Thermal conductance and resistance (English Wikipedia)

Analysis of information sources in references of the Wikipedia article "Thermal conductance and resistance" in English language version.

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Ho-Ming Tong; Yi-Shao Lai; C.P. Wong (2013). Advanced Flip Chip Packaging. Springer Science & Business Media. pp. 460–461. ISBN 978-1-4419-5768-9.

Lasance, C. J. M. (2008). "Ten Years of Boundary-Condition- Independent Compact Thermal Modeling of Electronic Parts: A Review". Heat Transfer Engineering. 29 (2): 149–168. Bibcode:2008HTrEn..29..149L. doi:10.1080/01457630701673188. S2CID 121803741.
Schweitzer, D.; Pape, H.; Chen, L.; Kutscherauer, R.; Walder, M. (2011). "Transient dual interface measurement — A new JEDEC standard for the measurement of the junction-to-case thermal resistance". 2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium. p. 222. doi:10.1109/STHERM.2011.5767204. ISBN 978-1-61284-740-5.