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The Intel 2816 uses the FLOTOX structure, which has been discussed in detail in the literaturel. Basically, it utilizes an oxide of less than 200A thick between the floating polysilicon gate and the N+ region as shown in Figure 1.
The initialization procedure (steps 1, 4 and 7), i.e. obtaining the initial written and erased state threshold voltages, involved applying +25 volts for three seconds and -25 volts for three seconds, respectively, at room temperature to the gates of the memory FETs. Source, drain and substrate were all tied to ground during this initialization.
The Intel 2816 uses the FLOTOX structure, which has been discussed in detail in the literaturel. Basically, it utilizes an oxide of less than 200A thick between the floating polysilicon gate and the N+ region as shown in Figure 1.