Thermal management of high-power LEDs (English Wikipedia)

Martin, Genevieve; Linnartz, Jean-Paul; Onushkin, Grigory; Alexeev, Anton (January 2019). "Multiple Heat Source Thermal Modeling and Transient Analysis of LEDs". Energies. 12 (10): 1860. doi:10.3390/en12101860.
Alexeev, A.; Martin, G.; Onushkin, G. (2018-08-01). "Multiple heat path dynamic thermal compact modeling for silicone encapsulated LEDs". Microelectronics Reliability. 87: 89–96. Bibcode:2018MiRe...87...89A. doi:10.1016/j.microrel.2018.05.014. ISSN 0026-2714. S2CID 51942748.
Cui, Ying; Qin, Zihao; Wu, Huan; Li, Man; Hu, Yongjie (2021). "Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management". Nature Communications. 12 (1): 1284. Bibcode:2021NatCo..12.1284C. doi:10.1038/s41467-021-21531-7. PMC 7904764. PMID 33627644..
Jen-Hau Cheng; Chun-Kai Liu; Yu-Lin Chao; Ra-Min Tain (June 2005). "Cooling performance of silicon-based thermoelectric device on high power LED". ICT 2005. 24th International Conference on Thermoelectrics, 2005. pp. 53–56. doi:10.1109/ICT.2005.1519885. ISBN 0-7803-9552-2. S2CID 8190660.
Snyder, G. Jeffrey; Lim, James R.; Huang, Chen-Kuo; Fleurial, Jean-Pierre (August 2003). "Thermoelectric microdevice fabricated by a MEMS-like electrochemical process". Nature Materials. 2 (8): 528–531. Bibcode:2003NatMa...2..528S. doi:10.1038/nmat943. ISSN 1476-4660. PMID 12883550. S2CID 6287809.
Christensen, Adam; Graham, Samuel (2009-02-01). "Thermal effects in packaging high power light emitting diode arrays". Applied Thermal Engineering. 29 (2): 364–371. Bibcode:2009AppTE..29..364C. doi:10.1016/j.applthermaleng.2008.03.019. ISSN 1359-4311.
Deng, Yueguang; Liu, Jing (2010-08-01). "A liquid metal cooling system for the thermal management of high power LEDs". International Communications in Heat and Mass Transfer. 37 (7): 788–791. Bibcode:2010ICHMT..37..788D. doi:10.1016/j.icheatmasstransfer.2010.04.011. ISSN 0735-1933.

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Alexeev, A.; Martin, G.; Onushkin, G. (2018-08-01). "Multiple heat path dynamic thermal compact modeling for silicone encapsulated LEDs". Microelectronics Reliability. 87: 89–96. Bibcode:2018MiRe...87...89A. doi:10.1016/j.microrel.2018.05.014. ISSN 0026-2714. S2CID 51942748.
Cui, Ying; Qin, Zihao; Wu, Huan; Li, Man; Hu, Yongjie (2021). "Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management". Nature Communications. 12 (1): 1284. Bibcode:2021NatCo..12.1284C. doi:10.1038/s41467-021-21531-7. PMC 7904764. PMID 33627644..
Snyder, G. Jeffrey; Lim, James R.; Huang, Chen-Kuo; Fleurial, Jean-Pierre (August 2003). "Thermoelectric microdevice fabricated by a MEMS-like electrochemical process". Nature Materials. 2 (8): 528–531. Bibcode:2003NatMa...2..528S. doi:10.1038/nmat943. ISSN 1476-4660. PMID 12883550. S2CID 6287809.
Christensen, Adam; Graham, Samuel (2009-02-01). "Thermal effects in packaging high power light emitting diode arrays". Applied Thermal Engineering. 29 (2): 364–371. Bibcode:2009AppTE..29..364C. doi:10.1016/j.applthermaleng.2008.03.019. ISSN 1359-4311.
Deng, Yueguang; Liu, Jing (2010-08-01). "A liquid metal cooling system for the thermal management of high power LEDs". International Communications in Heat and Mass Transfer. 37 (7): 788–791. Bibcode:2010ICHMT..37..788D. doi:10.1016/j.icheatmasstransfer.2010.04.011. ISSN 0735-1933.

