Sputter deposition (English Wikipedia)

Analysis of information sources in references of the Wikipedia article "Sputter deposition" in English language version.

refsWebsite

Global rank English rank

14doi.org

2^nd place

10harvard.edu

18^th place

17^th place

4worldcat.org

5^th place

4semanticscholar.org

11^th place

8^th place

3sciencedirect.com

149^th place

178^th place

2mariobirkholz.de

low place

1sputtertargets.net

low place

1phys.org

1,283^rd place

1,130^th place

1books.google.com

3^rd place

books.google.com

Bernhard Wolf (1995). Handbook of ion sources. CRC Press. p. 222. ISBN 978-0-8493-2502-1.

doi.org

Gregoire, J. M.; Lobovsky, M. B.; Heinz, M. F.; DiSalvo, F. J.; van Dover, R. B. (26 November 2007). "Resputtering phenomena and determination of composition in codeposited films". Physical Review B. 76 (19): 195437. Bibcode:2007PhRvB..76s5437G. doi:10.1103/PhysRevB.76.195437.
Kester, Daniel J.; Messier, Russell (1 August 1993). "Macro-effects of resputtering due to negative ion bombardment of growing thin films". Journal of Materials Research. 8 (8): 1928–1937. Bibcode:1993JMatR...8.1928K. doi:10.1557/JMR.1993.1928. ISSN 2044-5326. S2CID 221977398.
Vilcot, J.P.; Ayachi, B. (2017). "Full Sputtering Deposition of Thin Film Solar Cells: A Way of Achieving High Efficiency Sustainable Tandem Cells?". Journal of Electronic Materials. 46: 6523–6527. doi:10.1007/s11664-017-5694-3.
Rashidian Vaziri, M R; et al. (2010). "Microscopic description of the thermalization process during pulsed laser deposition of aluminium in the presence of argon background gas". Journal of Physics D: Applied Physics. 43 (42): 425205. Bibcode:2010JPhD...43P5205R. doi:10.1088/0022-3727/43/42/425205. S2CID 120309363.
Rashidian Vaziri, M R; et al. (2011). "Monte Carlo simulation of the subsurface growth mode during pulsed laser deposition". Journal of Applied Physics. 110 (4): 043304–043304–12. Bibcode:2011JAP...110d3304R. doi:10.1063/1.3624768.
Safi, I. (2000-05-22). "Recent aspects concerning DC reactive magnetron sputtering of thin films: a review". Surface and Coatings Technology. 127 (2): 203–218. doi:10.1016/S0257-8972(00)00566-1. ISSN 0257-8972.
Sproul, W. D.; Christie, D. J.; Carter, D. C. (2005-11-22). "Control of reactive sputtering processes". Thin Solid Films. 491 (1): 1–17. Bibcode:2005TSF...491....1S. doi:10.1016/j.tsf.2005.05.022. ISSN 0040-6090.
Berg, S.; Nyberg, T. (2005-04-08). "Fundamental understanding and modeling of reactive sputtering processes". Thin Solid Films. 476 (2): 215–230. Bibcode:2005TSF...476..215B. doi:10.1016/j.tsf.2004.10.051. ISSN 0040-6090.
K. Ishii (1989). "High-rate low kinetic energy gas-flow-sputtering system". Journal of Vacuum Science and Technology A. 7 (2): 256–258. Bibcode:1989JVSTA...7..256I. doi:10.1116/1.576129.
T. Jung & A. Westphal (1991). "Zirconia thin film deposition on silicon by reactive gas flow sputtering: the influence of low energy particle bombardment". Mater. Sci. Eng. A. 140: 528–533. doi:10.1016/0921-5093(91)90474-2.
K. Ortner; M. Birkholz & T. Jung (2003). "Neue Entwicklungen beim Hohlkatoden-Gasflusssputtern" (PDF). Vac. Praxis (in German). 15 (5): 236–239. doi:10.1002/vipr.200300196. S2CID 108638584.
J.A. Thornton (1974). "Influence of apparatus geometry and deposition conditions on the structure and topography of thick sputtered coatings". Journal of Vacuum Science and Technology. 11 (4): 666–670. Bibcode:1974JVST...11..666T. doi:10.1116/1.1312732.
H. Windischman (1992). "Intrinsic stress in sputter-deposited thin film". Crit. Rev. Sol. St. Mat. Sci. 17 (6): 547–596. Bibcode:1992CRSSM..17..547W. doi:10.1080/10408439208244586. S2CID 94349281.
M. Birkholz; C. Genzel & T. Jung (2004). "X-ray diffraction study of residual stress and preferred orientation in thin titanium films subjected to a high ion flux during deposition" (PDF). J. Appl. Phys. 96 (12): 7202–7211. Bibcode:2004JAP....96.7202B. doi:10.1063/1.1814413.

