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Williams, R. K.; Darwish, M. N.; Blanchard, R. A.; Siemieniec, R.; Rutter, P.; Kawaguchi, Y. The Trench Power MOSFET—Part II: Application Specific VDMOS, LDMOS, Packaging, Reliability. IEEE Transactions on Electron Devices. 2017, 64 (3): 692–712. Bibcode:2017ITED...64..692W. ISSN 0018-9383. doi:10.1109/TED.2017.2655149.
Williams, R. K.; Darwish, M. N.; Blanchard, R. A.; Siemieniec, R.; Rutter, P.; Kawaguchi, Y. The Trench Power MOSFET—Part II: Application Specific VDMOS, LDMOS, Packaging, Reliability. IEEE Transactions on Electron Devices. 2017, 64 (3): 692–712. Bibcode:2017ITED...64..692W. ISSN 0018-9383. doi:10.1109/TED.2017.2655149.
Williams, R. K.; Darwish, M. N.; Blanchard, R. A.; Siemieniec, R.; Rutter, P.; Kawaguchi, Y. The Trench Power MOSFET—Part II: Application Specific VDMOS, LDMOS, Packaging, Reliability. IEEE Transactions on Electron Devices. 2017, 64 (3): 692–712. Bibcode:2017ITED...64..692W. ISSN 0018-9383. doi:10.1109/TED.2017.2655149.