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Burmeister, L.; Reimer, D.; Schilling, M. (1994). "Thermosonic bond contacts with gold wire to YBa2Cu3O7 microstructures". Superconductor Science and Technology. 7 (8): 569. Bibcode:1994SuScT...7..569B. doi:10.1088/0953-2048/7/8/006.
Coucoulas, A., "Hot Work Ultrasonic Bonding – A Method Of Facilitating Metal Flow By Restoration Processes", Proc. 20th IEEE Electronic Components Conf. Washington, D.C., May 1970, pp. 549–556.https://sites.google.com/site/hotworkultrasonicbonding