覆晶技術 (Chinese Wikipedia)

Analysis of information sources in references of the Wikipedia article "覆晶技術" in Chinese language version.

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1web.archive.org

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archive.org

Aviation Week. Aviation Week 1963-09-23. http://archive.org/details/Aviation_Week_1963-09-23. 1963-09-23 （英语）. 缺少或|title=为空 (帮助)

doi.org

Li, Peng; Yu, Junyi; Luo, Suibin; Lai, Zhiqiang; Xiao, Bin; Yu, Shuhui; Sun, Rong. Cu deposition technologies for build-up film substrates towards FC-BGA. SCIENTIA SINICA Chimica. 2023-10-01, 53 (10). ISSN 1674-7224. doi:10.1360/SSC-2023-0130 （英语）.

flipchips.com

Introduction to Flip Chip: What, Why, How. [2011-10-02]. （原始内容存档于2011-11-22）.

scichina.com

engine.scichina.com

Li, Peng; Yu, Junyi; Luo, Suibin; Lai, Zhiqiang; Xiao, Bin; Yu, Shuhui; Sun, Rong. Cu deposition technologies for build-up film substrates towards FC-BGA. SCIENTIA SINICA Chimica. 2023-10-01, 53 (10). ISSN 1674-7224. doi:10.1360/SSC-2023-0130 （英语）.

web.archive.org

Introduction to Flip Chip: What, Why, How. [2011-10-02]. （原始内容存档于2011-11-22）.

worldcat.org

Li, Peng; Yu, Junyi; Luo, Suibin; Lai, Zhiqiang; Xiao, Bin; Yu, Shuhui; Sun, Rong. Cu deposition technologies for build-up film substrates towards FC-BGA. SCIENTIA SINICA Chimica. 2023-10-01, 53 (10). ISSN 1674-7224. doi:10.1360/SSC-2023-0130 （英语）.