绗缝封装 (Chinese Wikipedia)

Analysis of information sources in references of the Wikipedia article "绗缝封装" in Chinese language version.

refsWebsite

Global rank Chinese rank

11doi.org

2^nd place

23^rd place

6worldcat.org

5^th place

12^th place

5semanticscholar.org

11^th place

332^nd place

4harvard.edu

18^th place

57^th place

3web.archive.org

1^st place

1nd.edu

2,387^th place

8,327^th place

1indianaic.com

low place

1ieee.org

652^nd place

712^th place

doi.org

Zheng, Quanling; Kopp, David; Khan, Mohammad Ashraf; Fay, Patrick; Kriman, Alfred M.; Bernstein, Gary H. Investigation of Quilt Packaging Interchip Interconnect With Solder Paste. IEEE Transactions on Components, Packaging and Manufacturing Technology. March 2014, 4 (3): 400–407. ISSN 2156-3950. S2CID 36676516. doi:10.1109/tcpmt.2014.2301738.
Ashraf Khan, M.; Zheng, Quanling; Kopp, David; Buckhanan, Wayne; Kulick, Jason M.; Fay, Patrick; Kriman, Alfred M.; Bernstein, Gary H. Thermal Cycling Study of Quilt Packaging. Journal of Electronic Packaging. 2015-06-01, 137 (2). ISSN 1043-7398. doi:10.1115/1.4029245.
Ahmed, Tahsin; Butler, Thomas; Khan, Aamir A.; Kulick, Jason M.; Bernstein, Gary H.; Hoffman, Anthony J.; Howard, Scott S. FDTD modeling of chip-to-chip waveguide coupling via optical quilt packaging. Optical System Alignment, Tolerancing, and Verification VII (SPIE). 2013-09-10, 8844: 88440C. Bibcode:2013SPIE.8844E..0CA. S2CID 120463545. doi:10.1117/12.2024088.
Sparkman, Kevin; LaVeigne, Joe; McHugh, Steve; Kulick, Jason; Lannon, John; Goodwin, Scott. Scalable emitter array development for infrared scene projector systems. Infrared Imaging Systems: Design, Analysis, Modeling, and Testing XXV (SPIE). 2014-05-29, 9071: 90711I. Bibcode:2014SPIE.9071E..1IS. S2CID 53508849. doi:10.1117/12.2054360.
Khan, M. Ashraf; Kulick, Jason M.; Kriman, Alfred M.; Bernstein, Gary H. Design and Robustness of Quilt Packaging Superconnect. International Symposium on Microelectronics. January 2012, 2012 (1): 000524–000530. ISSN 2380-4505. doi:10.4071/isom-2012-poster_khan.
Bernstein, G.H.; Qing Liu; Zhuowen Sun; Fay, P. Quilt Packaging: A New Paradigm for Interchip Communication 1. IEEE. 2005 [2024-01-26]. ISBN 978-0-7803-9578-7. doi:10.1109/EPTC.2005.1614357. （原始内容存档于2018-06-19）.
Ashraf Khan, M.; Zheng, Quanling; Kopp, David; Buckhanan, Wayne; Kulick, Jason M.; Fay, Patrick; Kriman, Alfred M.; Bernstein, Gary H. Thermal Cycling Study of Quilt Packaging. Journal of Electronic Packaging. 2015-06-01, 137 (2). ISSN 1043-7398. doi:10.1115/1.4029245.
Fay, Patrick; Bernstein, Gary H.; Lu, Tian; Kulick, Jason M. Ultra-wide Bandwidth Inter-Chip Interconnects for Heterogeneous Millimeter-Wave and THz Circuits. Journal of Infrared, Millimeter, and Terahertz Waves. 2016-04-29, 37 (9): 874–880. Bibcode:2016JIMTW..37..874F. ISSN 1866-6892. doi:10.1007/s10762-016-0278-5 .
Lu, Tian; Ortega, Carlos; Kulick, Jason; Bernstein, G. H.; Ardisson, Scott; Engelhardt, Rob. Rapid SoC prototyping utilizing quilt packaging technology for modular functional IC partitioning. New York, New York, USA: ACM Press. 2016: 79–85. ISBN 978-1-4503-4535-4. doi:10.1145/2990299.2990313.
Ahmed, Tahsin; Khan, Aamir A.; Vigil, Genevieve; Kulick, Jason M.; Bernstein, Gary H.; Hoffman, Anthony J.; Howard, Scott S. Optical Quilt Packaging: A New Chip-to-Chip Optical Coupling and Alignment Process for Modular Sensors. Cleo: 2014 (Washington, D.C.: OSA). 2014: JTu4A.56. ISBN 978-1-55752-999-2. S2CID 14432676. doi:10.1364/cleo_at.2014.jtu4a.56.
Ahmed, Tahsin; Lu, Tian; Butler, Thomas P.; Kulick, Jason M.; Bernstein, Gary H.; Hoffman, Anthony J.; Hall, Douglas C.; Howard, Scott S. Mid-Infrared Waveguide Array Inter-Chip Coupling Using Optical Quilt Packaging. IEEE Photonics Technology Letters. 2017-05-01, 29 (9): 755–758. Bibcode:2017IPTL...29..755A. ISSN 1041-1135. S2CID 7455544. doi:10.1109/lpt.2017.2684091.

