Silicon on insulator (English Wikipedia)

Yang-Kyu Choi; Asano, K.; Lindert, N.; Subramanian, V.; Tsu-Jae King; Bokor, J.; Chenming Hu (May 2000). "Ultrathin-body SOI MOSFET for deep-sub-tenth micron era" (PDF). IEEE Electron Device Letters. 21 (5): 254–5. doi:10.1109/IEDM.1999.824298. S2CID 43561939.

books.google.com

Balestra, F. (2016). "1.5 Challenges to Ultralow-Power Semiconductor Device Operation". In Lury, S.; Xu, J.; Zaslavsky, A. (eds.). Future Trends in Microelectronics—Journey into the unknown. Wiley. pp. 69–81. doi:10.1002/9781119069225.ch1-5. ISBN 978-1-119-06922-5.
Reed, Graham T.; Knights, Andrew P. (5 March 2004). Silicon Photonics: An Introduction. Wiley. ISBN 978-0-470-87034-1. Retrieved 22 April 2018 – via Google Books.

charteredsemi.com

Chartered expands foundry market access to IBM's 90nm SOI technology

chip-architect.com

Vries, Hans de. "Chip Architect: Intel and Motorola/AMD's 130 nm processes to be revealed". chip-architect.com. Retrieved 22 April 2018.

cnet.com

"IBM touts chipmaking technology". cnet.com. 29 March 2001. Retrieved 22 April 2018.

doi.org

Celler, G. K.; Cristoloveanu, S. (2003). "Frontiers of silicon-on-insulator". Journal of Applied Physics. 93 (9): 4955. Bibcode:2003JAP....93.4955C. doi:10.1063/1.1558223.
Yang-Kyu Choi; Asano, K.; Lindert, N.; Subramanian, V.; Tsu-Jae King; Bokor, J.; Chenming Hu (May 2000). "Ultrathin-body SOI MOSFET for deep-sub-tenth micron era" (PDF). IEEE Electron Device Letters. 21 (5): 254–5. doi:10.1109/IEDM.1999.824298. S2CID 43561939.
Balestra, F. (2016). "1.5 Challenges to Ultralow-Power Semiconductor Device Operation". In Lury, S.; Xu, J.; Zaslavsky, A. (eds.). Future Trends in Microelectronics—Journey into the unknown. Wiley. pp. 69–81. doi:10.1002/9781119069225.ch1-5. ISBN 978-1-119-06922-5.
Rong, Haisheng; Liu, Ansheng; Jones, Richard; Cohen, Oded; Hak, Dani; Nicolaescu, Remus; Fang, Alexander; Paniccia, Mario (January 2005). "An all-silicon Raman laser" (PDF). Nature. 433 (7042): 292–4. doi:10.1038/nature03723. PMID 15931210. S2CID 4423069.

eetimes.com

"Samsung, GF Ramp FD-SOI". 27 April 2018.

espacenet.com

worldwide.espacenet.com

US 6835633, "SOI wafers with 30-100 Ang. Buried OX created by wafer bonding using 30-100 Ang. thin oxide as bonding layer"
US 7002214, "Ultra-thin body super-steep retrograde well (SSRW) FET devices"
US 7138685, "Vertical MOSFET SRAM cell" describes SOI buried oxide (BOX) structures and methods for implementing enhanced SOI BOX structures
US 5888297, Atsushi Ogura, "Method of fabricating SOI substrate", issued 1999-03-30
US 5061642, Hiroshi Fujioka, "Method of manufacturing semiconductor on insulator", issued 1991-10-29
US 4771016, Bajor, George & et al., "Using a rapid thermal process for manufacturing a wafer bonded soi semiconductor", issued 1988-09-13
US 5417180

fabtech.org

"TSMC has no customer demand for SOI technology". Fabtech: The online information source for semiconductor professionals. Archived from the original on 28 September 2007. Retrieved 22 April 2018.

freescale.com

"NXP Semiconductors - Automotive, Security, IoT". www.freescale.com. Retrieved 22 April 2018.

