Printed circuit board (English Wikipedia)

Leong, W.C.; Abdullah, M.Z.; Khor, C.Y. (April 2012). "Application of flexible printed circuit board (FPCB) in personal computer motherboards: Focusing on mechanical performance". Microelectronics Reliability. 52 (4): 744–756. Bibcode:2012MiRe...52..744L. doi:10.1016/j.microrel.2011.11.003.

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"Advanced Coating. Parylene - Electrical Properties". advancedcoating.com. July 15 2026. Retrieved July 15 2026. {{cite web}}: Check date values in: |access-date= and |date= (help)CS1 maint: url-status (link)

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"What Is a Printed Circuit Board (PCB)? - Technical Articles". AllAboutCircuits.com. Retrieved June 24, 2021.

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"Material Matters: Comparing Polyimide, PET, and Other Flex PCB Materials and Their Thicknesses". www.allpcb.com.

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Brunetti, Cledo (November 22, 1948). New Advances in Printed Circuits. Washington, DC: National Bureau of Standards.

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Yung, Winco K. C. (2007). "Using Metal Core Printed Circuit Board (MCPCB) as a Solution for Thermal Management" (PDF). Journal of the HKPCA (24): 12–16.

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Materials for Advanced Packaging. Springer. November 18, 2016. ISBN 978-3-319-45098-8.
Carter, Bruce (March 19, 2009). Op Amps for Everyone. Newnes. ISBN 9780080949482 – via Google Books.

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Fjelstad, Joseph. "Method for the Manufacture of an Aluminum Substrate PCB and its Advantages" (PDF). CircuitInsight.com. Retrieved January 17, 2024.

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Bhunia, Swarup; Tehranipoor, Mark (2019). "Chapter 2, section 2.6, A Quick Overview of Electronic Hardware". Hardware Security. p. 36. doi:10.1016/b978-0-12-812477-2.00007-1. ISBN 978-0-12-812477-2.
Ostmann, Andreas; Schein, Friedrich-Leonhard; Dietterle, Michael; Kunz, Marc; Lang, Klaus-Dieter (2018). "High Density Interconnect Processes for Panel Level Packaging". 2018 7th Electronic System-Integration Technology Conference (ESTC). pp. 1–5. doi:10.1109/ESTC.2018.8546431. ISBN 978-1-5386-6814-6. S2CID 54214952.
Selbmann, Franz; Paul, Soumya Deep; Satwara, Maulik; Roscher, Frank; Wiemer, Maik; Kuhn, Harald; Joseph, Yvonne (February 10, 2023). "Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible Substrates". Micromachines. 14 (2): 415. doi:10.3390/mi14020415. ISSN 2072-666X. PMC 9960505. PMID 36838115.
Leong, W.C.; Abdullah, M.Z.; Khor, C.Y. (April 2012). "Application of flexible printed circuit board (FPCB) in personal computer motherboards: Focusing on mechanical performance". Microelectronics Reliability. 52 (4): 744–756. Bibcode:2012MiRe...52..744L. doi:10.1016/j.microrel.2011.11.003.
Selbmann, Franz; Baum, Mario; Meinecke, Christoph; Wiemer, Maik; Kuhn, Harald; Joseph, Yvonne (July 1, 2021). "Low-Temperature Parylene-Based Adhesive Bonding Technology for 150 and 200 mm Wafers for Fully Biocompatible and Highly Reliable Microsystems". ECS Journal of Solid State Science and Technology. 10 (7): 074010. doi:10.1149/2162-8777/ac12b6. ISSN 2162-8769.
Selbmann, Franz; Roscher, Frank; de Souza Tortato, Felipe; Wiemer, Maik; Otto, Thomas; Joseph, Yvonne (April 27, 2021). "An ultra-thin and highly flexible multilayer Printed Circuit Board based on Parylene". IEEE: 1–4. doi:10.1109/SSI52265.2021.9466996. ISBN 978-1-6654-4092-9. {{cite journal}}: Cite journal requires |journal= (help)CS1 maint: periodical has ISBN (link)
Perdigones, Francisco; Quero, José Manuel (2022). "Printed Circuit Boards: The Layers' Functions for Electronic and Biomedical Engineering". Micromachines. 13 (3). MDPI: 460. doi:10.3390/mi13030460. PMC 8952574. PMID 35334752.
Brown, Mark; Rawtani, Jawahar; Patil, Dinesh (2004). "Appendix B - Troubleshooting". Practical Troubleshooting of Electrical Equipment and Control Circuits. Elsevier. pp. 196–212. doi:10.1016/b978-075066278-9/50009-3. ISBN 978-0-7506-6278-9.