harvard.edu

ui.adsabs.harvard.edu

Ahmed, Tahsin; Butler, Thomas; Khan, Aamir A.; Kulick, Jason M.; Bernstein, Gary H.; Hoffman, Anthony J.; Howard, Scott S. FDTD modeling of chip-to-chip waveguide coupling via optical quilt packaging. Optical System Alignment, Tolerancing, and Verification VII (SPIE). 2013-09-10, 8844: 88440C. Bibcode:2013SPIE.8844E..0CA. S2CID 120463545. doi:10.1117/12.2024088.
Sparkman, Kevin; LaVeigne, Joe; McHugh, Steve; Kulick, Jason; Lannon, John; Goodwin, Scott. Scalable emitter array development for infrared scene projector systems. Infrared Imaging Systems: Design, Analysis, Modeling, and Testing XXV (SPIE). 2014-05-29, 9071: 90711I. Bibcode:2014SPIE.9071E..1IS. S2CID 53508849. doi:10.1117/12.2054360.
Fay, Patrick; Bernstein, Gary H.; Lu, Tian; Kulick, Jason M. Ultra-wide Bandwidth Inter-Chip Interconnects for Heterogeneous Millimeter-Wave and THz Circuits. Journal of Infrared, Millimeter, and Terahertz Waves. 2016-04-29, 37 (9): 874–880. Bibcode:2016JIMTW..37..874F. ISSN 1866-6892. doi:10.1007/s10762-016-0278-5 .
Ahmed, Tahsin; Lu, Tian; Butler, Thomas P.; Kulick, Jason M.; Bernstein, Gary H.; Hoffman, Anthony J.; Hall, Douglas C.; Howard, Scott S. Mid-Infrared Waveguide Array Inter-Chip Coupling Using Optical Quilt Packaging. IEEE Photonics Technology Letters. 2017-05-01, 29 (9): 755–758. Bibcode:2017IPTL...29..755A. ISSN 1041-1135. S2CID 7455544. doi:10.1109/lpt.2017.2684091.

ieee.org

ieeexplore.ieee.org

Bernstein, G.H.; Qing Liu; Zhuowen Sun; Fay, P. Quilt Packaging: A New Paradigm for Interchip Communication 1. IEEE. 2005 [2024-01-26]. ISBN 978-0-7803-9578-7. doi:10.1109/EPTC.2005.1614357. （原始内容存档于2018-06-19）.

indianaic.com

Quilt Packaging Concept | Indiana Integrated Circuits. [2024-01-26]. （原始内容存档于2024-01-26）（美国英语）.

nd.edu

news.nd.edu

Gilroy, William G. Notre Dame researchers introduce “Quilt Packaging” to address interchip interconnect problem. Notre Dame News. 2006-10-09 [2024-01-26]. （原始内容存档于2024-01-26）（英语）.

