Printed circuit board (English Wikipedia)

Bhunia, Swarup; Tehranipoor, Mark (2019). "Chapter 2, section 2.6, A Quick Overview of Electronic Hardware". Hardware Security. p. 36. doi:10.1016/b978-0-12-812477-2.00007-1. ISBN 978-0-12-812477-2.
Ostmann, Andreas; Schein, Friedrich-Leonhard; Dietterle, Michael; Kunz, Marc; Lang, Klaus-Dieter (2018). "High Density Interconnect Processes for Panel Level Packaging". 2018 7th Electronic System-Integration Technology Conference (ESTC). pp. 1–5. doi:10.1109/ESTC.2018.8546431. ISBN 978-1-5386-6814-6. S2CID 54214952.
Perdigones, Francisco; Quero, José Manuel (2022). "Printed Circuit Boards: The Layers' Functions for Electronic and Biomedical Engineering". Micromachines. 13 (3). MDPI: 460. doi:10.3390/mi13030460. PMC 8952574. PMID 35334752.
Brown, Mark; Rawtani, Jawahar; Patil, Dinesh (2004). "Appendix B - Troubleshooting". Practical Troubleshooting of Electrical Equipment and Control Circuits. Elsevier. pp. 196–212. doi:10.1016/b978-075066278-9/50009-3. ISBN 978-0-7506-6278-9.

dupont.com

"Pyralux Flexible Circuit Materials". DuPont.

electronicdesign.com

"StackPath". February 11, 2014.

espacenet.com

worldwide.espacenet.com

US 1256599, Schoop, Max Ulrich, "Process and mechanism for the production of electric heaters", published 1918-02-19
US 2756485, Abramson, Moe & Danko, Stanislaus F., "Process of Assembling Electrical Circuits", published 1956-07-31, assigned to Secretary of the United States Army
US patent 5434751, Cole, Jr., Herbert S.; Sitnik-Nieters, Theresa A. & Wojnarowski, Robert J. et al., "Reworkable high density interconnect structure incorporating a release layer", issued July 18, 1995
US 4175816, Burr, Robert P.; Morino, Ronald & Keogh, Raymond J., "Multi-wire electrical interconnecting member having a multi-wire matrix of insulated wires mechanically terminated thereon", published 1979-11-27, assigned to Kollmorgen Technologies Corp.

europa.eu

eur-lex.europa.eu

"EURLex – 02011L0065-20140129 – EN – EUR-Lex". Eur-lex.europa.eu. Archived from the original on January 7, 2016. Retrieved July 3, 2015.

freedomcad.com

"Why Use High Density Interconnect?". August 21, 2018.

iconnect007.com

"World PCB Production in 2014 Estimated at $60.2B". iconnect007. September 28, 2015. Retrieved April 12, 2016.

ieee.org

"IEEE Cledo Brunetti Award Recipients" (PDF). IEEE. Archived from the original (PDF) on August 4, 2018.

ieeexplore.ieee.org

Ostmann, Andreas; Schein, Friedrich-Leonhard; Dietterle, Michael; Kunz, Marc; Lang, Klaus-Dieter (2018). "High Density Interconnect Processes for Panel Level Packaging". 2018 7th Electronic System-Integration Technology Conference (ESTC). pp. 1–5. doi:10.1109/ESTC.2018.8546431. ISBN 978-1-5386-6814-6. S2CID 54214952.

jhuapl.edu

Wagner, G. Donald (1999). "History of Electronic Packaging at APL: From the VT Fuze to the NEAR Spacecraft" (PDF). Johns Hopkins APL Technical Digest. 20 (1). Archived from the original (PDF) on May 10, 2017.

laserfocusworld.com

"Advances in Optical Communications: Making optical printed circuit boards on an industrial scale". October 2019.

legislation.gov.uk

"The Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment Regulations 2012". legislation.gov.uk. December 4, 2012. Retrieved March 31, 2022.

michigan.gov

"How Does Lead Affect Our Environment?". Pollutants and Toxicants: Environmental Lead (Pb). Department of Environmental Quality, State of Michigan. 2019. Archived from the original on April 19, 2019.1. “You Are HereDEQ Pollutants and Toxicants Environmental Lead (Pb).” DEQ - How Does Lead Affect Our Environment?, Agency: Environmental Quality, www.michigan.gov/deq/0,4561,7-135-3307_29693_30031-90418--,00.html.

microwavejournal.com

"A High Performance, Economical RF/Microwave Substrate". MicrowaveJournal.com. September 1, 1998. Retrieved November 4, 2024.

mordorintelligence.com

"PCB Market Size". PCB Market Size, Share, Trends. Retrieved December 22, 2024.

multi-circuit-boards.eu

"RF-35 datasheet" (PDF). Taconic – via Multi-CB.

nih.gov

ncbi.nlm.nih.gov

Perdigones, Francisco; Quero, José Manuel (2022). "Printed Circuit Boards: The Layers' Functions for Electronic and Biomedical Engineering". Micromachines. 13 (3). MDPI: 460. doi:10.3390/mi13030460. PMC 8952574. PMID 35334752.

pubmed.ncbi.nlm.nih.gov

Perdigones, Francisco; Quero, José Manuel (2022). "Printed Circuit Boards: The Layers' Functions for Electronic and Biomedical Engineering". Micromachines. 13 (3). MDPI: 460. doi:10.3390/mi13030460. PMC 8952574. PMID 35334752.

rohsguide.com

"FAQ on RoHS Compliance". RoHS Compliance Guide.

semanticscholar.org

api.semanticscholar.org

Ostmann, Andreas; Schein, Friedrich-Leonhard; Dietterle, Michael; Kunz, Marc; Lang, Klaus-Dieter (2018). "High Density Interconnect Processes for Panel Level Packaging". 2018 7th Electronic System-Integration Technology Conference (ESTC). pp. 1–5. doi:10.1109/ESTC.2018.8546431. ISBN 978-1-5386-6814-6. S2CID 54214952.

speedingedge.com

Lee W. Ritchey, Speeding Edge (November 1999). "A Survey and Tutorial of DIELECTRIC MATERIALS USED in the Manufacture of Printed Circuit Boards" (PDF). Circuitree Magazine.

upilex.jp

"Applications | UBE Heat Resistant Polyimide Materials". Upilex.jp. UBE.

vgamuseum.info

Weisberg, David E. (2008). "14: Intergraph" (PDF). pp. 14–8.

web.archive.org

"IEEE Cledo Brunetti Award Recipients" (PDF). IEEE. Archived from the original (PDF) on August 4, 2018.
Wagner, G. Donald (1999). "History of Electronic Packaging at APL: From the VT Fuze to the NEAR Spacecraft" (PDF). Johns Hopkins APL Technical Digest. 20 (1). Archived from the original (PDF) on May 10, 2017.
"EURLex – 02011L0065-20140129 – EN – EUR-Lex". Eur-lex.europa.eu. Archived from the original on January 7, 2016. Retrieved July 3, 2015.
"How Does Lead Affect Our Environment?". Pollutants and Toxicants: Environmental Lead (Pb). Department of Environmental Quality, State of Michigan. 2019. Archived from the original on April 19, 2019.1. “You Are HereDEQ Pollutants and Toxicants Environmental Lead (Pb).” DEQ - How Does Lead Affect Our Environment?, Agency: Environmental Quality, www.michigan.gov/deq/0,4561,7-135-3307_29693_30031-90418--,00.html.

wisc.edu

engr.wisc.edu

Engineers' Day, 1984 Award Recipients, College of Engineering, University of Wisconsin-Madison