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US 1256599, Schoop, Max Ulrich, "Process and mechanism for the production of electric heaters", published February 19, 1918
US 2756485, Abramson, Moe & Danko, Stanislaus F., "Process of Assembling Electrical Circuits", published July 31, 1956, assigned to Secretary of the United States Army
US patent 5434751, Cole, Jr., Herbert S.; Sitnik-Nieters, Theresa A. & Wojnarowski, Robert J. et al., "Reworkable high density interconnect structure incorporating a release layer", issued July 18, 1995
US 4175816, Burr, Robert P.; Morino, Ronald & Keogh, Raymond J., "Multi-wire electrical interconnecting member having a multi-wire matrix of insulated wires mechanically terminated thereon", published November 27, 1979, assigned to Kollmorgen Technologies Corp.

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"EURLex – 02011L0065-20140129 – EN – EUR-Lex". Eur-lex.europa.eu. Archived from the original on January 7, 2016. Retrieved July 3, 2015.

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enas.fraunhofer.de

Selbmann, Franz (July 24 2026). "Ultra-thin and highly flexible Parylene-based PCB with multiple metallization layers". enas.fraunhofer.de. Retrieved July 24 2026. {{cite web}}: Check date values in: |access-date= and |date= (help)

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"Why Use High Density Interconnect?". August 21, 2018.

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"World PCB Production in 2014 Estimated at $60.2B". iconnect007. September 28, 2015. Retrieved April 12, 2016.

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ieeexplore.ieee.org

Selbmann, Franz; Roscher, Frank; de Souza Tortato, Felipe; Wiemer, Maik; Otto, Thomas; Joseph, Yvonne (April 27, 2021). "An ultra-thin and highly flexible multilayer Printed Circuit Board based on Parylene". IEEE: 1–4. doi:10.1109/SSI52265.2021.9466996. ISBN 978-1-6654-4092-9. {{cite journal}}: Cite journal requires |journal= (help)CS1 maint: periodical has ISBN (link)

iop.org (Global: 1,046^th place; English: 1,608^th place)

iopscience.iop.org

Selbmann, Franz; Baum, Mario; Meinecke, Christoph; Wiemer, Maik; Kuhn, Harald; Joseph, Yvonne (July 1, 2021). "Low-Temperature Parylene-Based Adhesive Bonding Technology for 150 and 200 mm Wafers for Fully Biocompatible and Highly Reliable Microsystems". ECS Journal of Solid State Science and Technology. 10 (7): 074010. doi:10.1149/2162-8777/ac12b6. ISSN 2162-8769.

jhuapl.edu (Global: 6,146^th place; English: 5,567^th place)

Wagner, G. Donald (1999). "History of Electronic Packaging at APL: From the VT Fuze to the NEAR Spacecraft" (PDF). Johns Hopkins APL Technical Digest. 20 (1). Archived from the original (PDF) on May 10, 2017.

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"Advances in Optical Communications: Making optical printed circuit boards on an industrial scale". October 2019.

legislation.gov.uk (Global: 728^th place; English: 375^th place)

"The Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment Regulations 2012". legislation.gov.uk. December 4, 2012. Retrieved March 31, 2022.

mdpi.com (Global: 1,887^th place; English: 3,593^rd place)

Selbmann, Franz; Paul, Soumya Deep; Satwara, Maulik; Roscher, Frank; Wiemer, Maik; Kuhn, Harald; Joseph, Yvonne (February 10, 2023). "Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible Substrates". Micromachines. 14 (2): 415. doi:10.3390/mi14020415. ISSN 2072-666X. PMC 9960505. PMID 36838115.

michigan.gov (Global: 4,340^th place; English: 2,226^th place)

"How Does Lead Affect Our Environment?". Pollutants and Toxicants: Environmental Lead (Pb). Department of Environmental Quality, State of Michigan. 2019. Archived from the original on April 19, 2019.

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"A High Performance, Economical RF/Microwave Substrate". MicrowaveJournal.com. September 1, 1998. Retrieved November 4, 2024.

