Miniaturization (English Wikipedia)

Analysis of information sources in references of the Wikipedia article "Miniaturization" in English language version.

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5doi.org

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5books.google.com

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3web.archive.org

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3worldcat.org

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2computerhistory.org

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2archive.org

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2iop.org

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2semanticscholar.org

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1eetimes.com

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1elsevier.com

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1harvard.edu

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1cartesianproduct.wordpress.com

low place

1medicalmoulds.com

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archive.org

Sharma, Karl (2010). Nanostructuring Operations in Nanoscale Science and Engineering. New York: McGraw-Hill Companies Inc. pp. 16. ISBN 9780071626095.
Van Riper, A. Bowdoin (2002). Science in Popular Culture: A Reference Guide. Westport, CT: Greenwood Publishing Group. pp. 193. ISBN 0313318220.

books.google.com

Colinge, Jean-Pierre; Colinge, C. A. (2005). Physics of Semiconductor Devices. Springer Science & Business Media. p. 165. ISBN 9780387285238.
Siozios, Kostas; Anagnostos, Dimitrios; Soudris, Dimitrios; Kosmatopoulos, Elias (2018). IoT for Smart Grids: Design Challenges and Paradigms. Springer. p. 167. ISBN 9783030036409.
Sridharan, K.; Pudi, Vikramkumar (2015). Design of Arithmetic Circuits in Quantum Dot Cellular Automata Nanotechnology. Springer. p. 1. ISBN 9783319166889.
Moskowitz, Sanford L. (2016). Advanced Materials Innovation: Managing Global Technology in the 21st century. John Wiley & Sons. pp. 165–167. ISBN 9780470508923.
Golio, Mike; Golio, Janet (2018). RF and Microwave Passive and Active Technologies. CRC Press. pp. 18–5. ISBN 9781420006728.

cartesianproduct.wordpress.com

McMenamin, Adrian (April 15, 2013). "The end of Dennard scaling". Retrieved January 23, 2014.

computerhistory.org

"Tortoise of Transistors Wins the Race - CHM Revolution". Computer History Museum. Retrieved 22 July 2019.
"Who Invented the Transistor?". Computer History Museum. 4 December 2013. Retrieved 20 July 2019.

doi.org

Motoyoshi, M. (2009). "Through-Silicon Via (TSV)" (PDF). Proceedings of the IEEE. 97 (1): 43–48. doi:10.1109/JPROC.2008.2007462. ISSN 0018-9219. S2CID 29105721. Archived from the original (PDF) on 2019-07-19.
Huff, Howard; Riordan, Michael (2007-09-01). "Frosch and Derick: Fifty Years Later (Foreword)". The Electrochemical Society Interface. 16 (3): 29. doi:10.1149/2.F02073IF. ISSN 1064-8208.
Frosch, C. J.; Derick, L (1957). "Surface Protection and Selective Masking during Diffusion in Silicon". Journal of the Electrochemical Society. 104 (9): 547. doi:10.1149/1.2428650.
KAHNG, D. (1961). "Silicon-Silicon Dioxide Surface Device". Technical Memorandum of Bell Laboratories: 583–596. doi:10.1142/9789814503464_0076. ISBN 978-981-02-0209-5. {{cite journal}}: ISBN / Date incompatibility (help)
Ligenza, J.R.; Spitzer, W.G. (1960). "The mechanisms for silicon oxidation in steam and oxygen". Journal of Physics and Chemistry of Solids. 14: 131–136. Bibcode:1960JPCS...14..131L. doi:10.1016/0022-3697(60)90219-5.

eetimes.com

"Transistors Keep Moore's Law Alive". EETimes. 12 December 2018. Retrieved 18 July 2019.

elsevier.com

linkinghub.elsevier.com

Ligenza, J.R.; Spitzer, W.G. (1960). "The mechanisms for silicon oxidation in steam and oxygen". Journal of Physics and Chemistry of Solids. 14: 131–136. Bibcode:1960JPCS...14..131L. doi:10.1016/0022-3697(60)90219-5.

harvard.edu

ui.adsabs.harvard.edu

Ligenza, J.R.; Spitzer, W.G. (1960). "The mechanisms for silicon oxidation in steam and oxygen". Journal of Physics and Chemistry of Solids. 14: 131–136. Bibcode:1960JPCS...14..131L. doi:10.1016/0022-3697(60)90219-5.

iop.org

iopscience.iop.org

Huff, Howard; Riordan, Michael (2007-09-01). "Frosch and Derick: Fifty Years Later (Foreword)". The Electrochemical Society Interface. 16 (3): 29. doi:10.1149/2.F02073IF. ISSN 1064-8208.
Frosch, C. J.; Derick, L (1957). "Surface Protection and Selective Masking during Diffusion in Silicon". Journal of the Electrochemical Society. 104 (9): 547. doi:10.1149/1.2428650.

medicalmoulds.com

"Micro Moulding and Miniaturisation in MedTech". Micro Systems. 17 May 2023. Retrieved 18 May 2023.

semanticscholar.org

api.semanticscholar.org

Motoyoshi, M. (2009). "Through-Silicon Via (TSV)" (PDF). Proceedings of the IEEE. 97 (1): 43–48. doi:10.1109/JPROC.2008.2007462. ISSN 0018-9219. S2CID 29105721. Archived from the original (PDF) on 2019-07-19.

pdfs.semanticscholar.org

Motoyoshi, M. (2009). "Through-Silicon Via (TSV)" (PDF). Proceedings of the IEEE. 97 (1): 43–48. doi:10.1109/JPROC.2008.2007462. ISSN 0018-9219. S2CID 29105721. Archived from the original (PDF) on 2019-07-19.

web.archive.org

Motoyoshi, M. (2009). "Through-Silicon Via (TSV)" (PDF). Proceedings of the IEEE. 97 (1): 43–48. doi:10.1109/JPROC.2008.2007462. ISSN 0018-9219. S2CID 29105721. Archived from the original (PDF) on 2019-07-19.
"Cramming more components onto integrated circuits" (PDF). Electronics Magazine. 1965. p. 4. Archived from the original (PDF) on 2008-02-18. Retrieved November 11, 2006.
"Excerpts from A Conversation with Gordon Moore: Moore's Law" (PDF). Intel Corporation. 2005. p. 1. Archived from the original (PDF) on 2008-02-18. Retrieved May 2, 2006.

worldcat.org

search.worldcat.org

Motoyoshi, M. (2009). "Through-Silicon Via (TSV)" (PDF). Proceedings of the IEEE. 97 (1): 43–48. doi:10.1109/JPROC.2008.2007462. ISSN 0018-9219. S2CID 29105721. Archived from the original (PDF) on 2019-07-19.
Huff, Howard; Riordan, Michael (2007-09-01). "Frosch and Derick: Fifty Years Later (Foreword)". The Electrochemical Society Interface. 16 (3): 29. doi:10.1149/2.F02073IF. ISSN 1064-8208.
Streetman, Ben G.; Banerjee, Sanjay Kumar (2016). Solid state electronic devices. Boston: Pearson. p. 341. ISBN 978-1-292-06055-2. OCLC 908999844.