لحیم‌کاری (Persian Wikipedia)

Analysis of information sources in references of the Wikipedia article "لحیم‌کاری" in Persian language version.

refsWebsite

Global rank Persian rank

28doi.org

2^nd place

19worldcat.org

5^th place

12^th place

8ieee.org

652^nd place

1,509^th place

4springer.com

274^th place

506^th place

2scientific.net

low place

2web.archive.org

1^st place

2bme.hu

low place

1wiley.com

222^nd place

185^th place

1asme.org

6,461^st place

6,711^th place

1scitation.org

4,352^nd place

5,517^th place

1dtic.mil

833^rd place

883^rd place

1pan.pl

3,844^th place

low place

1nature.com

234^th place

262^nd place

1machinedesign.com

low place

1osti.gov

2,036^th place

5,277^th place

1amadaweldtech.eu

low place

1elsevier.com

610^th place

762^nd place

1spiedigitallibrary.org

low place

1pmmag.com

low place

1inbr.ir

low place

1sciencedirect.com

149^th place

190^th place

amadaweldtech.eu

Hot Bar Reflow Soldering Fundamentals (PDF). کاراکتر line feed character در |عنوان= در موقعیت 25 (کمک)

asme.org

asmedigitalcollection.asme.org

Mukherjee, Shantanu; Castro, Manuel; Tsai, Pei-Fang Jennifer; Srihari, Krishnaswami; Nguyen, Van D. (2007-01-01). "PB-Free Wave Soldering of Thick Printed Circuit Boards Using No-Clean VOC Free Flux". Volume 5: Electronics and Photonics. Seattle, Washington, USA: ASMEDC: 143–147. doi:10.1115/IMECE2007-42930. ISBN 978-0-7918-4299-7.

bme.hu

pp.bme.hu

Balogh, Bálint; Harsányi, Gábor; Kovács, Róbert; Nagynémedi, Csaba; Papp, Bence (2008). "Analysis of solder joint failures arisen during the soldering process". Periodica Polytechnica Electrical Engineering (به انگلیسی). 52 (1–2): 5. doi:10.3311/pp.ee.2008-1-2.01. ISSN 0031-532X.
Balogh, Bálint; Harsányi, Gábor; Kovács, Róbert; Nagynémedi, Csaba; Papp, Bence (2008). "Analysis of solder joint failures arisen during the soldering process". Periodica Polytechnica Electrical Engineering (به انگلیسی). 52 (1–2): 5. doi:10.3311/pp.ee.2008-1-2.01. ISSN 0031-532X.

