Wire bonding (English Wikipedia)

Analysis of information sources in references of the Wikipedia article "Wire bonding" in English language version.

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aecouncil.com

"AEC Q006" (PDF). www.aecouncil.com.

astm.org

"ASTM F459-13: Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds (Withdrawn 2023)". ASTM International. Retrieved 2024-04-22.

cambridge.org

journals.cambridge.org

V. Valenta et al., "Design and experimental evaluation of compensated bondwire interconnects above 100 GHz", International Journal of Microwave and Wireless Technologies, 2015.

dfrsolutions.com

Ensuring suitability of Cu wire bonded ICs for automotive applications

doi.org

Khoury, S.L.; Burkhard, D.J.; Galloway, D.P.; Scharr, T.A. (1990). "A comparison of copper and gold wire bonding on integrated circuit devices". pp. 768–776. doi:10.1109/ECTC.1990.122277. S2CID 111130335. Retrieved 2024-02-06.
Breach, C. D. (2010). "What is the future of bonding wire? Will copper entirely replace gold?" (PDF). Gold Bulletin. 43 (3): 150–168. doi:10.1007/BF03214983. S2CID 137609854. Retrieved 2024-02-06.

eetimes.com

Mokhoff, Nicolas (March 26, 2012). "Red Micro Wire encapsulates wire bonding in glass". EE Times. San Francisco: UBM plc. ISSN 0192-1541. OCLC 56085045. Archived from the original on March 20, 2014. Retrieved March 20, 2014.

heraeus.com

"Heraeus Bonding Wires for Semiconductor Technology catalogue" (PDF). Heraeus.

hesse-mechatronics.com

Brökelmann, M.; Siepe, D.; Hunstig, M.; McKeown, M.; Oftebro, K. (October 26, 2015), Copper wire bonding ready for industrial mass production (PDF), retrieved January 30, 2016

ieee.org

ieeexplore.ieee.org

Khoury, S.L.; Burkhard, D.J.; Galloway, D.P.; Scharr, T.A. (1990). "A comparison of copper and gold wire bonding on integrated circuit devices". pp. 768–776. doi:10.1109/ECTC.1990.122277. S2CID 111130335. Retrieved 2024-02-06.

kns.com

"K&S - ACS Pro". www.kns.com.

microchip.com

"Product Change Notification - CYER-27BVXY633". microchip.com. August 29, 2013. Archived from the original on March 20, 2014. Retrieved March 20, 2014.

researchgate.net

A.Coucoulas, "Compliant Bonding" Proceedings 1970 IEEE 20th Electronic Components Conference, pp. 380-89, 1970. http://commons.wikimedia.org/wiki/File:CompliantBondingPublic_1-10.pdf https://www.researchgate.net/publication/225284187_Compliant_Bonding_Alexander_Coucoulas_1970_Proceeding_Electronic_Components_Conference_Awarded_Best_Paper
Hillman, C., "Predicting and avoiding die attach, wire bond, and solder joint failures." International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM), 2016.

semanticscholar.org

api.semanticscholar.org

Khoury, S.L.; Burkhard, D.J.; Galloway, D.P.; Scharr, T.A. (1990). "A comparison of copper and gold wire bonding on integrated circuit devices". pp. 768–776. doi:10.1109/ECTC.1990.122277. S2CID 111130335. Retrieved 2024-02-06.
Breach, C. D. (2010). "What is the future of bonding wire? Will copper entirely replace gold?" (PDF). Gold Bulletin. 43 (3): 150–168. doi:10.1007/BF03214983. S2CID 137609854. Retrieved 2024-02-06.

semiconductor-digest.com

sst.semiconductor-digest.com

"The Great Debate: Copper vs. Gold Ball Bonding | Semiconductor Digest".

springer.com

springer.com

Chauhan, Preeti; Choubey, Anupam; Zhong, ZhaoWei; Pecht, Michael (2014). Copper Wire Bonding (PDF). New York: Springer. ISBN 978-1-4614-5760-2. OCLC 864498662.

link.springer.com

Breach, C. D. (2010). "What is the future of bonding wire? Will copper entirely replace gold?" (PDF). Gold Bulletin. 43 (3): 150–168. doi:10.1007/BF03214983. S2CID 137609854. Retrieved 2024-02-06.

web.archive.org

Mokhoff, Nicolas (March 26, 2012). "Red Micro Wire encapsulates wire bonding in glass". EE Times. San Francisco: UBM plc. ISSN 0192-1541. OCLC 56085045. Archived from the original on March 20, 2014. Retrieved March 20, 2014.
"Product Change Notification - CYER-27BVXY633". microchip.com. August 29, 2013. Archived from the original on March 20, 2014. Retrieved March 20, 2014.

wikimedia.org

commons.wikimedia.org

A.Coucoulas, "Compliant Bonding" Proceedings 1970 IEEE 20th Electronic Components Conference, pp. 380-89, 1970. http://commons.wikimedia.org/wiki/File:CompliantBondingPublic_1-10.pdf https://www.researchgate.net/publication/225284187_Compliant_Bonding_Alexander_Coucoulas_1970_Proceeding_Electronic_Components_Conference_Awarded_Best_Paper

wirepull.how

How to test bonds: How to Wire Pull? April 2016.

worldcat.org

Mokhoff, Nicolas (March 26, 2012). "Red Micro Wire encapsulates wire bonding in glass". EE Times. San Francisco: UBM plc. ISSN 0192-1541. OCLC 56085045. Archived from the original on March 20, 2014. Retrieved March 20, 2014.
Chauhan, Preeti; Choubey, Anupam; Zhong, ZhaoWei; Pecht, Michael (2014). Copper Wire Bonding (PDF). New York: Springer. ISBN 978-1-4614-5760-2. OCLC 864498662.
Harman, George G. (2010). Wire Bonding in Microelectronics (3rd ed.). New York: McGraw-Hill. ISBN 978-0-07-164265-1. OCLC 609421363.