印制电路板 (Chinese Wikipedia)

Analysis of information sources in references of the Wikipedia article "印制电路板" in Chinese language version.

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doi.org

dx.doi.org

Li, Peng; Yu, Junyi; Luo, Suibin; Lai, Zhiqiang; Xiao, Bin; Yu, Shuhui; Sun, Rong. Cu deposition technologies for build-up film substrates towards FC-BGA. SCIENTIA SINICA Chimica. 2023-10-01, 53 (10). ISSN 1674-7224. doi:10.1360/SSC-2023-0130 （英语）.

jpo.go.jp

《4.2 積層体の構造の概要》－[[日本專利局]]（特許庁） (PDF). [2008-06-15]. （原始内容 (PDF)存档于2011-03-23）.

scichina.com

engine.scichina.com

Li, Peng; Yu, Junyi; Luo, Suibin; Lai, Zhiqiang; Xiao, Bin; Yu, Shuhui; Sun, Rong. Cu deposition technologies for build-up film substrates towards FC-BGA. SCIENTIA SINICA Chimica. 2023-10-01, 53 (10). ISSN 1674-7224. doi:10.1360/SSC-2023-0130 （英语）.

web.archive.org

《4.2 積層体の構造の概要》－[[日本專利局]]（特許庁） (PDF). [2008-06-15]. （原始内容 (PDF)存档于2011-03-23）.

worldcat.org

Li, Peng; Yu, Junyi; Luo, Suibin; Lai, Zhiqiang; Xiao, Bin; Yu, Shuhui; Sun, Rong. Cu deposition technologies for build-up film substrates towards FC-BGA. SCIENTIA SINICA Chimica. 2023-10-01, 53 (10). ISSN 1674-7224. doi:10.1360/SSC-2023-0130 （英语）.