doi.org

Bradley, E. (2003). "Lead-free solder assembly: impact and opportunity". 53rd Electronic Components and Technology Conference, 2003. Proceedings. New Orleans, Louisiana, USA: IEEE: 41–46. doi:10.1109/ECTC.2003.1216254. ISBN 978-0-7803-7791-2.
Turbini, L.J.; Munie, G.C.; Bernier, D.; Gamalski, J.; Bergman, D.W. (2001-01). "Examining the environmental impact of lead-free soldering alternatives". IEEE Transactions on Electronics Packaging Manufacturing (به انگلیسی). 24 (1): 4–9. doi:10.1109/6104.924786. ISSN 1521-334X. {{cite journal}}: Check date values in: |date= (help)
Gregory, R. (1990-04). "Galvanic Corrosion of Lead Solder in Copper Pipework". Water and Environment Journal (به انگلیسی). 4 (2): 112–118. doi:10.1111/j.1747-6593.1990.tb01566.x. ISSN 1747-6585. {{cite journal}}: Check date values in: |date= (help)
Mashkov, P.; Pencheva, T.; Popov, D.; Gyoch, B. (2005). "Apparatus and method for soldering electronic components to printed circuit boards". 28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005. Wiener Neustadt, Austria: IEEE: 420–425. doi:10.1109/ISSE.2005.1491065. ISBN 978-0-7803-9325-7.
Mukherjee, Shantanu; Castro, Manuel; Tsai, Pei-Fang Jennifer; Srihari, Krishnaswami; Nguyen, Van D. (2007-01-01). "PB-Free Wave Soldering of Thick Printed Circuit Boards Using No-Clean VOC Free Flux". Volume 5: Electronics and Photonics. Seattle, Washington, USA: ASMEDC: 143–147. doi:10.1115/IMECE2007-42930. ISBN 978-0-7918-4299-7.
Pyle, Robert W. (2008-05). "A design strategy for brass instruments". The Journal of the Acoustical Society of America (به انگلیسی). 123 (5): 3121–3121. doi:10.1121/1.2933040. ISSN 0001-4966. {{cite journal}}: Check date values in: |date= (help)
Wang, B.; Yi, S. (2002-05-01). "Dynamic plastic behavior of 63 wt% Sn 37 wt% Pb eutectic solder under high strain rates". Journal of Materials Science Letters (به انگلیسی). 21 (9): 697–698. doi:10.1023/A:1015776820115. ISSN 1573-4811.
Morando, Carina; Fornaro, Osvaldo; Garbellini, Olga; Palacio, Hugo (2015-12). "Fluidity of Sn-based eutectic solder alloys". Journal of Materials Science: Materials in Electronics (به انگلیسی). 26 (12): 9478–9483. doi:10.1007/s10854-015-3415-3. ISSN 0957-4522. {{cite journal}}: Check date values in: |date= (help)
Ogunseitan, Oladele A. (2007-07). "Public health and environmental benefits of adopting lead-free solders". JOM (به انگلیسی). 59 (7): 12–17. doi:10.1007/s11837-007-0082-8. ISSN 1047-4838. {{cite journal}}: Check date values in: |date= (help)
Fouzder, Tama; Gain, Asit Kumar; Chan, Daniel K. (2017-11). "Microstructure, wetting characteristics and hardness of tin-bismuth-silver (Sn–Bi–Ag) solders on silver (Ag)-surface finished copper (Cu) substrates". Journal of Materials Science: Materials in Electronics (به انگلیسی). 28 (22): 16921–16931. doi:10.1007/s10854-017-7611-1. ISSN 0957-4522. {{cite journal}}: Check date values in: |date= (help)
Liu, Huan; Xue, Feng; Zhou, Jian (2011-02). "Study of Flux on Wetting Behavior of Sn-Zn Lead-Free Solders". Advanced Materials Research. 189–193: 3230–3237. doi:10.4028/www.scientific.net/AMR.189-193.3230. ISSN 1662-8985. {{cite journal}}: Check date values in: |date= (help)
Li, Tianpeng; Tan, Jorcelyn Ying Ru; Khoo, Soon Aik; Breach, Christopher D.; Hawkins, J. Adrian (2014-11). "Thermal and Wetting Properties of Water-Soluble Fluxes and Solder Pastes". IEEE Transactions on Components, Packaging and Manufacturing Technology. 4 (11): 1871–1878. doi:10.1109/TCPMT.2014.2357214. ISSN 2156-3950. {{cite journal}}: Check date values in: |date= (help)
Conseil, Hélène; Verdingovas, Vadimas; Jellesen, Morten S.; Ambat, Rajan (2016-01). "Decomposition of no-clean solder flux systems and their effects on the corrosion reliability of electronics". Journal of Materials Science: Materials in Electronics (به انگلیسی). 27 (1): 23–32. doi:10.1007/s10854-015-3712-x. ISSN 0957-4522. {{cite journal}}: Check date values in: |date= (help)
