Wire bonding (English Wikipedia)

Khoury, S.L.; Burkhard, D.J.; Galloway, D.P.; Scharr, T.A. (1990). "A comparison of copper and gold wire bonding on integrated circuit devices". 40th Conference Proceedings on Electronic Components and Technology. pp. 768–776. doi:10.1109/ECTC.1990.122277. S2CID 111130335.
Breach, C. D. (2010). "What is the future of bonding wire? Will copper entirely replace gold?" (PDF). Gold Bulletin. 43 (3): 150–168. doi:10.1007/BF03214983. S2CID 137609854. Retrieved 2024-02-06.
Ghrabli, Mehdi; Bouarroudj, Mounira; Chamoin, Ludovic; Aldea, Emanuel (2024). Hybrid modeling for remaining useful life prediction in power module prognosis. 2024 25th International Conference on Thermal Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Catania, Italy: IEEE. doi:10.1109/EuroSimE60745.2024.10491493.
Ghrabli, Mehdi; Bouarroudj, Mounira; Chamoin, Ludovic; Aldea, Emanuel (2025). "Physics-informed Markov chains for remaining useful life prediction of wire bonds in power electronic modules". Microelectronics Reliability. 167 115644: 1–12. doi:10.1016/j.microrel.2025.115644.

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Mokhoff, Nicolas (March 26, 2012). "Red Micro Wire encapsulates wire bonding in glass". EE Times. San Francisco: UBM plc. ISSN 0192-1541. OCLC 56085045. Archived from the original on March 20, 2014. Retrieved March 20, 2014.

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"Heraeus Bonding Wires for Semiconductor Technology catalogue" (PDF). Heraeus.

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Brökelmann, M.; Siepe, D.; Hunstig, M.; McKeown, M.; Oftebro, K. (October 26, 2015), Copper wire bonding ready for industrial mass production (PDF), archived from the original (PDF) on February 3, 2016, retrieved January 30, 2016

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"K&S - ACS Pro". www.kns.com.

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"Product Change Notification - CYER-27BVXY633". microchip.com. August 29, 2013. Archived from the original on March 20, 2014. Retrieved March 20, 2014.

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A.Coucoulas, "Compliant Bonding" Proceedings 1970 IEEE 20th Electronic Components Conference, pp. 380-89, 1970. http://commons.wikimedia.org/wiki/File:CompliantBondingPublic_1-10.pdf https://www.researchgate.net/publication/225284187_Compliant_Bonding_Alexander_Coucoulas_1970_Proceeding_Electronic_Components_Conference_Awarded_Best_Paper
Hillman, C., "Predicting and avoiding die attach, wire bond, and solder joint failures." International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM), 2016.

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Khoury, S.L.; Burkhard, D.J.; Galloway, D.P.; Scharr, T.A. (1990). "A comparison of copper and gold wire bonding on integrated circuit devices". 40th Conference Proceedings on Electronic Components and Technology. pp. 768–776. doi:10.1109/ECTC.1990.122277. S2CID 111130335.
Breach, C. D. (2010). "What is the future of bonding wire? Will copper entirely replace gold?" (PDF). Gold Bulletin. 43 (3): 150–168. doi:10.1007/BF03214983. S2CID 137609854. Retrieved 2024-02-06.

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"The Great Debate: Copper vs. Gold Ball Bonding | Semiconductor Digest".

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springer.com

Chauhan, Preeti; Choubey, Anupam; Zhong, ZhaoWei; Pecht, Michael (2014). Copper Wire Bonding (PDF). New York: Springer. ISBN 978-1-4614-5760-2. OCLC 864498662.

link.springer.com

Breach, C. D. (2010). "What is the future of bonding wire? Will copper entirely replace gold?" (PDF). Gold Bulletin. 43 (3): 150–168. doi:10.1007/BF03214983. S2CID 137609854. Retrieved 2024-02-06.

web.archive.org (Global: 1^st place; English: 1^st place)

Mokhoff, Nicolas (March 26, 2012). "Red Micro Wire encapsulates wire bonding in glass". EE Times. San Francisco: UBM plc. ISSN 0192-1541. OCLC 56085045. Archived from the original on March 20, 2014. Retrieved March 20, 2014.
"Product Change Notification - CYER-27BVXY633". microchip.com. August 29, 2013. Archived from the original on March 20, 2014. Retrieved March 20, 2014.
Brökelmann, M.; Siepe, D.; Hunstig, M.; McKeown, M.; Oftebro, K. (October 26, 2015), Copper wire bonding ready for industrial mass production (PDF), archived from the original (PDF) on February 3, 2016, retrieved January 30, 2016

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commons.wikimedia.org

A.Coucoulas, "Compliant Bonding" Proceedings 1970 IEEE 20th Electronic Components Conference, pp. 380-89, 1970. http://commons.wikimedia.org/wiki/File:CompliantBondingPublic_1-10.pdf https://www.researchgate.net/publication/225284187_Compliant_Bonding_Alexander_Coucoulas_1970_Proceeding_Electronic_Components_Conference_Awarded_Best_Paper

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How to test bonds: How to Wire Pull? April 2016.

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Mokhoff, Nicolas (March 26, 2012). "Red Micro Wire encapsulates wire bonding in glass". EE Times. San Francisco: UBM plc. ISSN 0192-1541. OCLC 56085045. Archived from the original on March 20, 2014. Retrieved March 20, 2014.
Chauhan, Preeti; Choubey, Anupam; Zhong, ZhaoWei; Pecht, Michael (2014). Copper Wire Bonding (PDF). New York: Springer. ISBN 978-1-4614-5760-2. OCLC 864498662.
Harman, George G. (2010). Wire Bonding in Microelectronics (3rd ed.). New York: McGraw-Hill. ISBN 978-0-07-164265-1. OCLC 609421363.

Wire bonding (English Wikipedia)

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