پیوند یوتکتیکی (Persian Wikipedia)

Analysis of information sources in references of the Wikipedia article "پیوند یوتکتیکی" in Persian language version.

refsWebsite

Global rank Persian rank

17doi.org

2^nd place

7worldcat.org

5^th place

12^th place

1ieee.org

652^nd place

1,509^th place

1springer.com

274^th place

506^th place

1sciencedirect.com

149^th place

190^th place

doi.org

Lin, Y. -C.; Baum, M.; Haubold, M.; Fromel, J.; Wiemer, M.; Gessner, T.; Esashi, M. (2009-06). "Development and evaluation of AuSi eutectic wafer bonding". TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference. IEEE. doi:10.1109/sensor.2009.5285519. ISBN 978-1-4244-4190-7. {{cite journal}}: Check date values in: |date= (help)
Wolffenbuttel, R.F. (1997-07). "Low-temperature intermediate Au-Si wafer bonding; eutectic or silicide bond". Sensors and Actuators A: Physical. 62 (1–3): 680–686. doi:10.1016/s0924-4247(97)01550-1. ISSN 0924-4247. {{cite journal}}: Check date values in: |date= (help)
Farrens, Shari (2008). "Wafer and Die Bonding Technologies for 3D Integration". Materials Research Society Symposium Proceedings. Materials Research Society. doi:10.1557/proc-1112-e01-06.
Matijasevic, Goran S; Lee, Chin C; Wang, Chen Y (1993-02). "AuSn alloy phase diagram and properties related to its use as a bonding medium". Thin Solid Films. 223 (2): 276–287. doi:10.1016/0040-6090(93)90533-u. ISSN 0040-6090. {{cite journal}}: Check date values in: |date= (help)
Sood, Sumant; Farrens, Shari; Pinker, Ron; Xie, James; Cataby, Wilbur (2010). "Al-Ge Eutectic Wafer Bonding and Bond Characterization for CMOS Compatible Wafer Packaging". ECS. doi:10.1149/1.3483497. {{cite journal}}: Cite journal requires |journal= (help)
Lani, S.; Bosseboeuf, A.; Belier, B.; Clerc, C.; Gousset, C.; Aubert, J. (2006-06-20). "Gold metallizations for eutectic bonding of silicon wafers". Microsystem Technologies. 12 (10–11): 1021–1025. doi:10.1007/s00542-006-0228-6. ISSN 0946-7076.
Yost, F. G. (1974-05-01). "Ultimate strength and morphological structure of eutectic bonds". Journal of Electronic Materials (به انگلیسی). 3 (2): 353–369. doi:10.1007/BF02652947. ISSN 1543-186X.
Cheng, Y. T.; Lin, L.; Najafi, K. (2000-3). "Localized silicon fusion and eutectic bonding for MEMS fabrication and packaging". Journal of Microelectromechanical Systems. 9 (1): 3–8. doi:10.1109/84.825770. ISSN 1057-7157. {{cite journal}}: Check date values in: |date= (help)
Bhushan، Bharat, ویراستار (۲۰۰۷). Springer Handbook of Nanotechnology (به انگلیسی). Berlin, Heidelberg: Springer Berlin Heidelberg. doi:10.1007/978-3-540-29857-1. شابک ۹۷۸۳۵۴۰۲۹۸۵۵۷.
Wolffenbuttel, R. F.; Wise, K. D. (1994-05-01). "Low-temperature silicon wafer-to-wafer bonding using gold at eutectic temperature". Sensors and Actuators A: Physical. 43 (1): 223–229. doi:10.1016/0924-4247(93)00653-L. ISSN 0924-4247.