Schmitt, W. (2006-09). "Resin / Rosin Free Solder Pastes and Fluxes". 2006 1st Electronic Systemintegration Technology Conference. 2: 974–982. doi:10.1109/ESTC.2006.280129. {{cite journal}}: Check date values in: |date= (help)
Way, Matthew; Willingham, Jack; Goodall, Russell (2020-07-03). "Brazing filler metals". International Materials Reviews. 65 (5): 257–285. doi:10.1080/09506608.2019.1613311. ISSN 0950-6608.
Bagrets, N.; Barth, C.; Weiss, K. -P (2014-06). "Low Temperature Thermal and Thermo-Mechanical Properties of Soft Solders for Superconducting Applications". IEEE Transactions on Applied Superconductivity. 24 (3): 1–3. doi:10.1109/TASC.2013.2283869. ISSN 1051-8223. {{cite journal}}: Check date values in: |date= (help)
Mičian, M.; Koňár, R. (2017-09-01). "Repairs of Damaged Castings Made of Graphitic Cast Iron by Means of Brazing". Archives of Foundry Engineering. 17 (3): 91–96. doi:10.1515/afe-2017-0097. ISSN 2299-2944.
"Soldering Electrical Joints". Nature (به انگلیسی). 150 (3804): 371–371. 1942-09-01. doi:10.1038/150371b0. ISSN 1476-4687.
Colbus, Jakob; Zimmermann, Karl Friedrich (1974-06-01). "Properties of gold-nickel alloy brazed joints in high temperature materials". Gold Bulletin (به انگلیسی). 7 (2): 42–49. doi:10.1007/BF03215037. ISSN 2190-7579.
Friebe, E. R. (Sun Aug 01 00:00:00 EDT 1976). "Induction soldering evaluation" (به انگلیسی). doi:10.2172/7262156. {{cite journal}}: Cite journal requires |journal= (help); Check date values in: |date= (help)
Koleňák, Roman; Prach, Michal (2014-02). "Research of Joining Graphite by Use of Active Solder". Advanced Materials Research. 875–877: 1270–1274. doi:10.4028/www.scientific.net/AMR.875-877.1270. ISSN 1662-8985. {{cite journal}}: Check date values in: |date= (help)
Sunappan, V.; Collier, P. (2003). "Lead-free wave soldering development for pcb assembly". 53rd Electronic Components and Technology Conference, 2003. Proceedings. New Orleans, Louisiana, USA: IEEE: 1829–1838. doi:10.1109/ECTC.2003.1216552. ISBN 978-0-7803-7791-2.
Nguty, T.A.; Budiman, S.; Rajkumar, D.; Solomon, R.; Ekere, N.N.; Currie, M.A. (2000). "Understanding the process window for printing lead-free solder pastes". 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070). Las Vegas, NV, USA: IEEE: 1426–1435. doi:10.1109/ECTC.2000.853398. ISBN 978-0-7803-5908-6.
Balogh, Bálint; Harsányi, Gábor; Kovács, Róbert; Nagynémedi, Csaba; Papp, Bence (2008). "Analysis of solder joint failures arisen during the soldering process". Periodica Polytechnica Electrical Engineering (به انگلیسی). 52 (1–2): 5. doi:10.3311/pp.ee.2008-1-2.01. ISSN 0031-532X.
Balogh, Bálint; Harsányi, Gábor; Kovács, Róbert; Nagynémedi, Csaba; Papp, Bence (2008). "Analysis of solder joint failures arisen during the soldering process". Periodica Polytechnica Electrical Engineering (به انگلیسی). 52 (1–2): 5. doi:10.3311/pp.ee.2008-1-2.01. ISSN 0031-532X.
Chaminade, C.; Fogarassy, E.; Boisselier, D. (2006-04). "Diode laser soldering using a lead-free filler material for electronic packaging structures". Applied Surface Science (به انگلیسی). 252 (13): 4406–4410. doi:10.1016/j.apsusc.2005.07.095. {{cite journal}}: Check date values in: |date= (help)
Wang, Jing-bo; Watanabe, Mamoru; Goto, Yasuhiro; Fujii, Kouji; Kuriaki, Hiroyuki; Satoh, Masahiro; Ikeda, Junji; Fujimoto, Kozo (2003-03-03). "Development of high-speed laser soldering process for lead-free solder with diode laser". First International Symposium on High-Power Laser Macroprocessing. International Society for Optics and Photonics. 4831: 26–31. doi:10.1117/12.497966.
Subramanian, K. S.; Sastri, V. S.; Elboujdaini, M.; Connor, J. W.; Davey, A. B. C. (1995-08-01). "Water contamination: Impact of tin-lead solder". Water Research (به انگلیسی). 29 (8): 1827–1836. doi:10.1016/0043-1354(95)00005-6. ISSN 0043-1354.

