打線接合 (Chinese Wikipedia)

Analysis of information sources in references of the Wikipedia article "打線接合" in Chinese language version.

refsWebsite

Global rank Chinese rank

5web.archive.org

1^st place

4doi.org

2^nd place

23^rd place

2elsevier.com

610^th place

388^th place

1moea.gov.tw

low place

2,584^th place

1skhynix.com.cn

low place

1henkel-adhesives.com

low place

1scitation.org

4,352^nd place

3,443^rd place

1ieee.org

652^nd place

712^th place

1worldcat.org

5^th place

12^th place

doi.org (Global: 2^nd place; Chinese: 23^rd place)

O. L. Anderson, H. Christensen, P. Andreatch. Technique for Connecting Electrical Leads to Semiconductors. Journal of Applied Physics: 923–923. [2018-04-02]. doi:10.1063/1.1722893. （原始内容存档于2019-11-30）.
B. Langenecker. Effects of Ultrasound on Deformation Characteristics of Metals. IEEE Transactions on Sonics and Ultrasonics. March 1966, 13 (1): 1–8 [2018-04-02]. ISSN 0018-9537. doi:10.1109/t-su.1966.29367. （原始内容存档于2019-11-30）.
Hao-Wen Hsueh, Fei-Yi Hung, Truan-Sheng Lui, Li-Hui Chen. Microstructure, electric flame-off characteristics and tensile properties of silver bonding wires. Microelectronics Reliability: 2243–2249. [2018-04-02]. doi:10.1016/j.microrel.2011.07.062. （原始内容存档于2019-11-30）.
C.D. Breach, F. Wulff. New observations on intermetallic compound formation in gold ball bonds: general growth patterns and identification of two forms of Au4Al. Microelectronics Reliability: 973–981. [2018-04-02]. doi:10.1016/j.microrel.2004.02.013. （原始内容存档于2019-11-30）.

elsevier.com (Global: 610^th place; Chinese: 388^th place)

linkinghub.elsevier.com

Hao-Wen Hsueh, Fei-Yi Hung, Truan-Sheng Lui, Li-Hui Chen. Microstructure, electric flame-off characteristics and tensile properties of silver bonding wires. Microelectronics Reliability: 2243–2249. [2018-04-02]. doi:10.1016/j.microrel.2011.07.062. （原始内容存档于2019-11-30）.
C.D. Breach, F. Wulff. New observations on intermetallic compound formation in gold ball bonds: general growth patterns and identification of two forms of Au4Al. Microelectronics Reliability: 973–981. [2018-04-02]. doi:10.1016/j.microrel.2004.02.013. （原始内容存档于2019-11-30）.

henkel-adhesives.com (Global: low place; Chinese: low place)

Henkel Taiwan. 引线键合半导体封装. Henkel Taiwan. 台灣漢高股份有限公司. [2023-03-10]. （原始内容存档于2023-03-10）.

ieee.org (Global: 652^nd place; Chinese: 712^th place)

ieeexplore.ieee.org

B. Langenecker. Effects of Ultrasound on Deformation Characteristics of Metals. IEEE Transactions on Sonics and Ultrasonics. March 1966, 13 (1): 1–8 [2018-04-02]. ISSN 0018-9537. doi:10.1109/t-su.1966.29367. （原始内容存档于2019-11-30）.

moea.gov.tw (Global: low place; Chinese: 2,584^th place)

科技新知. 經濟部產業技術司. 2020-04-07 [2024-12-25]. 半導體封裝內部接合方式，可分為打線接合(wire bonding)、捲帶式自動接合與覆晶接合

scitation.org (Global: 4,352^nd place; Chinese: 3,443^rd place)

aip.scitation.org

O. L. Anderson, H. Christensen, P. Andreatch. Technique for Connecting Electrical Leads to Semiconductors. Journal of Applied Physics: 923–923. [2018-04-02]. doi:10.1063/1.1722893. （原始内容存档于2019-11-30）.

skhynix.com.cn (Global: low place; Chinese: low place)

news.skhynix.com.cn

user. 引线键合(Wire Bonding)——将芯片装配到PCB上的方法 | SK hynix Newsroom. 2021-03-11 [2025-07-27] （中文（简体））.

web.archive.org (Global: 1^st place; Chinese: 1^st place)

Henkel Taiwan. 引线键合半导体封装. Henkel Taiwan. 台灣漢高股份有限公司. [2023-03-10]. （原始内容存档于2023-03-10）.
O. L. Anderson, H. Christensen, P. Andreatch. Technique for Connecting Electrical Leads to Semiconductors. Journal of Applied Physics: 923–923. [2018-04-02]. doi:10.1063/1.1722893. （原始内容存档于2019-11-30）.
B. Langenecker. Effects of Ultrasound on Deformation Characteristics of Metals. IEEE Transactions on Sonics and Ultrasonics. March 1966, 13 (1): 1–8 [2018-04-02]. ISSN 0018-9537. doi:10.1109/t-su.1966.29367. （原始内容存档于2019-11-30）.
Hao-Wen Hsueh, Fei-Yi Hung, Truan-Sheng Lui, Li-Hui Chen. Microstructure, electric flame-off characteristics and tensile properties of silver bonding wires. Microelectronics Reliability: 2243–2249. [2018-04-02]. doi:10.1016/j.microrel.2011.07.062. （原始内容存档于2019-11-30）.
C.D. Breach, F. Wulff. New observations on intermetallic compound formation in gold ball bonds: general growth patterns and identification of two forms of Au4Al. Microelectronics Reliability: 973–981. [2018-04-02]. doi:10.1016/j.microrel.2004.02.013. （原始内容存档于2019-11-30）.

worldcat.org (Global: 5^th place; Chinese: 12^th place)

B. Langenecker. Effects of Ultrasound on Deformation Characteristics of Metals. IEEE Transactions on Sonics and Ultrasonics. March 1966, 13 (1): 1–8 [2018-04-02]. ISSN 0018-9537. doi:10.1109/t-su.1966.29367. （原始内容存档于2019-11-30）.

打線接合 (Chinese Wikipedia)

doi.org (Global: 2nd place; Chinese: 23rd place)

elsevier.com (Global: 610th place; Chinese: 388th place)

linkinghub.elsevier.com

henkel-adhesives.com (Global: low place; Chinese: low place)

ieee.org (Global: 652nd place; Chinese: 712th place)

ieeexplore.ieee.org

moea.gov.tw (Global: low place; Chinese: 2,584th place)

scitation.org (Global: 4,352nd place; Chinese: 3,443rd place)

aip.scitation.org

skhynix.com.cn (Global: low place; Chinese: low place)

news.skhynix.com.cn

web.archive.org (Global: 1st place; Chinese: 1st place)

worldcat.org (Global: 5th place; Chinese: 12th place)

doi.org (Global: 2^nd place; Chinese: 23^rd place)

elsevier.com (Global: 610^th place; Chinese: 388^th place)

ieee.org (Global: 652^nd place; Chinese: 712^th place)

moea.gov.tw (Global: low place; Chinese: 2,584^th place)

scitation.org (Global: 4,352^nd place; Chinese: 3,443^rd place)

web.archive.org (Global: 1^st place; Chinese: 1^st place)

worldcat.org (Global: 5^th place; Chinese: 12^th place)