Multi-project wafer service (English Wikipedia)

Analysis of information sources in references of the Wikipedia article "Multi-project wafer service" in English language version.

refsWebsite

Global rank English rank

11doi.org

2^nd place

8semanticscholar.org

11^th place

8^th place

5musesemi.com

low place

2umich.edu

459^th place

360^th place

1europractice-ic.com

low place

1smartphotonics.nl

low place

1europa.eu

68^th place

117^th place

1semiwiki.com

low place

1nsf.gov

3,828^th place

2,823^rd place

1cornell.edu

332^nd place

246^th place

1tsmc.com

low place

1pubpub.org

low place

1caltech.edu

887^th place

714^th place

1themosisservice.com

low place

1harvard.edu

18^th place

17^th place

1uni-kl.de

low place

1skywatertechnology.com

low place

caltech.edu

caltechconf.library.caltech.edu

Conway, L. (1982). "The MPC adventures: Experiences with the generation of VLSI design and implementation methodologies" (PDF). Microprocessing and Microprogramming Number 4. 10 (4): 209–228. doi:10.1016/0165-6074(82)90054-0.

cornell.edu

csl.cornell.edu

https://www.csl.cornell.edu/~cbatten/pdfs/torng-brgtc2-slides-riscvday2018.pdf A New Era of Silicon Prototyping in Computer Architecture Research

doi.org

Wu, M.-C.; Lin, R.-B. (2005). "Multiple Project Wafers for Medium-Volume IC Production". 2005 IEEE International Symposium on Circuits and Systems. pp. 4725–4728. doi:10.1109/ISCAS.2005.1465688. ISBN 0-7803-8834-8. S2CID 16510670.
Grinde, C.; Welham, C. (2008). "μBUILDER: The easy and low cost road to advanced microsystems". 2008 15th IEEE International Conference on Electronics, Circuits and Systems. pp. 17–18. doi:10.1109/ICECS.2008.4675128. ISBN 978-1-4244-2181-7.
Pann, P. (2009). "Prototyping and testing of analog integrated circuits". Proceedings - 1st Asia Symposium on Quality Electronic Design: 173–177. doi:10.1109/ASQED.2009.5206277. S2CID 2987670.
Conway, L. (1982). "The MPC adventures: Experiences with the generation of VLSI design and implementation methodologies" (PDF). Microprocessing and Microprogramming Number 4. 10 (4): 209–228. doi:10.1016/0165-6074(82)90054-0.
Tenhunen, H.; Nielsen, I.-R. (1994). "Microelectronics R&D cooperation in the nordic countries". Analog Integrated Circuits and Signal Processing. 5 (3): 195–197. Bibcode:1994AICSP...5..195T. doi:10.1007/BF01261411. S2CID 62771908.
Olesen, O.; Svensson, C. (1984). "NORCHIP, a silicon brokers model". Integration. 2: 3–13. doi:10.1016/0167-9260(84)90003-8.
Kemppinen, E.; Järvinen, E.; Närhi, T. (1988). "Design of an L-band monolithic GaAs receiver front-end with low power consumption". 1988., IEEE International Symposium on Circuits and Systems. Vol. 3. pp. 2535–2538. doi:10.1109/ISCAS.1988.15458. S2CID 57998893.
Andersson, M.; Åberg, M.; Pohjonen, H. (1988). "Simultaneous extraction of GaAs MESFET channel and gate diode parameters and its application to circuit simulation". 1988., IEEE International Symposium on Circuits and Systems. Vol. 3. pp. 2601–2604. doi:10.1109/ISCAS.1988.15474. S2CID 62628680.
Courtois, B.; Delori, H.; Karam, J.M.; Paillotin, F.; Torki, K. (1996). "CMP services: Basic principles and developments". 2nd International Conference on ASIC. pp. 417–420. doi:10.1109/ICASIC.1996.562841. S2CID 108800823.
Torki, K.; Courtois, B. (2001). "CMP: The access to advanced low cost manufacturing". Proceedings 2001 International Conference on Microelectronic Systems Education. pp. 6–9. doi:10.1109/MSE.2001.932392. ISBN 0-7695-1156-2. S2CID 30387757.
Li, Tao; Hou, Jie; Yan, Jinli; Liu, Rulin; Yang, Hui; Sun, Zhigang (2020). "Chiplet Heterogeneous Integration Technology—Status and Challenges". Electronics. 9 (4): 670. doi:10.3390/electronics9040670. S2CID 218776269.