dtic.mil

apps.dtic.mil

«"An Investigation of the Chemistry of Citric Acid in Military Soldering Applications"» (PDF). بایگانی‌شده از اصلی (PDF) در ۱۵ مارس ۲۰۲۰. دریافت‌شده در ۱۳ ژانویه ۲۰۲۱.

elsevier.com

linkinghub.elsevier.com

Chaminade, C.; Fogarassy, E.; Boisselier, D. (2006-04). "Diode laser soldering using a lead-free filler material for electronic packaging structures". Applied Surface Science (به انگلیسی). 252 (13): 4406–4410. doi:10.1016/j.apsusc.2005.07.095. {{cite journal}}: Check date values in: |date= (help)

ieee.org

ieeexplore.ieee.org

Bradley, E. (2003). "Lead-free solder assembly: impact and opportunity". 53rd Electronic Components and Technology Conference, 2003. Proceedings. New Orleans, Louisiana, USA: IEEE: 41–46. doi:10.1109/ECTC.2003.1216254. ISBN 978-0-7803-7791-2.
Turbini, L.J.; Munie, G.C.; Bernier, D.; Gamalski, J.; Bergman, D.W. (2001-01). "Examining the environmental impact of lead-free soldering alternatives". IEEE Transactions on Electronics Packaging Manufacturing (به انگلیسی). 24 (1): 4–9. doi:10.1109/6104.924786. ISSN 1521-334X. {{cite journal}}: Check date values in: |date= (help)
Mashkov, P.; Pencheva, T.; Popov, D.; Gyoch, B. (2005). "Apparatus and method for soldering electronic components to printed circuit boards". 28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005. Wiener Neustadt, Austria: IEEE: 420–425. doi:10.1109/ISSE.2005.1491065. ISBN 978-0-7803-9325-7.
Li, Tianpeng; Tan, Jorcelyn Ying Ru; Khoo, Soon Aik; Breach, Christopher D.; Hawkins, J. Adrian (2014-11). "Thermal and Wetting Properties of Water-Soluble Fluxes and Solder Pastes". IEEE Transactions on Components, Packaging and Manufacturing Technology. 4 (11): 1871–1878. doi:10.1109/TCPMT.2014.2357214. ISSN 2156-3950. {{cite journal}}: Check date values in: |date= (help)
Schmitt, W. (2006-09). "Resin / Rosin Free Solder Pastes and Fluxes". 2006 1st Electronic Systemintegration Technology Conference. 2: 974–982. doi:10.1109/ESTC.2006.280129. {{cite journal}}: Check date values in: |date= (help)
Bagrets, N.; Barth, C.; Weiss, K. -P (2014-06). "Low Temperature Thermal and Thermo-Mechanical Properties of Soft Solders for Superconducting Applications". IEEE Transactions on Applied Superconductivity. 24 (3): 1–3. doi:10.1109/TASC.2013.2283869. ISSN 1051-8223. {{cite journal}}: Check date values in: |date= (help)
Sunappan, V.; Collier, P. (2003). "Lead-free wave soldering development for pcb assembly". 53rd Electronic Components and Technology Conference, 2003. Proceedings. New Orleans, Louisiana, USA: IEEE: 1829–1838. doi:10.1109/ECTC.2003.1216552. ISBN 978-0-7803-7791-2.
Nguty, T.A.; Budiman, S.; Rajkumar, D.; Solomon, R.; Ekere, N.N.; Currie, M.A. (2000). "Understanding the process window for printing lead-free solder pastes". 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070). Las Vegas, NV, USA: IEEE: 1426–1435. doi:10.1109/ECTC.2000.853398. ISBN 978-0-7803-5908-6.

