Wafer-level packaging (English Wikipedia)

Analysis of information sources in references of the Wikipedia article "Wafer-level packaging" in English language version.

refsWebsite

Global rank English rank

3semiengineering.com

low place

low place

2web.archive.org

1^st place

1^st place

low place

low place

4,756^th place

2,900^th place

7,049^th place

4,298^th place

low place

8,784^th place

1statschippac.com

low place

low place

1anysilicon.com

low place

low place

786^th place

558^th place

anysilicon.com (Global: low place; English: low place)

"WLCSP Overview, Market and Applications". November 11, 2018.

bgr.com (Global: 7,049^th place; English: 4,298^th place)

By Yoni Heisler, BGR. “Report details new tech Apple is using to make the iPhone 7 thinner and lighter.” March 31, 2016. Retrieved April 14, 2016.

nxp.com (Global: low place; English: 8,784^th place)

"Wafer Level Chip Scale Package (WLCSP)" (PDF). www.nxp.com. Retrieved 2023-11-19.

semiengineering.com (Global: low place; English: low place)

By Mark LaPedus, Semiconductor Engineering. “Fan-Out Packaging Gains Steam.” November 23, 2015. Retrieved May 23, 2016.
"Improving Redistribution Layers for Fan-out Packages and SiPs". 15 September 2022.
"Fan-Out Wars Begin". 5 February 2018.

semimd.com (Global: low place; English: low place)

Korczynski, Ed (May 5, 2014). "Wafer-level packaging of ICs for mobile systems of the future". Semiconductor Manufacturing & Design Community. Archived from the original on August 16, 2018. Retrieved September 24, 2018.

statschippac.com (Global: low place; English: low place)

"Stats ChipPAC - Wafer Level CSP (WLCSP) - a FIWLP Technology". www.statschippac.com. Archived from the original on 2019-05-26. Retrieved 2019-05-26.

techtimes.com (Global: 4,756^th place; English: 2,900^th place)

By Aaron Mamiit, Tech Times. “Apple Wants a Slimmer iPhone 7 and Will Reportedly Use Fan-Out Packaging Technology.” April 1, 2016. Retrieved April 8, 2016.

web.archive.org (Global: 1^st place; English: 1^st place)

Korczynski, Ed (May 5, 2014). "Wafer-level packaging of ICs for mobile systems of the future". Semiconductor Manufacturing & Design Community. Archived from the original on August 16, 2018. Retrieved September 24, 2018.
"Stats ChipPAC - Wafer Level CSP (WLCSP) - a FIWLP Technology". www.statschippac.com. Archived from the original on 2019-05-26. Retrieved 2019-05-26.

zdnet.com (Global: 786^th place; English: 558^th place)

By Leon Spencer, ZDNet. “Raspberry Pi 2 power crashes when exposed to xenon flash.” February 9, 2015. Retrieved February 5, 2016.