球柵陣列封裝 (Chinese Wikipedia)

Analysis of information sources in references of the Wikipedia article "球柵陣列封裝" in Chinese language version.

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9web.archive.org

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archive.today

Solid State Technology: BGA underfills - Increasing board-level solder joint reliability, 12/01/2001. [2014-03-18]. （原始内容存档于2013-07-19）.

bit-tech.net

Ryan J. Leng. "The Secrets of PC Memory: Part 2" （页面存档备份，存于互联网档案馆）. 2007.

economist.com

More than just digital quilting: The "maker" movement could change how science is taught and boost innovation. It may even herald a new industrial revolution. The Economist. Dec 3, 2011 [2014-03-18]. （原始内容存档于2018-05-14）.

electroiq.com

Solid State Technology: BGA underfills - Increasing board-level solder joint reliability, 12/01/2001. [2014-03-18]. （原始内容存档于2013-07-19）.

indium.com

Soldering 101 - A Basic Overview. [2014-03-18]. （原始内容存档于2012-03-03）.

jgarantmc.com

"CT Services - Overview." Jesse Garant & Associates. August 17, 2010. 存档副本. [2010-11-24]. （原始内容存档于2010-09-23）.

nasa.gov

teerm.nasa.gov

存档副本. [2014-03-21]. （原始内容存档于2014-10-08）.

researchmfg.com

BGA枕頭效應(head-in-pillow)發生的可能原因. 工作熊. [2014-03-18]. （原始内容存档于2021-01-24）.

seekdatasheet.com

pdf.seekdatasheet.com

Intel. "Mobile Intel Celeron Processor (0.13 μ) in Micro-FCBGA and Micro-FCPGA Packages". Datasheet （页面存档备份，存于互联网档案馆）. 2002.

sparkfun.com

Sparkfun tutorials: Reflow skillet, July 2006. [2014-03-18]. （原始内容存档于2021-03-14）.

web.archive.org

Soldering 101 - A Basic Overview. [2014-03-18]. （原始内容存档于2012-03-03）.
BGA枕頭效應(head-in-pillow)發生的可能原因. 工作熊. [2014-03-18]. （原始内容存档于2021-01-24）.
存档副本. [2014-03-21]. （原始内容存档于2014-10-08）.
"CT Services - Overview." Jesse Garant & Associates. August 17, 2010. 存档副本. [2010-11-24]. （原始内容存档于2010-09-23）.
Sparkfun tutorials: Reflow skillet, July 2006. [2014-03-18]. （原始内容存档于2021-03-14）.
Ryan J. Leng. "The Secrets of PC Memory: Part 2" （页面存档备份，存于互联网档案馆）. 2007.
Intel. "Mobile Intel Celeron Processor (0.13 μ) in Micro-FCBGA and Micro-FCPGA Packages". Datasheet （页面存档备份，存于互联网档案馆）. 2002.
FCBGA-479 (Micro-FCBGA). [2014-03-18]. （原始内容存档于2021-02-28）.
More than just digital quilting: The "maker" movement could change how science is taught and boost innovation. It may even herald a new industrial revolution. The Economist. Dec 3, 2011 [2014-03-18]. （原始内容存档于2018-05-14）.

x86-guide.com

FCBGA-479 (Micro-FCBGA). [2014-03-18]. （原始内容存档于2021-02-28）.