inbr.ir

وزارت مسکن و شهرسازی - مقررات ملی ساختمان مبحث شانزدهم. بایگانی‌شده از اصلی در ۲۳ ژانویه ۲۰۲۱. دریافت‌شده در ۲۲ ژانویه ۲۰۲۱.

machinedesign.com

Stephen Mraz (DEC 09, 2004). «When Brazing Beats Welding». تاریخ وارد شده در |تاریخ= را بررسی کنید (کمک)

nature.com

"Soldering Electrical Joints". Nature (به انگلیسی). 150 (3804): 371–371. 1942-09-01. doi:10.1038/150371b0. ISSN 1476-4687.

osti.gov

Friebe, E. R. (Sun Aug 01 00:00:00 EDT 1976). "Induction soldering evaluation" (به انگلیسی). doi:10.2172/7262156. {{cite journal}}: Cite journal requires |journal= (help); Check date values in: |date= (help)

pan.pl

journals.pan.pl

Mičian, M.; Koňár, R. (2017-09-01). "Repairs of Damaged Castings Made of Graphitic Cast Iron by Means of Brazing". Archives of Foundry Engineering. 17 (3): 91–96. doi:10.1515/afe-2017-0097. ISSN 2299-2944.

pmmag.com

«Flux Basics for the Plumbing Professional». pmmag. نوامبر ۷, ۲۰۰۳.

sciencedirect.com

Subramanian, K. S.; Sastri, V. S.; Elboujdaini, M.; Connor, J. W.; Davey, A. B. C. (1995-08-01). "Water contamination: Impact of tin-lead solder". Water Research (به انگلیسی). 29 (8): 1827–1836. doi:10.1016/0043-1354(95)00005-6. ISSN 0043-1354.

scientific.net

Liu, Huan; Xue, Feng; Zhou, Jian (2011-02). "Study of Flux on Wetting Behavior of Sn-Zn Lead-Free Solders". Advanced Materials Research. 189–193: 3230–3237. doi:10.4028/www.scientific.net/AMR.189-193.3230. ISSN 1662-8985. {{cite journal}}: Check date values in: |date= (help)
Koleňák, Roman; Prach, Michal (2014-02). "Research of Joining Graphite by Use of Active Solder". Advanced Materials Research. 875–877: 1270–1274. doi:10.4028/www.scientific.net/AMR.875-877.1270. ISSN 1662-8985. {{cite journal}}: Check date values in: |date= (help)

scitation.org

asa.scitation.org

Pyle, Robert W. (2008-05). "A design strategy for brass instruments". The Journal of the Acoustical Society of America (به انگلیسی). 123 (5): 3121–3121. doi:10.1121/1.2933040. ISSN 0001-4966. {{cite journal}}: Check date values in: |date= (help)

spiedigitallibrary.org

Wang, Jing-bo; Watanabe, Mamoru; Goto, Yasuhiro; Fujii, Kouji; Kuriaki, Hiroyuki; Satoh, Masahiro; Ikeda, Junji; Fujimoto, Kozo (2003-03-03). "Development of high-speed laser soldering process for lead-free solder with diode laser". First International Symposium on High-Power Laser Macroprocessing. International Society for Optics and Photonics. 4831: 26–31. doi:10.1117/12.497966.

