieved 5 May 2019.
Schor, David (3 May 2019). "Huawei Expands Kunpeng Server CPUs, Plans SMT, SVE For Next Gen". WikiChip Fuse. Archived from the original on 4 May 2019. Retrieved 4 May 2019.
"Ascend | HiSilicon". www.hisilicon.com. Archived from the original on 4 May 2019. Retrieved 4 May 2019.

wikichip.org

fuse.wikichip.org

Schor, David (3 May 2019). "Huawei Expands Kunpeng Server CPUs, Plans SMT, SVE For Next Gen". WikiChip Fuse. Archived from the original on 4 May 2019. Retrieved 4 May 2019.

windosi.com

"Hisilicon grown into the largest local IC design companies". Windosi. September 2012. Archived from the original on 21 August 2014. Retrieved 26 April 2013.

worldcat.org

search.worldcat.org

Qing, Lingli; Chun, Dongphil; Xiong, Peng (1 December 2022). "What Cultivates a Path of Disruptive Innovation within Semiconductor Latecomers? An Exploratory Case Study of HiSilicon". Science, Technology and Society. 27 (4): 502–523. doi:10.1177/09717218221124884. ISSN 0971-7218.

xda-developers.com

"Huawei HiSilicon's new 14nm Kirin 710A chip was manufactured by Shanghai-based SMIC". xda-developers. 13 May 2020. Retrieved 2 July 2020.

youtube.com

极客湾Geekerwan (youtube.com) (6 December 2024). "华为Mate70 Pro+性能分析：麒麟9020来啦！". YouTube.