Analysis of information sources in references of the Wikipedia article "Semiconductor package" in English language version.
Electronic encapsulants may be considered as one kind of sealants: however, most of them are extremely moisture resistant for use as hermetic encapsulants (59). In Table 14, we list the properties of several potential candidates for encapsulants: epoxies, polyimides, polyxylylene, siloxane polyimide, silicones and bisbenzocyclo-butene. Among them, siloxane polyimides and bisbenzocyclobutene are relatively new materials. One of the siloxane polyimides was available from Microsil (60), and bisbenzocyclobutene has been commercialized by Dow Chemical as Cyclotene (61).