springer.com

link.springer.com

Morando, Carina; Fornaro, Osvaldo; Garbellini, Olga; Palacio, Hugo (2015-12). "Fluidity of Sn-based eutectic solder alloys". Journal of Materials Science: Materials in Electronics (به انگلیسی). 26 (12): 9478–9483. doi:10.1007/s10854-015-3415-3. ISSN 0957-4522. {{cite journal}}: Check date values in: |date= (help)
Ogunseitan, Oladele A. (2007-07). "Public health and environmental benefits of adopting lead-free solders". JOM (به انگلیسی). 59 (7): 12–17. doi:10.1007/s11837-007-0082-8. ISSN 1047-4838. {{cite journal}}: Check date values in: |date= (help)
Fouzder, Tama; Gain, Asit Kumar; Chan, Daniel K. (2017-11). "Microstructure, wetting characteristics and hardness of tin-bismuth-silver (Sn–Bi–Ag) solders on silver (Ag)-surface finished copper (Cu) substrates". Journal of Materials Science: Materials in Electronics (به انگلیسی). 28 (22): 16921–16931. doi:10.1007/s10854-017-7611-1. ISSN 0957-4522. {{cite journal}}: Check date values in: |date= (help)
Conseil, Hélène; Verdingovas, Vadimas; Jellesen, Morten S.; Ambat, Rajan (2016-01). "Decomposition of no-clean solder flux systems and their effects on the corrosion reliability of electronics". Journal of Materials Science: Materials in Electronics (به انگلیسی). 27 (1): 23–32. doi:10.1007/s10854-015-3712-x. ISSN 0957-4522. {{cite journal}}: Check date values in: |date= (help)

web.archive.org

«"An Investigation of the Chemistry of Citric Acid in Military Soldering Applications"» (PDF). بایگانی‌شده از اصلی (PDF) در ۱۵ مارس ۲۰۲۰. دریافت‌شده در ۱۳ ژانویه ۲۰۲۱.
وزارت مسکن و شهرسازی - مقررات ملی ساختمان مبحث شانزدهم. بایگانی‌شده از اصلی در ۲۳ ژانویه ۲۰۲۱. دریافت‌شده در ۲۲ ژانویه ۲۰۲۱.

wiley.com

doi.wiley.com

Gregory, R. (1990-04). "Galvanic Corrosion of Lead Solder in Copper Pipework". Water and Environment Journal (به انگلیسی). 4 (2): 112–118. doi:10.1111/j.1747-6593.1990.tb01566.x. ISSN 1747-6585. {{cite journal}}: Check date values in: |date= (help)

