电子封装 (Chinese Wikipedia)

Analysis of information sources in references of the Wikipedia article "电子封装" in Chinese language version.

refsWebsite

Global rank Chinese rank

3web.archive.org

1^st place

1^st place

1designworldonline.com

low place

low place

low place

low place

1books.google.com

3^rd place

8^th place

1sciencedirect.com

149^th place

292^nd place

books.google.com

Handbook on the Physics and Chemistry of Rare Earths: Including Actinides. Elsevier Science. 1 August 2016: 89. ISBN 978-0-444-63705-5.

designworldonline.com

Nandivada, Venkat. Enhance Electronic Performance with Epoxy Compounds. Design World. 2013-01-16 [2023-02-17]. （原始内容存档于2023-10-04）.

empf.org

Kelly, Joe. Improving Chip on Board Assembly. empf.com. December 2004. （原始内容存档于2006-09-23）.

sciencedirect.com

G. Wu et al. "Study on the shear strength degradation of ACA joints induced by different hygrothermal aging conditions " （页面存档备份，存于互联网档案馆）. Microelectronics Reliability. 2013.

web.archive.org

Nandivada, Venkat. Enhance Electronic Performance with Epoxy Compounds. Design World. 2013-01-16 [2023-02-17]. （原始内容存档于2023-10-04）.
Kelly, Joe. Improving Chip on Board Assembly. empf.com. December 2004. （原始内容存档于2006-09-23）.
G. Wu et al. "Study on the shear strength degradation of ACA joints induced by different hygrothermal aging conditions " （页面存档备份，存于互联网档案馆）. Microelectronics Reliability. 2013.