globenewswire.com

Future, Market Research (2021-02-17). "Silicon on Insulator (SoI) Market is Anticipated to Surpass USD 2.40 Billion By 2026 | APAC Region to Remain Forerunner in Global Silicon on Insulator Industry". GlobeNewswire News Room (Press release). Retrieved 2021-03-07.

harvard.edu

ui.adsabs.harvard.edu

Celler, G. K.; Cristoloveanu, S. (2003). "Frontiers of silicon-on-insulator". Journal of Applied Physics. 93 (9): 4955. Bibcode:2003JAP....93.4955C. doi:10.1063/1.1558223.

infotech-enterprises.com

Kodeti, Narayan M. (October 2010). "Silicon On Insulator (SOI) Implementation" (PDF). White Paper. Infotech. Archived from the original (PDF) on 2013-04-18.

jsap.or.jp

jsapi.jsap.or.jp

Yonehara, T; Sakaguchi, K. "ELTRAN® Novel SOI Wafer Technology" (PDF). Cutting Edge 2. Canon.

mobile-experts.net

Madden, Joe. "Handset RFFEs: MMPAs, Envelope Tracking, Antenna Tuning, FEMs, and MIMO" (PDF). Mobile Experts. Archived from the original (PDF) on 4 March 2016. Retrieved 2 May 2012.

nih.gov

pubmed.ncbi.nlm.nih.gov

Rong, Haisheng; Liu, Ansheng; Jones, Richard; Cohen, Oded; Hak, Dani; Nicolaescu, Remus; Fang, Alexander; Paniccia, Mario (January 2005). "An all-silicon Raman laser" (PDF). Nature. 433 (7042): 292–4. doi:10.1038/nature03723. PMID 15931210. S2CID 4423069.

photonics.com

Rigny, Arnaud. "Silicon-on-Insulator Substrates: The Basis of Silicon Photonics". Photonics.com. Retrieved 7 May 2023.

semanticscholar.org

api.semanticscholar.org

Yang-Kyu Choi; Asano, K.; Lindert, N.; Subramanian, V.; Tsu-Jae King; Bokor, J.; Chenming Hu (May 2000). "Ultrathin-body SOI MOSFET for deep-sub-tenth micron era" (PDF). IEEE Electron Device Letters. 21 (5): 254–5. doi:10.1109/IEDM.1999.824298. S2CID 43561939.
Rong, Haisheng; Liu, Ansheng; Jones, Richard; Cohen, Oded; Hak, Dani; Nicolaescu, Remus; Fang, Alexander; Paniccia, Mario (January 2005). "An all-silicon Raman laser" (PDF). Nature. 433 (7042): 292–4. doi:10.1038/nature03723. PMID 15931210. S2CID 4423069.

semiwiki.com

McLellan, Paul. "Silicon on Insulator (SOI)". Semiwiki. Retrieved 2021-03-07.

sigen.com

"SIGEN.COM". www.sigen.com. Retrieved 22 April 2018.

soiconsortium.org

Mendez, Horacio (April 2009). "Silicon-on-insulator — SOI technology and ecosystem — Emerging SOI applications" (PDF). SOI Industry Consortium.

ucsb.edu

ece.ucsb.edu

Rong, Haisheng; Liu, Ansheng; Jones, Richard; Cohen, Oded; Hak, Dani; Nicolaescu, Remus; Fang, Alexander; Paniccia, Mario (January 2005). "An all-silicon Raman laser" (PDF). Nature. 433 (7042): 292–4. doi:10.1038/nature03723. PMID 15931210. S2CID 4423069.

web.archive.org

Kodeti, Narayan M. (October 2010). "Silicon On Insulator (SOI) Implementation" (PDF). White Paper. Infotech. Archived from the original (PDF) on 2013-04-18.
"TSMC has no customer demand for SOI technology". Fabtech: The online information source for semiconductor professionals. Archived from the original on 28 September 2007. Retrieved 22 April 2018.
Madden, Joe. "Handset RFFEs: MMPAs, Envelope Tracking, Antenna Tuning, FEMs, and MIMO" (PDF). Mobile Experts. Archived from the original (PDF) on 4 March 2016. Retrieved 2 May 2012.