Integrated circuit packaging (English Wikipedia)

Analysis of information sources in references of the Wikipedia article "Integrated circuit packaging" in English language version.

refsWebsite

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2books.google.com

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1researchgate.net

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1semanticscholar.org

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1semiconductor-digest.com

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1web.archive.org

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archive.org

Rabaey, Jan (2007). Digital Integrated Circuits (2nd ed.). Prentice Hall, Inc. ISBN 978-0130909961.

books.google.com

Materials for Advanced Packaging. Springer. 17 December 2008. ISBN 978-0-387-78219-5.
Lau, John H. (30 June 1994). Chip on Board: Technology for Multichip Modules. Springer. ISBN 978-0-442-01441-4.

doi.org

Ardebili, Haleh; Pecht, Michael G. (2009). "Plastic Encapsulant Materials". Encapsulation Technologies for Electronic Applications. pp. 47–127. doi:10.1016/B978-0-8155-1576-0.50006-1. ISBN 9780815515760. S2CID 138753417 – via ResearchGate.

eetimes.com

"Die bonding techniques and methods". 9 July 2012.
"Die bonding techniques and methods". 9 July 2012.

hal.science

Buttay, Cyril, et al. "Die attach of power devices using silver sintering-bonding process optimization and characterization." HiTEN 2011. 2011.

intel.com

"Land Grid Array (LGA) Socket and Package Technology" (PDF). Intel. Retrieved April 7, 2016.

nasa.gov

nepp.nasa.gov

R. Wayne Johnson, Mark Strickland and David Gerke, NASA Electronic Parts and Packaging Program. "3-D Packaging: A Technology Review." June 23, 2005. Retrieved July 31, 2015

oricus-semicon.com

"What is the Die Attach process?". Oricus Semicon Solutions. 2021-11-01. Retrieved 2024-04-22.

researchgate.net

Ardebili, Haleh; Pecht, Michael G. (2009). "Plastic Encapsulant Materials". Encapsulation Technologies for Electronic Applications. pp. 47–127. doi:10.1016/B978-0-8155-1576-0.50006-1. ISBN 9780815515760. S2CID 138753417 – via ResearchGate.

semanticscholar.org

api.semanticscholar.org

Ardebili, Haleh; Pecht, Michael G. (2009). "Plastic Encapsulant Materials". Encapsulation Technologies for Electronic Applications. pp. 47–127. doi:10.1016/B978-0-8155-1576-0.50006-1. ISBN 9780815515760. S2CID 138753417 – via ResearchGate.

semiconductor-digest.com

sst.semiconductor-digest.com

"Wire Bond Vs. Flip Chip Packaging | Semiconductor Digest". 10 December 2016.

web.archive.org

Riley, George (2009-01-30). "Flipchips: Tutorial #1". Archived from the original on January 30, 2009. Retrieved 2016-04-07.{{cite web}}: CS1 maint: unfit URL (link)