Reliability (semiconductor) (English Wikipedia)

Analysis of information sources in references of the Wikipedia article "Reliability (semiconductor)" in English language version.

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aecouncil.com (Global: low place; English: low place)

Ghrabli, Mehdi; Bouarroudj, Mounira; Chamoin, Ludovic; Aldea, Emanuel (2024). Hybrid modeling for remaining useful life prediction in power module prognosis. 2024 25th International Conference on Thermal Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Catania, Italy: IEEE. doi:10.1109/EuroSimE60745.2024.10491493.
Ghrabli, Mehdi; Bouarroudj, Mounira; Chamoin, Ludovic; Aldea, Emanuel (2025). "Physics-informed Markov chains for remaining useful life prediction of wire bonds in power electronic modules". Microelectronics Reliability. 167 115644: 1–12. Bibcode:2025MiRe..16715644G. doi:10.1016/j.microrel.2025.115644.

Sykes, Bob (June 2010). "Why test bonds?". Global SMT & Packaging magazine. Archived from the original on 2018-07-03. Retrieved 2014-06-20.

Sykes, Bob (June 2010). "Why test bonds?". Global SMT & Packaging magazine. Archived from the original on 2018-07-03. Retrieved 2014-06-20.