europa.eu

cordis.europa.eu

"An integrated modular service for microfluidics, μBUILDER program".

europractice-ic.com

"EUROPRACTICE MEMS MPW".

harvard.edu

ui.adsabs.harvard.edu

Tenhunen, H.; Nielsen, I.-R. (1994). "Microelectronics R&D cooperation in the nordic countries". Analog Integrated Circuits and Signal Processing. 5 (3): 195–197. Bibcode:1994AICSP...5..195T. doi:10.1007/BF01261411. S2CID 62771908.

musesemi.com

"FAQ | Muse Semiconductor". musesemi. Retrieved 2022-09-04.
"FAQ | Muse Semiconductor". musesemi.
"Home | Muse Semiconductor". musesemi. Retrieved 2022-09-04.
https://www.musesemi.com/shared-block-tapeout-pricing Example of MPW pricing
"TSMC University FinFET Program Services and Price | Muse Semiconductor".

nsf.gov

"Dear Colleague Letter: Supplements for Access to Semiconductor Fabrication (ASF) (nsf22113) | NSF - National Science Foundation". www.nsf.gov. Retrieved 2022-09-06.

pubpub.org

conwaysuchman-conv.pubpub.org

Conway, Lynn; Suchman, Lucy (February 28, 2021). "Conway-Suchman conversation". Conway Suchman Conversation – via conwaysuchman-conv.pubpub.org.

semanticscholar.org

api.semanticscholar.org

Wu, M.-C.; Lin, R.-B. (2005). "Multiple Project Wafers for Medium-Volume IC Production". 2005 IEEE International Symposium on Circuits and Systems. pp. 4725–4728. doi:10.1109/ISCAS.2005.1465688. ISBN 0-7803-8834-8. S2CID 16510670.
Pann, P. (2009). "Prototyping and testing of analog integrated circuits". Proceedings - 1st Asia Symposium on Quality Electronic Design: 173–177. doi:10.1109/ASQED.2009.5206277. S2CID 2987670.
Tenhunen, H.; Nielsen, I.-R. (1994). "Microelectronics R&D cooperation in the nordic countries". Analog Integrated Circuits and Signal Processing. 5 (3): 195–197. Bibcode:1994AICSP...5..195T. doi:10.1007/BF01261411. S2CID 62771908.
Kemppinen, E.; Järvinen, E.; Närhi, T. (1988). "Design of an L-band monolithic GaAs receiver front-end with low power consumption". 1988., IEEE International Symposium on Circuits and Systems. Vol. 3. pp. 2535–2538. doi:10.1109/ISCAS.1988.15458. S2CID 57998893.
Andersson, M.; Åberg, M.; Pohjonen, H. (1988). "Simultaneous extraction of GaAs MESFET channel and gate diode parameters and its application to circuit simulation". 1988., IEEE International Symposium on Circuits and Systems. Vol. 3. pp. 2601–2604. doi:10.1109/ISCAS.1988.15474. S2CID 62628680.
Courtois, B.; Delori, H.; Karam, J.M.; Paillotin, F.; Torki, K. (1996). "CMP services: Basic principles and developments". 2nd International Conference on ASIC. pp. 417–420. doi:10.1109/ICASIC.1996.562841. S2CID 108800823.
Torki, K.; Courtois, B. (2001). "CMP: The access to advanced low cost manufacturing". Proceedings 2001 International Conference on Microelectronic Systems Education. pp. 6–9. doi:10.1109/MSE.2001.932392. ISBN 0-7695-1156-2. S2CID 30387757.
Li, Tao; Hou, Jie; Yan, Jinli; Liu, Rulin; Yang, Hui; Sun, Zhigang (2020). "Chiplet Heterogeneous Integration Technology—Status and Challenges". Electronics. 9 (4): 670. doi:10.3390/electronics9040670. S2CID 218776269.