打線接合 (Chinese Wikipedia)

Analysis of information sources in references of the Wikipedia article "打線接合" in Chinese language version.

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O. L. Anderson, H. Christensen, P. Andreatch. Technique for Connecting Electrical Leads to Semiconductors. Journal of Applied Physics: 923–923. [2018-04-02]. doi:10.1063/1.1722893. （原始内容存档于2019-11-30）.
B. Langenecker. Effects of Ultrasound on Deformation Characteristics of Metals. IEEE Transactions on Sonics and Ultrasonics. March 1966, 13 (1): 1–8 [2018-04-02]. ISSN 0018-9537. doi:10.1109/t-su.1966.29367. （原始内容存档于2019-11-30）.
C.D. Breach, F. Wulff. New observations on intermetallic compound formation in gold ball bonds: general growth patterns and identification of two forms of Au4Al. Microelectronics Reliability: 973–981. [2018-04-02]. doi:10.1016/j.microrel.2004.02.013. （原始内容存档于2019-11-30）.
Hao-Wen Hsueh, Fei-Yi Hung, Truan-Sheng Lui, Li-Hui Chen. Microstructure, electric flame-off characteristics and tensile properties of silver bonding wires. Microelectronics Reliability: 2243–2249. [2018-04-02]. doi:10.1016/j.microrel.2011.07.062. （原始内容存档于2019-11-30）.

Henkel Taiwan. 引线键合半导体封装. Henkel Taiwan. 台灣漢高股份有限公司. [2023-03-10]. （原始内容存档于2023-03-10）.

B. Langenecker. Effects of Ultrasound on Deformation Characteristics of Metals. IEEE Transactions on Sonics and Ultrasonics. March 1966, 13 (1): 1–8 [2018-04-02]. ISSN 0018-9537. doi:10.1109/t-su.1966.29367. （原始内容存档于2019-11-30）.

科技新知. 經濟部產業技術司. 2020-04-07 [2024-12-25]. 半導體封裝內部接合方式，可分為打線接合(wire bonding)、捲帶式自動接合與覆晶接合

O. L. Anderson, H. Christensen, P. Andreatch. Technique for Connecting Electrical Leads to Semiconductors. Journal of Applied Physics: 923–923. [2018-04-02]. doi:10.1063/1.1722893. （原始内容存档于2019-11-30）.

Henkel Taiwan. 引线键合半导体封装. Henkel Taiwan. 台灣漢高股份有限公司. [2023-03-10]. （原始内容存档于2023-03-10）.
O. L. Anderson, H. Christensen, P. Andreatch. Technique for Connecting Electrical Leads to Semiconductors. Journal of Applied Physics: 923–923. [2018-04-02]. doi:10.1063/1.1722893. （原始内容存档于2019-11-30）.
B. Langenecker. Effects of Ultrasound on Deformation Characteristics of Metals. IEEE Transactions on Sonics and Ultrasonics. March 1966, 13 (1): 1–8 [2018-04-02]. ISSN 0018-9537. doi:10.1109/t-su.1966.29367. （原始内容存档于2019-11-30）.
C.D. Breach, F. Wulff. New observations on intermetallic compound formation in gold ball bonds: general growth patterns and identification of two forms of Au4Al. Microelectronics Reliability: 973–981. [2018-04-02]. doi:10.1016/j.microrel.2004.02.013. （原始内容存档于2019-11-30）.
Hao-Wen Hsueh, Fei-Yi Hung, Truan-Sheng Lui, Li-Hui Chen. Microstructure, electric flame-off characteristics and tensile properties of silver bonding wires. Microelectronics Reliability: 2243–2249. [2018-04-02]. doi:10.1016/j.microrel.2011.07.062. （原始内容存档于2019-11-30）.

B. Langenecker. Effects of Ultrasound on Deformation Characteristics of Metals. IEEE Transactions on Sonics and Ultrasonics. March 1966, 13 (1): 1–8 [2018-04-02]. ISSN 0018-9537. doi:10.1109/t-su.1966.29367. （原始内容存档于2019-11-30）.