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Williams, R. K.; Darwish, M. N.; Blanchard, R. A.; Siemieniec, R.; Rutter, P.; Kawaguchi, Y. (2017). "The Trench Power MOSFET—Part II: Application Specific VDMOS, LDMOS, Packaging, and Reliability". IEEE Transactions on Electron Devices. 64 (3): 692–712. Bibcode:2017ITED...64..692W. doi:10.1109/TED.2017.2655149. ISSN0018-9383. S2CID38550249.
Williams, R. K.; Darwish, M. N.; Blanchard, R. A.; Siemieniec, R.; Rutter, P.; Kawaguchi, Y. (2017). "The Trench Power MOSFET—Part II: Application Specific VDMOS, LDMOS, Packaging, and Reliability". IEEE Transactions on Electron Devices. 64 (3): 692–712. Bibcode:2017ITED...64..692W. doi:10.1109/TED.2017.2655149. ISSN0018-9383. S2CID38550249.
Williams, R. K.; Darwish, M. N.; Blanchard, R. A.; Siemieniec, R.; Rutter, P.; Kawaguchi, Y. (2017). "The Trench Power MOSFET—Part II: Application Specific VDMOS, LDMOS, Packaging, and Reliability". IEEE Transactions on Electron Devices. 64 (3): 692–712. Bibcode:2017ITED...64..692W. doi:10.1109/TED.2017.2655149. ISSN0018-9383. S2CID38550249.
Williams, R. K.; Darwish, M. N.; Blanchard, R. A.; Siemieniec, R.; Rutter, P.; Kawaguchi, Y. (2017). "The Trench Power MOSFET—Part II: Application Specific VDMOS, LDMOS, Packaging, and Reliability". IEEE Transactions on Electron Devices. 64 (3): 692–712. Bibcode:2017ITED...64..692W. doi:10.1109/TED.2017.2655149. ISSN0018-9383. S2CID38550249.