Thermocompression bonding (English Wikipedia)

Analysis of information sources in references of the Wikipedia article "Thermocompression bonding" in English language version.

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Farrens, S. (2008). "Wafer-Bonding Technologies and Strategies for 3D ICs". In Tan, C. S.; Gutmann, R. J.; Reif, L. R. (eds.). Wafer Level 3-D ICs Process Technology. Integrated Circuits and Systems. Springer US. pp. 49–85. doi:10.1007/978-0-387-76534-1.
Jung, E. and Ostmann, A. and Wiemer, M. and Kolesnik, I. and Hutter, M. (2003). "Soldered sealing process to assemble a protective cap for a MEMS CSP". Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. pp. 255–260. doi:10.1109/DTIP.2003.1287047.{{cite conference}}: CS1 maint: multiple names: authors list (link)
Shimatsu, T. & Uomoto, M. (2010). "Atomic diffusion bonding of wafers with thin nanocrystalline metal films". Journal of Vacuum Science and Technology B. 28 (4): 706–714. doi:10.1116/1.3437515.
Wiemer, M. and Frömel, J. and Chenping, J. and Haubold, M. and Gessner, T. (2008). "Waferbond technologies and quality assessment". 58th Electronic Components and Technology Conference (ECTC). pp. 319–324. doi:10.1109/ECTC.2008.4549989.{{cite conference}}: CS1 maint: multiple names: authors list (link)
Tsau, C. H. and Spearing, S. M. and Schmidt, M. A. (2004). "Characterization of wafer-level thermocompression bonds". Journal of Microelectromechanical Systems. 13 (6): 963–971. doi:10.1109/JMEMS.2004.838393.{{cite journal}}: CS1 maint: multiple names: authors list (link)

Farrens, Shari & Sood, Sumant (2008). "Wafer Level Packaging: Balancing Device Requirements and Materials Properties" (PDF). IMAPS. International Microelectronics and Packaging Society.