Metal líquido (Portuguese Wikipedia)

Analysis of information sources in references of the Wikipedia article "Metal líquido" in Portuguese language version.

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«Liquid Metal Direct Write and 3D Printing: A Review». Advanced Materials Technologies. 5 (9). 2020. p. 2000070. ISSN 2365-709X. doi:10.1002/admt.202000070
«Exclusively Relativistic: Periodic Trends in the Melting and Boiling Points of Group 12». Angewandte Chemie. 60 (14). 11 de fevereiro de 2021. pp. 7703–7709. doi:10.1002/anie.202100486
«Gallium: The liquid metal that could transform soft electronics». Knowable Magazine. 3 de maio de 2022. doi:10.1146/knowable-050322-2
«Gallium Liquid Metal: The Devil's Elixir». Annual Review of Materials Research. 51 (1). 26 de julho de 2021. pp. 381–408. ISSN 1531-7331. doi:10.1146/annurev-matsci-080819-125403
Kunquan, Ma; Jing, Liu (Outubro de 2007). «Liquid metal management of computer chips». Frontiers of Energy and Power Engineering in China. 1 (4): 384–402. ISSN 1673-7504. doi:10.1007/s11708-007-0057-3
Miner, A.; Ghoshal, U. (19 de julho de 2004). «Cooling of high-power-density microdevices using liquid metal coolants». Applied Physics Letters. 85 (3). pp. 506–508. Bibcode:2004ApPhL..85..506M. ISSN 0003-6951. doi:10.1063/1.1772862

Miner, A.; Ghoshal, U. (19 de julho de 2004). «Cooling of high-power-density microdevices using liquid metal coolants». Applied Physics Letters. 85 (3). pp. 506–508. Bibcode:2004ApPhL..85..506M. ISSN 0003-6951. doi:10.1063/1.1772862

«Liquid Metal Direct Write and 3D Printing: A Review». Advanced Materials Technologies. 5 (9). 2020. p. 2000070. ISSN 2365-709X. doi:10.1002/admt.202000070
«Gallium Liquid Metal: The Devil's Elixir». Annual Review of Materials Research. 51 (1). 26 de julho de 2021. pp. 381–408. ISSN 1531-7331. doi:10.1146/annurev-matsci-080819-125403
Kunquan, Ma; Jing, Liu (Outubro de 2007). «Liquid metal management of computer chips». Frontiers of Energy and Power Engineering in China. 1 (4): 384–402. ISSN 1673-7504. doi:10.1007/s11708-007-0057-3
Miner, A.; Ghoshal, U. (19 de julho de 2004). «Cooling of high-power-density microdevices using liquid metal coolants». Applied Physics Letters. 85 (3). pp. 506–508. Bibcode:2004ApPhL..85..506M. ISSN 0003-6951. doi:10.1063/1.1772862