Solder (English Wikipedia)

Analysis of information sources in references of the Wikipedia article "Solder" in English language version.

refsWebsite

Global rank English rank

11books.google.com

3^rd place

5nih.gov

4^th place

4doi.org

2^nd place

3harvard.edu

18^th place

17^th place

3aimsolder.com

low place

2web.archive.org

1^st place

2nasa.gov

75^th place

83^rd place

1lexico.com

1,242^nd place

853^rd place

1semanticscholar.org

11^th place

8^th place

1etymonline.com

287^th place

321^st place

1dfrsolutions.com

low place

1farnell.com

low place

1gpo.gov

1,360^th place

845^th place

1kester.com

low place

1balverzinn.com

low place

1floridacirtech.com

low place

aimsolder.com

"The Fluidity of the Ni-Modified Sn-Cu Eutectic Lead-free Solder" (PDF). Retrieved 2019-09-07.
"Solder selection for photonic packaging". 2013-02-27. Retrieved 20 August 2016.
Keith Sweatman & Tetsuro Nishimura (2006). "The Fluidity of the Ni-Modified Sn-Cu Eutectic Lead-Free Solder" (PDF). Nihon Superior Co., Ltd.

balverzinn.com

"Balver Zinn Desoxy RSN" (PDF). balverzinn.com. Archived from the original (PDF) on 7 July 2011. Retrieved 27 March 2018.

books.google.com

Joseph R. Davis (2001). Alloying: understanding the basics. ASM International. p. 538. ISBN 978-0-87170-744-4.
Howard H. Manko (2001). Solders and soldering: materials, design, production, and analysis for reliable bonding. McGraw-Hill Professional. p. 164. ISBN 978-0-07-134417-3.
A. C. Tan (1989). Lead finishing in semiconductor devices: soldering. World Scientific. p. 45. ISBN 978-9971-5-0679-7.
Madhav Datta; Tetsuya Ōsaka; Joachim Walter Schultze (2005). Microelectronic packaging. CRC Press. p. 196. ISBN 978-0-415-31190-8.
Karl J. Puttlitz; Kathleen A. Stalter (2004). Handbook of lead-free solder technology for microelectronic assemblies. CRC Press. p. 541. ISBN 978-0-8247-4870-8.
Sanka Ganesan; Michael Pecht (2006). Lead-free electronics. Wiley. p. 110. ISBN 978-0-471-78617-7.
Kaushish (2008). Manufacturing Processes. PHI Learning Pvt. Ltd. p. 378. ISBN 978-81-203-3352-9.
I. R. Walker (2011). Reliability in Scientific Research: Improving the Dependability of Measurements, Calculations, Equipment, and Software. Cambridge University Press. pp. 160–. ISBN 978-0-521-85770-3.
Michael Pecht (1993). Soldering processes and equipment. Wiley-IEEE. p. 18. ISBN 978-0-471-59167-2.
D. R. Frear; Steve Burchett; Harold S. Morgan; John H. Lau (1994). The Mechanics of solder alloy interconnects. Springer. p. 51. ISBN 978-0-442-01505-3.
Jennie S. Hwang (1996). Modern solder technology for competitive electronics manufacturing. McGraw-Hill Professional. p. 397. ISBN 978-0-07-031749-9.

dfrsolutions.com

Craig Hillman; Gregg Kittlesen & Randy Schueller. "A New (Better) Approach to Tin Whisker Mitigation" (PDF). DFR Solutions. Retrieved 23 October 2013.

doi.org

Ogunseitan, Oladele A. (2007). "Public health and environmental benefits of adopting lead-free solders". Journal of the Minerals, Metals and Materials Society. 59 (7): 12–17. Bibcode:2007JOM....59g..12O. doi:10.1007/s11837-007-0082-8. S2CID 111017033.
Nan Jiang (2019). "Reliability issues of lead-free solder joints in electronic devices". Science and Technology of Advanced Materials. 20 (1): 876–901. Bibcode:2019STAdM..20..876J. doi:10.1080/14686996.2019.1640072. PMC 6735330. PMID 31528239.
H.L. Needleman; et al. (1990). "The long-term effects of exposure to low doses of lead in childhood. An 11-year follow-up report". The New England Journal of Medicine. 322 (2): 83–8. doi:10.1056/NEJM199001113220203. PMID 2294437.
Meng Zhao, Liang Zhang, Zhi-Quan Liu, Ming-Yue Xiong, and Lei Sun (2019). "Structure and properties of Sn-Cu lead-free solders in electronics packaging". Science and Technology of Advanced Materials. 20 (1): 421–444. Bibcode:2019STAdM..20..421Z. doi:10.1080/14686996.2019.1591168. PMC 6711112. PMID 31489052.{{cite journal}}: CS1 maint: multiple names: authors list (link)

etymonline.com

Harper, Douglas. "solder". Online Etymology Dictionary.