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multi-circuit-boards.eu (Global: low place; English: low place)

"RF-35 datasheet" (PDF). Taconic – via Multi-CB.

nih.gov (Global: 5^th place; English: 5^th place)

ncbi.nlm.nih.gov

Selbmann, Franz; Paul, Soumya Deep; Satwara, Maulik; Roscher, Frank; Wiemer, Maik; Kuhn, Harald; Joseph, Yvonne (February 10, 2023). "Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible Substrates". Micromachines. 14 (2): 415. doi:10.3390/mi14020415. ISSN 2072-666X. PMC 9960505. PMID 36838115.
Perdigones, Francisco; Quero, José Manuel (2022). "Printed Circuit Boards: The Layers' Functions for Electronic and Biomedical Engineering". Micromachines. 13 (3). MDPI: 460. doi:10.3390/mi13030460. PMC 8952574. PMID 35334752.

pubmed.ncbi.nlm.nih.gov

Selbmann, Franz; Paul, Soumya Deep; Satwara, Maulik; Roscher, Frank; Wiemer, Maik; Kuhn, Harald; Joseph, Yvonne (February 10, 2023). "Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible Substrates". Micromachines. 14 (2): 415. doi:10.3390/mi14020415. ISSN 2072-666X. PMC 9960505. PMID 36838115.
Perdigones, Francisco; Quero, José Manuel (2022). "Printed Circuit Boards: The Layers' Functions for Electronic and Biomedical Engineering". Micromachines. 13 (3). MDPI: 460. doi:10.3390/mi13030460. PMC 8952574. PMID 35334752.

qnityelectronics.com (Global: low place; English: low place)

"Pyralux Flexible Circuit Materials". DuPont.

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"FAQ on RoHS Compliance". RoHS Compliance Guide.

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Ostmann, Andreas; Schein, Friedrich-Leonhard; Dietterle, Michael; Kunz, Marc; Lang, Klaus-Dieter (2018). "High Density Interconnect Processes for Panel Level Packaging". 2018 7th Electronic System-Integration Technology Conference (ESTC). pp. 1–5. doi:10.1109/ESTC.2018.8546431. ISBN 978-1-5386-6814-6. S2CID 54214952.

speedingedge.com (Global: low place; English: low place)

Lee W. Ritchey, Speeding Edge (November 1999). "A Survey and Tutorial of DIELECTRIC MATERIALS USED in the Manufacture of Printed Circuit Boards" (PDF). Circuitree Magazine.

stanford.edu (Global: 194^th place; English: 182^nd place)

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Gorka Plata, Shraddha Singh and John Clegg. "Thermal Management Analysis of Conventional Multi-PCB-Stack for Geothermal Drilling Tools" (PDF). Stanford University.

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"Applications | UBE Heat Resistant Polyimide Materials". Upilex.jp. UBE.

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"IEEE Cledo Brunetti Award Recipients" (PDF). IEEE. Archived from the original (PDF) on August 4, 2018.
Wagner, G. Donald (1999). "History of Electronic Packaging at APL: From the VT Fuze to the NEAR Spacecraft" (PDF). Johns Hopkins APL Technical Digest. 20 (1). Archived from the original (PDF) on May 10, 2017.
"EURLex – 02011L0065-20140129 – EN – EUR-Lex". Eur-lex.europa.eu. Archived from the original on January 7, 2016. Retrieved July 3, 2015.
"How Does Lead Affect Our Environment?". Pollutants and Toxicants: Environmental Lead (Pb). Department of Environmental Quality, State of Michigan. 2019. Archived from the original on April 19, 2019.

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Engineers' Day, 1984 Award Recipients, College of Engineering, University of Wisconsin-Madison

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Selbmann, Franz; Paul, Soumya Deep; Satwara, Maulik; Roscher, Frank; Wiemer, Maik; Kuhn, Harald; Joseph, Yvonne (February 10, 2023). "Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible Substrates". Micromachines. 14 (2): 415. doi:10.3390/mi14020415. ISSN 2072-666X. PMC 9960505. PMID 36838115.
Selbmann, Franz; Baum, Mario; Meinecke, Christoph; Wiemer, Maik; Kuhn, Harald; Joseph, Yvonne (July 1, 2021). "Low-Temperature Parylene-Based Adhesive Bonding Technology for 150 and 200 mm Wafers for Fully Biocompatible and Highly Reliable Microsystems". ECS Journal of Solid State Science and Technology. 10 (7): 074010. doi:10.1149/2162-8777/ac12b6. ISSN 2162-8769.

Printed circuit board (English Wikipedia)

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