worldcat.org

Turbini, L.J.; Munie, G.C.; Bernier, D.; Gamalski, J.; Bergman, D.W. (2001-01). "Examining the environmental impact of lead-free soldering alternatives". IEEE Transactions on Electronics Packaging Manufacturing (به انگلیسی). 24 (1): 4–9. doi:10.1109/6104.924786. ISSN 1521-334X. {{cite journal}}: Check date values in: |date= (help)
Gregory, R. (1990-04). "Galvanic Corrosion of Lead Solder in Copper Pipework". Water and Environment Journal (به انگلیسی). 4 (2): 112–118. doi:10.1111/j.1747-6593.1990.tb01566.x. ISSN 1747-6585. {{cite journal}}: Check date values in: |date= (help)
Pyle, Robert W. (2008-05). "A design strategy for brass instruments". The Journal of the Acoustical Society of America (به انگلیسی). 123 (5): 3121–3121. doi:10.1121/1.2933040. ISSN 0001-4966. {{cite journal}}: Check date values in: |date= (help)
Wang, B.; Yi, S. (2002-05-01). "Dynamic plastic behavior of 63 wt% Sn 37 wt% Pb eutectic solder under high strain rates". Journal of Materials Science Letters (به انگلیسی). 21 (9): 697–698. doi:10.1023/A:1015776820115. ISSN 1573-4811.
Morando, Carina; Fornaro, Osvaldo; Garbellini, Olga; Palacio, Hugo (2015-12). "Fluidity of Sn-based eutectic solder alloys". Journal of Materials Science: Materials in Electronics (به انگلیسی). 26 (12): 9478–9483. doi:10.1007/s10854-015-3415-3. ISSN 0957-4522. {{cite journal}}: Check date values in: |date= (help)
Ogunseitan, Oladele A. (2007-07). "Public health and environmental benefits of adopting lead-free solders". JOM (به انگلیسی). 59 (7): 12–17. doi:10.1007/s11837-007-0082-8. ISSN 1047-4838. {{cite journal}}: Check date values in: |date= (help)
Fouzder, Tama; Gain, Asit Kumar; Chan, Daniel K. (2017-11). "Microstructure, wetting characteristics and hardness of tin-bismuth-silver (Sn–Bi–Ag) solders on silver (Ag)-surface finished copper (Cu) substrates". Journal of Materials Science: Materials in Electronics (به انگلیسی). 28 (22): 16921–16931. doi:10.1007/s10854-017-7611-1. ISSN 0957-4522. {{cite journal}}: Check date values in: |date= (help)
Liu, Huan; Xue, Feng; Zhou, Jian (2011-02). "Study of Flux on Wetting Behavior of Sn-Zn Lead-Free Solders". Advanced Materials Research. 189–193: 3230–3237. doi:10.4028/www.scientific.net/AMR.189-193.3230. ISSN 1662-8985. {{cite journal}}: Check date values in: |date= (help)
Li, Tianpeng; Tan, Jorcelyn Ying Ru; Khoo, Soon Aik; Breach, Christopher D.; Hawkins, J. Adrian (2014-11). "Thermal and Wetting Properties of Water-Soluble Fluxes and Solder Pastes". IEEE Transactions on Components, Packaging and Manufacturing Technology. 4 (11): 1871–1878. doi:10.1109/TCPMT.2014.2357214. ISSN 2156-3950. {{cite journal}}: Check date values in: |date= (help)
Conseil, Hélène; Verdingovas, Vadimas; Jellesen, Morten S.; Ambat, Rajan (2016-01). "Decomposition of no-clean solder flux systems and their effects on the corrosion reliability of electronics". Journal of Materials Science: Materials in Electronics (به انگلیسی). 27 (1): 23–32. doi:10.1007/s10854-015-3712-x. ISSN 0957-4522. {{cite journal}}: Check date values in: |date= (help)
Way, Matthew; Willingham, Jack; Goodall, Russell (2020-07-03). "Brazing filler metals". International Materials Reviews. 65 (5): 257–285. doi:10.1080/09506608.2019.1613311. ISSN 0950-6608.
Bagrets, N.; Barth, C.; Weiss, K. -P (2014-06). "Low Temperature Thermal and Thermo-Mechanical Properties of Soft Solders for Superconducting Applications". IEEE Transactions on Applied Superconductivity. 24 (3): 1–3. doi:10.1109/TASC.2013.2283869. ISSN 1051-8223. {{cite journal}}: Check date values in: |date= (help)
Mičian, M.; Koňár, R. (2017-09-01). "Repairs of Damaged Castings Made of Graphitic Cast Iron by Means of Brazing". Archives of Foundry Engineering. 17 (3): 91–96. doi:10.1515/afe-2017-0097. ISSN 2299-2944.
"Soldering Electrical Joints". Nature (به انگلیسی). 150 (3804): 371–371. 1942-09-01. doi:10.1038/150371b0. ISSN 1476-4687.
Colbus, Jakob; Zimmermann, Karl Friedrich (1974-06-01). "Properties of gold-nickel alloy brazed joints in high temperature materials". Gold Bulletin (به انگلیسی). 7 (2): 42–49. doi:10.1007/BF03215037. ISSN 2190-7579.
Koleňák, Roman; Prach, Michal (2014-02). "Research of Joining Graphite by Use of Active Solder". Advanced Materials Research. 875–877: 1270–1274. doi:10.4028/www.scientific.net/AMR.875-877.1270. ISSN 1662-8985. {{cite journal}}: Check date values in: |date= (help)
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