farnell.com

Properties of Solders. farnell.com.

floridacirtech.com

SN100C® Technical Guide. floridacirtech.com

gpo.gov

"U.S. Code: Title 42. The Public Health and Welfare" (PDF). govinfo.gov. p. 990.

harvard.edu

ui.adsabs.harvard.edu

Ogunseitan, Oladele A. (2007). "Public health and environmental benefits of adopting lead-free solders". Journal of the Minerals, Metals and Materials Society. 59 (7): 12–17. Bibcode:2007JOM....59g..12O. doi:10.1007/s11837-007-0082-8. S2CID 111017033.
Nan Jiang (2019). "Reliability issues of lead-free solder joints in electronic devices". Science and Technology of Advanced Materials. 20 (1): 876–901. Bibcode:2019STAdM..20..876J. doi:10.1080/14686996.2019.1640072. PMC 6735330. PMID 31528239.
Meng Zhao, Liang Zhang, Zhi-Quan Liu, Ming-Yue Xiong, and Lei Sun (2019). "Structure and properties of Sn-Cu lead-free solders in electronics packaging". Science and Technology of Advanced Materials. 20 (1): 421–444. Bibcode:2019STAdM..20..421Z. doi:10.1080/14686996.2019.1591168. PMC 6711112. PMID 31489052.{{cite journal}}: CS1 maint: multiple names: authors list (link)

kester.com

Peter Biocca (19 April 2006). "Lead-free Hand-soldering – Ending the Nightmares" (PDF). Kester. Retrieved 20 October 2019.

lexico.com

"solder". Lexico UK English Dictionary. Oxford University Press. Archived from the original on January 10, 2022.

nasa.gov

nepp.nasa.gov

"Basic Info on Tin Whiskers". nepp.nasa.gov. Retrieved 27 March 2018.
Indium Solder Encapsulating Gold Bonding Wire Leads to Fragile Gold-Indium Compounds and an Unreliable Condition that Results in Wire Interconnection Rupture. GSFC NASA Advisory]. (PDF). Retrieved on 2019-03-09.

nih.gov

pubmed.ncbi.nlm.nih.gov

Nan Jiang (2019). "Reliability issues of lead-free solder joints in electronic devices". Science and Technology of Advanced Materials. 20 (1): 876–901. Bibcode:2019STAdM..20..876J. doi:10.1080/14686996.2019.1640072. PMC 6735330. PMID 31528239.
H.L. Needleman; et al. (1990). "The long-term effects of exposure to low doses of lead in childhood. An 11-year follow-up report". The New England Journal of Medicine. 322 (2): 83–8. doi:10.1056/NEJM199001113220203. PMID 2294437.
Meng Zhao, Liang Zhang, Zhi-Quan Liu, Ming-Yue Xiong, and Lei Sun (2019). "Structure and properties of Sn-Cu lead-free solders in electronics packaging". Science and Technology of Advanced Materials. 20 (1): 421–444. Bibcode:2019STAdM..20..421Z. doi:10.1080/14686996.2019.1591168. PMC 6711112. PMID 31489052.{{cite journal}}: CS1 maint: multiple names: authors list (link)

ncbi.nlm.nih.gov

Nan Jiang (2019). "Reliability issues of lead-free solder joints in electronic devices". Science and Technology of Advanced Materials. 20 (1): 876–901. Bibcode:2019STAdM..20..876J. doi:10.1080/14686996.2019.1640072. PMC 6735330. PMID 31528239.
Meng Zhao, Liang Zhang, Zhi-Quan Liu, Ming-Yue Xiong, and Lei Sun (2019). "Structure and properties of Sn-Cu lead-free solders in electronics packaging". Science and Technology of Advanced Materials. 20 (1): 421–444. Bibcode:2019STAdM..20..421Z. doi:10.1080/14686996.2019.1591168. PMC 6711112. PMID 31489052.{{cite journal}}: CS1 maint: multiple names: authors list (link)

semanticscholar.org

api.semanticscholar.org

Ogunseitan, Oladele A. (2007). "Public health and environmental benefits of adopting lead-free solders". Journal of the Minerals, Metals and Materials Society. 59 (7): 12–17. Bibcode:2007JOM....59g..12O. doi:10.1007/s11837-007-0082-8. S2CID 111017033.

web.archive.org

"solder". Lexico UK English Dictionary. Oxford University Press. Archived from the original on January 10, 2022.
"Balver Zinn Desoxy RSN" (PDF). balverzinn.com. Archived from the original (PDF) on 7 July 2011. Retrieved 27 March 2018.