半导体器件制造 (Chinese Wikipedia)
Analysis of information sources in references of the Wikipedia article "半导体器件制造" in Chinese language version.
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56lem.com
chinawaterrisk.org
- 8 Things You Should Know About Water & Semiconductors. China Water Risk. 11 July 2013 [2023-01-21] （美国英语）.
doi.org
doi.org
- Lei, Wei-Sheng; Kumar, Ajay; Yalamanchili, Rao. Die singulation technologies for advanced packaging: A critical review. Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena. 2012-04-06, 30 (4). ISSN 2166-2746. doi:10.1116/1.3700230.
dx.doi.org
- Lei, Wei-Sheng; Kumar, Ajay; Yalamanchili, Rao. Die singulation technologies for advanced packaging: A critical review. Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena. 2012-04-06, 30 (4). ISSN 2166-2746. doi:10.1116/1.3700230.
forbes.com
- The World’s Biggest Public Companies. Forbes. [2016年6月2日] （英语）.
hitachi.com
- Kure, Tokuo; Hanaoka, Hideo; Sugiura, Takumi; Nakagawa, Shinya. Clean-room Technologies for the Mini-environment Age (PDF). Hitachi Review. 2007, 56 (3): 70–74 [2021-11-01]. CiteSeerX 10.1.1.493.1460
. S2CID 30883737. （原始内容存档 (PDF)于2021-11-01）.
ieee.org
ieeexplore.ieee.org
- Advanced FOUP purge using diffusers for FOUP door-off application | IEEE Conference Publication | IEEE Xplore. ieeexplore.ieee.org.
- 450mm FOUP/LPU system in advanced semiconductor manufacturing processes: A study on the minimization of oxygen content inside FOUP when the door is opened | IEEE Conference Publication | IEEE Xplore. ieeexplore.ieee.org.
- Moisture Prevention in a Pre-Purged Front-Opening Unified Pod (FOUP) During Door Opening in a Mini-Environment | IEEE Journals & Magazine | IEEE Xplore. ieeexplore.ieee.org.
- A Numerical Study on the Effects of Purge and Air Curtain Flow Rates on Humidity Invasion Into a Front Opening Unified Pod (FOUP) | IEEE Journals & Magazine | IEEE Xplore. ieeexplore.ieee.org.
- Performance of Different Front-Opening Unified Pod (FOUP) Moisture Removal Techniques With Local Exhaust Ventilation System | IEEE Journals & Magazine | IEEE Xplore. ieeexplore.ieee.org.
psu.edu
citeseerx.ist.psu.edu
- Kure, Tokuo; Hanaoka, Hideo; Sugiura, Takumi; Nakagawa, Shinya. Clean-room Technologies for the Mini-environment Age (PDF). Hitachi Review. 2007, 56 (3): 70–74 [2021-11-01]. CiteSeerX 10.1.1.493.1460 . S2CID 30883737. （原始内容存档 (PDF)于2021-11-01）.
semanticscholar.org
api.semanticscholar.org
- Kure, Tokuo; Hanaoka, Hideo; Sugiura, Takumi; Nakagawa, Shinya. Clean-room Technologies for the Mini-environment Age (PDF). Hitachi Review. 2007, 56 (3): 70–74 [2021-11-01]. CiteSeerX 10.1.1.493.1460 . S2CID 30883737. （原始内容存档 (PDF)于2021-11-01）.
trendforce.com.tw
- 2015年全球智慧型手機出貨12.93億支，華為躍升全球第三並突破一億支大關. [2016-01-14]. （原始内容存档于2022-12-03）.
web.archive.org
- Kure, Tokuo; Hanaoka, Hideo; Sugiura, Takumi; Nakagawa, Shinya. Clean-room Technologies for the Mini-environment Age (PDF). Hitachi Review. 2007, 56 (3): 70–74 [2021-11-01]. CiteSeerX 10.1.1.493.1460 . S2CID 30883737. （原始内容存档 (PDF)于2021-11-01）.
- Barnes报告 （页面存档备份，存于互联网档案馆）“2006美国工业和市场展望”
- 2015年全球智慧型手機出貨12.93億支，華為躍升全球第三並突破一億支大關. [2016-01-14]. （原始内容存档于2022-12-03）.
- IDC：全球十大PC厂商将有两家退出市场. 2015年11月07日
worldcat.org
- Lei, Wei-Sheng; Kumar, Ajay; Yalamanchili, Rao. Die singulation technologies for advanced packaging: A critical review. Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena. 2012-04-06, 30 (4). ISSN 2166-2746. doi:10.1116/1.3700230.