semanticscholar.org

api.semanticscholar.org

Zheng, Quanling; Kopp, David; Khan, Mohammad Ashraf; Fay, Patrick; Kriman, Alfred M.; Bernstein, Gary H. Investigation of Quilt Packaging Interchip Interconnect With Solder Paste. IEEE Transactions on Components, Packaging and Manufacturing Technology. March 2014, 4 (3): 400–407. ISSN 2156-3950. S2CID 36676516. doi:10.1109/tcpmt.2014.2301738.
Ahmed, Tahsin; Butler, Thomas; Khan, Aamir A.; Kulick, Jason M.; Bernstein, Gary H.; Hoffman, Anthony J.; Howard, Scott S. FDTD modeling of chip-to-chip waveguide coupling via optical quilt packaging. Optical System Alignment, Tolerancing, and Verification VII (SPIE). 2013-09-10, 8844: 88440C. Bibcode:2013SPIE.8844E..0CA. S2CID 120463545. doi:10.1117/12.2024088.
Sparkman, Kevin; LaVeigne, Joe; McHugh, Steve; Kulick, Jason; Lannon, John; Goodwin, Scott. Scalable emitter array development for infrared scene projector systems. Infrared Imaging Systems: Design, Analysis, Modeling, and Testing XXV (SPIE). 2014-05-29, 9071: 90711I. Bibcode:2014SPIE.9071E..1IS. S2CID 53508849. doi:10.1117/12.2054360.
Ahmed, Tahsin; Khan, Aamir A.; Vigil, Genevieve; Kulick, Jason M.; Bernstein, Gary H.; Hoffman, Anthony J.; Howard, Scott S. Optical Quilt Packaging: A New Chip-to-Chip Optical Coupling and Alignment Process for Modular Sensors. Cleo: 2014 (Washington, D.C.: OSA). 2014: JTu4A.56. ISBN 978-1-55752-999-2. S2CID 14432676. doi:10.1364/cleo_at.2014.jtu4a.56.
Ahmed, Tahsin; Lu, Tian; Butler, Thomas P.; Kulick, Jason M.; Bernstein, Gary H.; Hoffman, Anthony J.; Hall, Douglas C.; Howard, Scott S. Mid-Infrared Waveguide Array Inter-Chip Coupling Using Optical Quilt Packaging. IEEE Photonics Technology Letters. 2017-05-01, 29 (9): 755–758. Bibcode:2017IPTL...29..755A. ISSN 1041-1135. S2CID 7455544. doi:10.1109/lpt.2017.2684091.

web.archive.org

Gilroy, William G. Notre Dame researchers introduce “Quilt Packaging” to address interchip interconnect problem. Notre Dame News. 2006-10-09 [2024-01-26]. （原始内容存档于2024-01-26）（英语）.
Quilt Packaging Concept | Indiana Integrated Circuits. [2024-01-26]. （原始内容存档于2024-01-26）（美国英语）.
Bernstein, G.H.; Qing Liu; Zhuowen Sun; Fay, P. Quilt Packaging: A New Paradigm for Interchip Communication 1. IEEE. 2005 [2024-01-26]. ISBN 978-0-7803-9578-7. doi:10.1109/EPTC.2005.1614357. （原始内容存档于2018-06-19）.

worldcat.org

Zheng, Quanling; Kopp, David; Khan, Mohammad Ashraf; Fay, Patrick; Kriman, Alfred M.; Bernstein, Gary H. Investigation of Quilt Packaging Interchip Interconnect With Solder Paste. IEEE Transactions on Components, Packaging and Manufacturing Technology. March 2014, 4 (3): 400–407. ISSN 2156-3950. S2CID 36676516. doi:10.1109/tcpmt.2014.2301738.
Ashraf Khan, M.; Zheng, Quanling; Kopp, David; Buckhanan, Wayne; Kulick, Jason M.; Fay, Patrick; Kriman, Alfred M.; Bernstein, Gary H. Thermal Cycling Study of Quilt Packaging. Journal of Electronic Packaging. 2015-06-01, 137 (2). ISSN 1043-7398. doi:10.1115/1.4029245.
Khan, M. Ashraf; Kulick, Jason M.; Kriman, Alfred M.; Bernstein, Gary H. Design and Robustness of Quilt Packaging Superconnect. International Symposium on Microelectronics. January 2012, 2012 (1): 000524–000530. ISSN 2380-4505. doi:10.4071/isom-2012-poster_khan.
Ashraf Khan, M.; Zheng, Quanling; Kopp, David; Buckhanan, Wayne; Kulick, Jason M.; Fay, Patrick; Kriman, Alfred M.; Bernstein, Gary H. Thermal Cycling Study of Quilt Packaging. Journal of Electronic Packaging. 2015-06-01, 137 (2). ISSN 1043-7398. doi:10.1115/1.4029245.
Fay, Patrick; Bernstein, Gary H.; Lu, Tian; Kulick, Jason M. Ultra-wide Bandwidth Inter-Chip Interconnects for Heterogeneous Millimeter-Wave and THz Circuits. Journal of Infrared, Millimeter, and Terahertz Waves. 2016-04-29, 37 (9): 874–880. Bibcode:2016JIMTW..37..874F. ISSN 1866-6892. doi:10.1007/s10762-016-0278-5 .
Ahmed, Tahsin; Lu, Tian; Butler, Thomas P.; Kulick, Jason M.; Bernstein, Gary H.; Hoffman, Anthony J.; Hall, Douglas C.; Howard, Scott S. Mid-Infrared Waveguide Array Inter-Chip Coupling Using Optical Quilt Packaging. IEEE Photonics Technology Letters. 2017-05-01, 29 (9): 755–758. Bibcode:2017IPTL...29..755A. ISSN 1041-1135. S2CID 7455544. doi:10.1109/lpt.2017.2684091.