harvard.edu

ui.adsabs.harvard.edu

Gregoire, J. M.; Lobovsky, M. B.; Heinz, M. F.; DiSalvo, F. J.; van Dover, R. B. (26 November 2007). "Resputtering phenomena and determination of composition in codeposited films". Physical Review B. 76 (19): 195437. Bibcode:2007PhRvB..76s5437G. doi:10.1103/PhysRevB.76.195437.
Kester, Daniel J.; Messier, Russell (1 August 1993). "Macro-effects of resputtering due to negative ion bombardment of growing thin films". Journal of Materials Research. 8 (8): 1928–1937. Bibcode:1993JMatR...8.1928K. doi:10.1557/JMR.1993.1928. ISSN 2044-5326. S2CID 221977398.
Rashidian Vaziri, M R; et al. (2010). "Microscopic description of the thermalization process during pulsed laser deposition of aluminium in the presence of argon background gas". Journal of Physics D: Applied Physics. 43 (42): 425205. Bibcode:2010JPhD...43P5205R. doi:10.1088/0022-3727/43/42/425205. S2CID 120309363.
Rashidian Vaziri, M R; et al. (2011). "Monte Carlo simulation of the subsurface growth mode during pulsed laser deposition". Journal of Applied Physics. 110 (4): 043304–043304–12. Bibcode:2011JAP...110d3304R. doi:10.1063/1.3624768.
Sproul, W. D.; Christie, D. J.; Carter, D. C. (2005-11-22). "Control of reactive sputtering processes". Thin Solid Films. 491 (1): 1–17. Bibcode:2005TSF...491....1S. doi:10.1016/j.tsf.2005.05.022. ISSN 0040-6090.
Berg, S.; Nyberg, T. (2005-04-08). "Fundamental understanding and modeling of reactive sputtering processes". Thin Solid Films. 476 (2): 215–230. Bibcode:2005TSF...476..215B. doi:10.1016/j.tsf.2004.10.051. ISSN 0040-6090.
K. Ishii (1989). "High-rate low kinetic energy gas-flow-sputtering system". Journal of Vacuum Science and Technology A. 7 (2): 256–258. Bibcode:1989JVSTA...7..256I. doi:10.1116/1.576129.
J.A. Thornton (1974). "Influence of apparatus geometry and deposition conditions on the structure and topography of thick sputtered coatings". Journal of Vacuum Science and Technology. 11 (4): 666–670. Bibcode:1974JVST...11..666T. doi:10.1116/1.1312732.
H. Windischman (1992). "Intrinsic stress in sputter-deposited thin film". Crit. Rev. Sol. St. Mat. Sci. 17 (6): 547–596. Bibcode:1992CRSSM..17..547W. doi:10.1080/10408439208244586. S2CID 94349281.
M. Birkholz; C. Genzel & T. Jung (2004). "X-ray diffraction study of residual stress and preferred orientation in thin titanium films subjected to a high ion flux during deposition" (PDF). J. Appl. Phys. 96 (12): 7202–7211. Bibcode:2004JAP....96.7202B. doi:10.1063/1.1814413.

