Thermal interface material (English Wikipedia)

Analysis of information sources in references of the Wikipedia article "Thermal interface material" in English language version.

refsWebsite

Global rank English rank

4doi.org

2^nd place

2semanticscholar.org

11^th place

8^th place

2nih.gov

4^th place

1harvard.edu

18^th place

17^th place

1laird.com

low place

1indium.com

low place

doi.org (Global: 2^nd place; English: 2^nd place)

Cui, Y.; Li, M.; Hu, Y. (2020). "Emerging interface materials for electronics thermal management: experiments, modeling, and new opportunities". Journal of Materials Chemistry C. 8 (31): 10568–10586. doi:10.1039/C9TC05415D.
Kearney, Andrew; Li, Li; Sanford, Sean (2009). "Interaction between TIM1 and TIM2 for mechanical robustness of integrated heat spreader". 2009 25th Annual IEEE Semiconductor Thermal Measurement and Management Symposium. pp. 293–298. doi:10.1109/STHERM.2009.4810778. ISBN 978-1-4244-3664-4. S2CID 29501079.
Liu, Johan; Michel, Bruno; Rencz, Marta; Tantolin, Christian; Sarno, Claude; Miessner, Ralf; Schuett, Klaus-Volker; Tang, Xinhe; Demoustier, Sebastien (2008). "Recent progress of thermal interface material research - an overview". 2008 14th International Workshop on Thermal Inveatigation of ICs and Systems. pp. 156–162. doi:10.1109/THERMINIC.2008.4669900. ISBN 978-1-4244-3365-0. S2CID 40595787.
Bartlett, Michael; Kazem, Navid; Powell-Palm, MAtthew; Huang, Xiaonan; Sun, Wenhuan; Malen, Jonathan; Majidi, Carmel (2017). "High thermal conductivity in soft elastomers with elongated liquid metal inclusions". Proceedings of the National Academy of Sciences. 114 (9): 2143–2148. Bibcode:2017PNAS..114.2143B. doi:10.1073/pnas.1616377114. PMC 5338550. PMID 28193902.

harvard.edu (Global: 18^th place; English: 17^th place)

ui.adsabs.harvard.edu

Bartlett, Michael; Kazem, Navid; Powell-Palm, MAtthew; Huang, Xiaonan; Sun, Wenhuan; Malen, Jonathan; Majidi, Carmel (2017). "High thermal conductivity in soft elastomers with elongated liquid metal inclusions". Proceedings of the National Academy of Sciences. 114 (9): 2143–2148. Bibcode:2017PNAS..114.2143B. doi:10.1073/pnas.1616377114. PMC 5338550. PMID 28193902.

indium.com (Global: low place; English: low place)

"Phase Change Metal TIMs | Thermal Interface Materials". indiumcorporation.

laird.com (Global: low place; English: low place)

"Phase Change". Laird Technologies.

nih.gov (Global: 4^th place; English: 4^th place)

ncbi.nlm.nih.gov

Bartlett, Michael; Kazem, Navid; Powell-Palm, MAtthew; Huang, Xiaonan; Sun, Wenhuan; Malen, Jonathan; Majidi, Carmel (2017). "High thermal conductivity in soft elastomers with elongated liquid metal inclusions". Proceedings of the National Academy of Sciences. 114 (9): 2143–2148. Bibcode:2017PNAS..114.2143B. doi:10.1073/pnas.1616377114. PMC 5338550. PMID 28193902.

pubmed.ncbi.nlm.nih.gov

Bartlett, Michael; Kazem, Navid; Powell-Palm, MAtthew; Huang, Xiaonan; Sun, Wenhuan; Malen, Jonathan; Majidi, Carmel (2017). "High thermal conductivity in soft elastomers with elongated liquid metal inclusions". Proceedings of the National Academy of Sciences. 114 (9): 2143–2148. Bibcode:2017PNAS..114.2143B. doi:10.1073/pnas.1616377114. PMC 5338550. PMID 28193902.

semanticscholar.org (Global: 11^th place; English: 8^th place)

api.semanticscholar.org

Kearney, Andrew; Li, Li; Sanford, Sean (2009). "Interaction between TIM1 and TIM2 for mechanical robustness of integrated heat spreader". 2009 25th Annual IEEE Semiconductor Thermal Measurement and Management Symposium. pp. 293–298. doi:10.1109/STHERM.2009.4810778. ISBN 978-1-4244-3664-4. S2CID 29501079.
Liu, Johan; Michel, Bruno; Rencz, Marta; Tantolin, Christian; Sarno, Claude; Miessner, Ralf; Schuett, Klaus-Volker; Tang, Xinhe; Demoustier, Sebastien (2008). "Recent progress of thermal interface material research - an overview". 2008 14th International Workshop on Thermal Inveatigation of ICs and Systems. pp. 156–162. doi:10.1109/THERMINIC.2008.4669900. ISBN 978-1-4244-3365-0. S2CID 40595787.