Package on a package (English Wikipedia)

Analysis of information sources in references of the Wikipedia article "Package on a package" in English language version.

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2web.archive.org

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1semiengineering.com

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1researchgate.net

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1semanticscholar.org

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1toshiba-components.com

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1docs.google.com

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1koreatimes.co.kr

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amkor.com

Amkor Technology. "Package on Package (PoP | PSfvBGA | PSfcCSP | TMV® PoP)". Retrieved 2015-07-30.

docs.google.com

"United States Patent US 7,923,830 B2" (PDF). 2011-04-12. Retrieved 2015-07-30.

doi.org

Garrou, Philip (6 August 2008). "Introduction to 3D Integration". Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits (PDF). Wiley-VCH. p. 4. doi:10.1002/9783527623051.ch1. ISBN 9783527623051.
James, Dick (2014). "3D ICs in the real world". 25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014). pp. 113–119. doi:10.1109/ASMC.2014.6846988. ISBN 978-1-4799-3944-2. S2CID 42565898.

indium.com

Thomas, Glen. "Package-on-Package Flux". Indium Corporation. Retrieved 2015-07-30.

koreatimes.co.kr

"Hynix Surprises NAND Chip Industry". Korea Times. 5 September 2007. Retrieved 8 July 2019.

researchgate.net

James, Dick (2014). "3D ICs in the real world". 25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014). pp. 113–119. doi:10.1109/ASMC.2014.6846988. ISBN 978-1-4799-3944-2. S2CID 42565898.

semanticscholar.org

api.semanticscholar.org

James, Dick (2014). "3D ICs in the real world". 25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014). pp. 113–119. doi:10.1109/ASMC.2014.6846988. ISBN 978-1-4799-3944-2. S2CID 42565898.

semiengineering.com

LaPedus, Mark (2014-06-19). "Mobile Packaging Market Heats Up". Semiconductor Engineering. Retrieved 2016-04-28.

tib.eu

Imoto, T.; Matsui, M.; Takubo, C.; Akejima, S.; Kariya, T.; Nishikawa, T.; Enomoto, R. (2001). "Development of 3-Dimensional Module Package, "System Block Module"". Electronic Components and Technology Conference (51). Institute of Electrical and Electronics Engineers: 552–7.

toshiba-components.com

"System-in-Package (SiP)". Toshiba. Archived from the original on 3 April 2010. Retrieved 3 April 2010.

toshiba.com

"TOSHIBA COMMERCIALIZES INDUSTRY'S HIGHEST CAPACITY EMBEDDED NAND FLASH MEMORY FOR MOBILE CONSUMER PRODUCTS". Toshiba. April 17, 2007. Archived from the original on November 23, 2010. Retrieved 23 November 2010.

web.archive.org

"System-in-Package (SiP)". Toshiba. Archived from the original on 3 April 2010. Retrieved 3 April 2010.
"TOSHIBA COMMERCIALIZES INDUSTRY'S HIGHEST CAPACITY EMBEDDED NAND FLASH MEMORY FOR MOBILE CONSUMER PRODUCTS". Toshiba. April 17, 2007. Archived from the original on November 23, 2010. Retrieved 23 November 2010.

wiley-vch.de

application.wiley-vch.de

Garrou, Philip (6 August 2008). "Introduction to 3D Integration". Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits (PDF). Wiley-VCH. p. 4. doi:10.1002/9783527623051.ch1. ISBN 9783527623051.