mariobirkholz.de

K. Ortner; M. Birkholz & T. Jung (2003). "Neue Entwicklungen beim Hohlkatoden-Gasflusssputtern" (PDF). Vac. Praxis (in German). 15 (5): 236–239. doi:10.1002/vipr.200300196. S2CID 108638584.
M. Birkholz; C. Genzel & T. Jung (2004). "X-ray diffraction study of residual stress and preferred orientation in thin titanium films subjected to a high ion flux during deposition" (PDF). J. Appl. Phys. 96 (12): 7202–7211. Bibcode:2004JAP....96.7202B. doi:10.1063/1.1814413.

phys.org

"High-quality superconducting qubits fabricated with CMOS-compatible technologies". August 19, 2022.

sciencedirect.com

Safi, I. (2000-05-22). "Recent aspects concerning DC reactive magnetron sputtering of thin films: a review". Surface and Coatings Technology. 127 (2): 203–218. doi:10.1016/S0257-8972(00)00566-1. ISSN 0257-8972.
Sproul, W. D.; Christie, D. J.; Carter, D. C. (2005-11-22). "Control of reactive sputtering processes". Thin Solid Films. 491 (1): 1–17. Bibcode:2005TSF...491....1S. doi:10.1016/j.tsf.2005.05.022. ISSN 0040-6090.
Berg, S.; Nyberg, T. (2005-04-08). "Fundamental understanding and modeling of reactive sputtering processes". Thin Solid Films. 476 (2): 215–230. Bibcode:2005TSF...476..215B. doi:10.1016/j.tsf.2004.10.051. ISSN 0040-6090.

semanticscholar.org

api.semanticscholar.org

Kester, Daniel J.; Messier, Russell (1 August 1993). "Macro-effects of resputtering due to negative ion bombardment of growing thin films". Journal of Materials Research. 8 (8): 1928–1937. Bibcode:1993JMatR...8.1928K. doi:10.1557/JMR.1993.1928. ISSN 2044-5326. S2CID 221977398.
Rashidian Vaziri, M R; et al. (2010). "Microscopic description of the thermalization process during pulsed laser deposition of aluminium in the presence of argon background gas". Journal of Physics D: Applied Physics. 43 (42): 425205. Bibcode:2010JPhD...43P5205R. doi:10.1088/0022-3727/43/42/425205. S2CID 120309363.
K. Ortner; M. Birkholz & T. Jung (2003). "Neue Entwicklungen beim Hohlkatoden-Gasflusssputtern" (PDF). Vac. Praxis (in German). 15 (5): 236–239. doi:10.1002/vipr.200300196. S2CID 108638584.
H. Windischman (1992). "Intrinsic stress in sputter-deposited thin film". Crit. Rev. Sol. St. Mat. Sci. 17 (6): 547–596. Bibcode:1992CRSSM..17..547W. doi:10.1080/10408439208244586. S2CID 94349281.

sputtertargets.net

Green, Julissa (Apr 23, 2024). "An Overview of Sputtering Deposition". Sputter Targets. Retrieved Aug 1, 2024.

worldcat.org

search.worldcat.org

Kester, Daniel J.; Messier, Russell (1 August 1993). "Macro-effects of resputtering due to negative ion bombardment of growing thin films". Journal of Materials Research. 8 (8): 1928–1937. Bibcode:1993JMatR...8.1928K. doi:10.1557/JMR.1993.1928. ISSN 2044-5326. S2CID 221977398.
Safi, I. (2000-05-22). "Recent aspects concerning DC reactive magnetron sputtering of thin films: a review". Surface and Coatings Technology. 127 (2): 203–218. doi:10.1016/S0257-8972(00)00566-1. ISSN 0257-8972.
Sproul, W. D.; Christie, D. J.; Carter, D. C. (2005-11-22). "Control of reactive sputtering processes". Thin Solid Films. 491 (1): 1–17. Bibcode:2005TSF...491....1S. doi:10.1016/j.tsf.2005.05.022. ISSN 0040-6090.
Berg, S.; Nyberg, T. (2005-04-08). "Fundamental understanding and modeling of reactive sputtering processes". Thin Solid Films. 476 (2): 215–230. Bibcode:2005TSF...476..215B. doi:10.1016/j.tsf.2004.10.051. ISSN 0040-6090.