Solder paste (English Wikipedia)

Analysis of information sources in references of the Wikipedia article "Solder paste" in English language version.

refsWebsite

Global rank English rank

5web.archive.org

1^st place

1^st place

1yamaha-motor.com

9,849^th place

low place

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low place

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14^th place

14^th place

low place

low place

1henkel-dam.com

low place

low place

1slideshare.net

2,161^st place

2,535^th place

1all-electronics.de

low place

low place

all-electronics.de

Robles Consée, Marisa (2015). "Marktübersicht SPI-Systeme – Den optimalen Lotpasten-Druckprozess im Visier" (PDF). Productronic (in German). 2015 (7): 42–45. 450pr0715. Archived (PDF) from the original on 2018-06-18. Retrieved 2018-06-18.

ami.ac.uk

Tarr, Martin (2006-10-03). "Solder paste basics". Online postgraduate courses for the electronics industry. UK: University of Bolton. Archived from the original on 2010-11-12. Retrieved 2010-10-03. [1]

archive.today

Tarr, Martin (2006-10-03). "Solder paste basics". Online postgraduate courses for the electronics industry. UK: University of Bolton. Archived from the original on 2010-11-12. Retrieved 2010-10-03. [1]

henkel-dam.com

dm.henkel-dam.com

Wilding, Ian (2016-02-08). "First-Ever Temperature Stable Solder Paste Unveiled – Major Development in Solder Paste Formulation Set to Change Market Paradigms". Henkel Electronics. The Electronics Group of Henkel. Archived (PDF) from the original on 2016-03-02. Retrieved 2021-02-25.

henkel.com

tds.us.henkel.com

"Technical Data Sheet LOCTITE HF 212" (PDF). Henkel. June 2016.

ipc.org

portal.ipc.org

Solder Paste Task Group (January 1995). "J-STD-005 Requirements for Soldering Pastes". Arlington, Virginia: Electronic Industries Alliance (EIA) and IPC.

slideshare.net

Alpha (2010-03-15) [September 2009]. "Reducing Head in Pillow Defects – Head in pillow defects: causes and potential solutions". 3. Archived from the original on 2013-12-03. Retrieved 2018-06-18.

te.com

"Solder Volumes for Through-Hole Reflow-Compatible Connectors" (PDF). Tyco Electronics Corporation. Archived (PDF) from the original on 2018-06-18. Retrieved 2016-08-29.

web.archive.org

"Solder Volumes for Through-Hole Reflow-Compatible Connectors" (PDF). Tyco Electronics Corporation. Archived (PDF) from the original on 2018-06-18. Retrieved 2016-08-29.
Tarr, Martin (2006-10-03). "Solder paste basics". Online postgraduate courses for the electronics industry. UK: University of Bolton. Archived from the original on 2010-11-12. Retrieved 2010-10-03. [1]
Wilding, Ian (2016-02-08). "First-Ever Temperature Stable Solder Paste Unveiled – Major Development in Solder Paste Formulation Set to Change Market Paradigms". Henkel Electronics. The Electronics Group of Henkel. Archived (PDF) from the original on 2016-03-02. Retrieved 2021-02-25.
Alpha (2010-03-15) [September 2009]. "Reducing Head in Pillow Defects – Head in pillow defects: causes and potential solutions". 3. Archived from the original on 2013-12-03. Retrieved 2018-06-18.
Robles Consée, Marisa (2015). "Marktübersicht SPI-Systeme – Den optimalen Lotpasten-Druckprozess im Visier" (PDF). Productronic (in German). 2015 (7): 42–45. 450pr0715. Archived (PDF) from the original on 2018-06-18. Retrieved 2018-06-18.

yamaha-motor.com

global.yamaha-motor.com

"Solder-Paste Printer". Yamaha Motor Co., Ltd.