dx.doi.org

Lin, Y. -C.; Baum, M.; Haubold, M.; Fromel, J.; Wiemer, M.; Gessner, T.; Esashi, M. (2009-06). "Development and evaluation of AuSi eutectic wafer bonding". TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference. IEEE. doi:10.1109/sensor.2009.5285519. ISBN 978-1-4244-4190-7. {{cite journal}}: Check date values in: |date= (help)
Wolffenbuttel, R.F. (1997-07). "Low-temperature intermediate Au-Si wafer bonding; eutectic or silicide bond". Sensors and Actuators A: Physical. 62 (1–3): 680–686. doi:10.1016/s0924-4247(97)01550-1. ISSN 0924-4247. {{cite journal}}: Check date values in: |date= (help)
Farrens, Shari (2008). "Wafer and Die Bonding Technologies for 3D Integration". Materials Research Society Symposium Proceedings. Materials Research Society. doi:10.1557/proc-1112-e01-06.
Matijasevic, Goran S; Lee, Chin C; Wang, Chen Y (1993-02). "AuSn alloy phase diagram and properties related to its use as a bonding medium". Thin Solid Films. 223 (2): 276–287. doi:10.1016/0040-6090(93)90533-u. ISSN 0040-6090. {{cite journal}}: Check date values in: |date= (help)
Sood, Sumant; Farrens, Shari; Pinker, Ron; Xie, James; Cataby, Wilbur (2010). "Al-Ge Eutectic Wafer Bonding and Bond Characterization for CMOS Compatible Wafer Packaging". ECS. doi:10.1149/1.3483497. {{cite journal}}: Cite journal requires |journal= (help)
Lani, S.; Bosseboeuf, A.; Belier, B.; Clerc, C.; Gousset, C.; Aubert, J. (2006-06-20). "Gold metallizations for eutectic bonding of silicon wafers". Microsystem Technologies. 12 (10–11): 1021–1025. doi:10.1007/s00542-006-0228-6. ISSN 0946-7076.
Farrens، Shari (۲۰۰۸). Wafer-Bonding Technologies and Strategies for 3D ICs. Boston, MA: Springer US. صص. ۱–۳۵. شابک ۹۷۸۰۳۸۷۷۶۵۳۲۷.

ieee.org

ieeexplore.ieee.org

Cheng, Y. T.; Lin, L.; Najafi, K. (2000-3). "Localized silicon fusion and eutectic bonding for MEMS fabrication and packaging". Journal of Microelectromechanical Systems. 9 (1): 3–8. doi:10.1109/84.825770. ISSN 1057-7157. {{cite journal}}: Check date values in: |date= (help)

sciencedirect.com

Wolffenbuttel, R. F.; Wise, K. D. (1994-05-01). "Low-temperature silicon wafer-to-wafer bonding using gold at eutectic temperature". Sensors and Actuators A: Physical. 43 (1): 223–229. doi:10.1016/0924-4247(93)00653-L. ISSN 0924-4247.

springer.com

link.springer.com

Bhushan، Bharat, ویراستار (۲۰۰۷). Springer Handbook of Nanotechnology (به انگلیسی). Berlin, Heidelberg: Springer Berlin Heidelberg. doi:10.1007/978-3-540-29857-1. شابک ۹۷۸۳۵۴۰۲۹۸۵۵۷.

worldcat.org

Wolffenbuttel, R.F. (1997-07). "Low-temperature intermediate Au-Si wafer bonding; eutectic or silicide bond". Sensors and Actuators A: Physical. 62 (1–3): 680–686. doi:10.1016/s0924-4247(97)01550-1. ISSN 0924-4247. {{cite journal}}: Check date values in: |date= (help)
Matijasevic, Goran S; Lee, Chin C; Wang, Chen Y (1993-02). "AuSn alloy phase diagram and properties related to its use as a bonding medium". Thin Solid Films. 223 (2): 276–287. doi:10.1016/0040-6090(93)90533-u. ISSN 0040-6090. {{cite journal}}: Check date values in: |date= (help)
Lani, S.; Bosseboeuf, A.; Belier, B.; Clerc, C.; Gousset, C.; Aubert, J. (2006-06-20). "Gold metallizations for eutectic bonding of silicon wafers". Microsystem Technologies. 12 (10–11): 1021–1025. doi:10.1007/s00542-006-0228-6. ISSN 0946-7076.
Mikro-System-Technik Chemnitz '03: Mikromechanik & Mikroelektronik ; 6. Chemnitzer Fachtagung Mikromechanik & Mikroelektronik, 29. /30. Oktober 2003. Chemnitz: Techn. Univ. ۲۰۰۳. OCLC 249217750. شابک ۳۰۰۰۱۱۶۵۵۹.
Yost, F. G. (1974-05-01). "Ultimate strength and morphological structure of eutectic bonds". Journal of Electronic Materials (به انگلیسی). 3 (2): 353–369. doi:10.1007/BF02652947. ISSN 1543-186X.
Cheng, Y. T.; Lin, L.; Najafi, K. (2000-3). "Localized silicon fusion and eutectic bonding for MEMS fabrication and packaging". Journal of Microelectromechanical Systems. 9 (1): 3–8. doi:10.1109/84.825770. ISSN 1057-7157. {{cite journal}}: Check date values in: |date= (help)
Wolffenbuttel, R. F.; Wise, K. D. (1994-05-01). "Low-temperature silicon wafer-to-wafer bonding using gold at eutectic temperature". Sensors and Actuators A: Physical. 43 (1): 223–229. doi:10.1016/0924-4247(93)00653-L. ISSN 0924-4247.