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Cui, Ying; Qin, Zihao; Wu, Huan; Li, Man; Hu, Yongjie (2021). "Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management". Nature Communications. 12 (1): 1284. Bibcode:2021NatCo..12.1284C. doi:10.1038/s41467-021-21531-7. PMC 7904764. PMID 33627644..
Snyder, G. Jeffrey; Lim, James R.; Huang, Chen-Kuo; Fleurial, Jean-Pierre (August 2003). "Thermoelectric microdevice fabricated by a MEMS-like electrochemical process". Nature Materials. 2 (8): 528–531. Bibcode:2003NatMa...2..528S. doi:10.1038/nmat943. ISSN 1476-4660. PMID 12883550. S2CID 6287809.

ncbi.nlm.nih.gov

Cui, Ying; Qin, Zihao; Wu, Huan; Li, Man; Hu, Yongjie (2021). "Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management". Nature Communications. 12 (1): 1284. Bibcode:2021NatCo..12.1284C. doi:10.1038/s41467-021-21531-7. PMC 7904764. PMID 33627644..

semanticscholar.org

api.semanticscholar.org

Alexeev, A.; Martin, G.; Onushkin, G. (2018-08-01). "Multiple heat path dynamic thermal compact modeling for silicone encapsulated LEDs". Microelectronics Reliability. 87: 89–96. Bibcode:2018MiRe...87...89A. doi:10.1016/j.microrel.2018.05.014. ISSN 0026-2714. S2CID 51942748.
Jen-Hau Cheng; Chun-Kai Liu; Yu-Lin Chao; Ra-Min Tain (June 2005). "Cooling performance of silicon-based thermoelectric device on high power LED". ICT 2005. 24th International Conference on Thermoelectrics, 2005. pp. 53–56. doi:10.1109/ICT.2005.1519885. ISBN 0-7803-9552-2. S2CID 8190660.
Snyder, G. Jeffrey; Lim, James R.; Huang, Chen-Kuo; Fleurial, Jean-Pierre (August 2003). "Thermoelectric microdevice fabricated by a MEMS-like electrochemical process". Nature Materials. 2 (8): 528–531. Bibcode:2003NatMa...2..528S. doi:10.1038/nmat943. ISSN 1476-4660. PMID 12883550. S2CID 6287809.

wikipedia.org

en.wikipedia.org

"Thermoelectric effect", Wikipedia, 2019-11-25, retrieved 2019-11-26

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Alexeev, A.; Martin, G.; Onushkin, G. (2018-08-01). "Multiple heat path dynamic thermal compact modeling for silicone encapsulated LEDs". Microelectronics Reliability. 87: 89–96. Bibcode:2018MiRe...87...89A. doi:10.1016/j.microrel.2018.05.014. ISSN 0026-2714. S2CID 51942748.
Snyder, G. Jeffrey; Lim, James R.; Huang, Chen-Kuo; Fleurial, Jean-Pierre (August 2003). "Thermoelectric microdevice fabricated by a MEMS-like electrochemical process". Nature Materials. 2 (8): 528–531. Bibcode:2003NatMa...2..528S. doi:10.1038/nmat943. ISSN 1476-4660. PMID 12883550. S2CID 6287809.
Christensen, Adam; Graham, Samuel (2009-02-01). "Thermal effects in packaging high power light emitting diode arrays". Applied Thermal Engineering. 29 (2): 364–371. Bibcode:2009AppTE..29..364C. doi:10.1016/j.applthermaleng.2008.03.019. ISSN 1359-4311.
Deng, Yueguang; Liu, Jing (2010-08-01). "A liquid metal cooling system for the thermal management of high power LEDs". International Communications in Heat and Mass Transfer. 37 (7): 788–791. Bibcode:2010ICHMT..37..788D. doi:10.1016/j.icheatmasstransfer.2010.04.011. ISSN 0735-1933.