Semiconductor package (English Wikipedia)

Analysis of information sources in references of the Wikipedia article "Semiconductor package" in English language version.

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doi.org

  • Lee, Lieng-Huang (2000). "Adhesive and Sealant Chemistry". Applied Polymer Science: 21st Century. pp. 273–301. doi:10.1016/B978-008043417-9/50017-9. ISBN 978-0-08-043417-9. Electronic encapsulants may be considered as one kind of sealants: however, most of them are extremely moisture resistant for use as hermetic encapsulants (59). In Table 14, we list the properties of several potential candidates for encapsulants: epoxies, polyimides, polyxylylene, siloxane polyimide, silicones and bisbenzocyclo-butene. Among them, siloxane polyimides and bisbenzocyclobutene are relatively new materials. One of the siloxane polyimides was available from Microsil (60), and bisbenzocyclobutene has been commercialized by Dow Chemical as Cyclotene (61).

eetimes.com

nature.com

psu.edu

citeseerx.ist.psu.edu

ti.com

focus.ti.com

  • "Quality & Lead-free (Pb-free): Marking Convention". Texas Instruments. Archived from the original on 2015-10-04. Retrieved August 6, 2015.

vintagecalculators.com

web.archive.org

  • "Quality & Lead-free (Pb-free): Marking Convention". Texas Instruments. Archived from the original on 2015-10-04. Retrieved August 6, 2015.
  • "Intel Bets on Glass for Chip Substrate - EE Times". 16 June 2023. Archived from the original on 2023-06-17. Retrieved 2025-01-08.